Mobile wireless communications device with reduced interfering RF energy into RF metal shield secured on circuit board
View Patent ↗A mobile wireless communications device includes a housing and circuit board carried by the housing and having RF circuitry comprising at least one RF component and plurality of other components mounted on the circuit board. An RF metal shield is secured to the circuit board and surrounds and isolates the at least one RF component and plurality of other components within the RF metal shield. An RF absorber is positioned adjacent an area of the RF component that radiates energy to aid in reducing energy radiated from the RF component into the RF metal shield.
1. An electronic device comprising:
a circuit board;
RF circuitry carried by said circuit board and comprising at least one RF radiating integrated circuit (IC);
an RF shield mounted to said circuit board and comprising a top and a plurality of sides extending downwardly therefrom and around said RF circuitry, said top having an opening therein; and
an RF absorbing material over the opening in said top of said RF shield.
2. The electronic device according to claim 1 , wherein said RF absorbing material comprises a ferrite material.
3. The electronic device according to claim 1 , wherein said RF absorbing material comprises a planar sheet of RF absorbing material.
4. The electronic device according to claim 3 , further comprising an adhesive tape securing said planar sheet to said RF shield.
5. The electronic device according to claim 1 , wherein said opening comprises a longitudinal slot.
6. The electronic device according to claim 1 , wherein said at least one RF radiating IC comprises an RF transceiver IC.
7. The electronic device according to claim 1 , wherein said at least one RF radiating IC comprises at least one of an RE transmitter IC, an RF receiver IC, and a local oscillator IC.
8. The electronic device according to claim 1 , wherein said RF circuitry further comprises at least one other component within said RF shield.
9. The electronic device according to claim 1 , wherein said RF circuitry is operative for generating Global System for Mobile (GSM) communications packet bursts.
10. An electronic device comprising:
a circuit board;
RF circuitry carried by said circuit board and comprising at least one RF radiating integrated circuit (IC); and
an RF shield carried by said circuit board and comprising a top and a plurality of sides extending downwardly therefrom and around said RF circuitry, said top having an RF absorber defined by a longitudinal slot therein and positioned over the at least one RF radiating integrated circuit.
11. The electronic device according to claim 10 , wherein said at least one RF radiating IC comprises an RF transceiver IC.
12. The electronic device according to claim 10 , wherein said at least one RF radiating IC comprises at least one of an RF transmitter IC, an RF receiver IC, and a local oscillator IC.
13. The electronic device according to claim 10 , wherein said RF circuitry further comprises at least one other component within said RF shield.
14. The electronic device according to claim 10 , wherein said RF circuitry is operative for generating Global System for Mobile (GSM) communications packet bursts.
15. A method for making an electronic device comprising:
mounting an RF shield on a circuit board and comprising a top and a plurality of sides extending downwardly therefrom and around RF circuitry, the RF circuitry comprising at least one RF radiating integrated circuit (IC), the top of the RF shield having an opening therein; and
positioning an RF absorbing material over the opening in the top of the RF shield.
16. The method according to claim 15 , wherein the RF absorbing material comprises a ferrite material.
17. The method according to claim 15 , wherein the RF absorbing material comprises a planar sheet of RF absorbing material.
18. The method according to claim 17 , wherein positioning the RF absorbing materials comprises using an adhesive tape to secure the planar sheet to the RF shield.
19. The method according to claim 15 , wherein the opening comprises a longitudinal slot.
20. The method according to claim 15 , wherein the at least one RF radiating IC comprises an RF transceiver IC.
21. The method according to claim 15 , wherein the at least one RF radiating IC comprises at least one of an RF transmitter IC, an RF receiver IC, and a local oscillator IC.
22. The method according to claim 15 , wherein the RF circuitry further comprises at least one other component within the RF shield.
23. The method according to claim 15 , wherein the RF circuitry is operative for generating Global System for Mobile (GSM) communications packet bursts.
24. A method for making an electronic device comprising:
mounting an RF shield on a circuit board and comprising a top and a plurality of sides extending downwardly therefrom and around RF circuitry, the RF circuitry comprising at least one RF radiating integrated circuit (IC), the top of the RF shield having an RF absorber defined by a longitudinal slot therein and positioned over the at least one RF integrated circuit.
25. The method according to claim 24 , wherein the at least one RF radiating IC comprises an RF transceiver IC.
26. The method according to claim 24 , wherein the at least one RF radiating IC comprises at least one of an RF transmitter IC, an RF receiver IC, and a local oscillator IC.
27. The method according to claim 24 , wherein the RF circuitry further comprises at least one other component within the RF shield.
28. The method according to claim 24 , wherein the RF circuitry is operative for generating Global System for Mobile (GSM) communications packet bursts.