IP Library Granted Patent US 8,199,017
Granted Patent B2
US 8,199,017 · App. 13/092,256 · Granted Jun 12, 2012

RFID integrated circuit with integrated antenna structure

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Quick Facts
Patent No.
US 8,199,017
App. No.
13/092,256
Granted
Jun 12, 2012
Kind
B2
Abstract

An integrated circuit for use in an RFID tag includes an integrated circuit die having a circuit, a radio frequency identification (RFID) interface for providing communication between the circuit and a remote RFID reader via RF signaling between the RFID interface and the remote RFID reader. An antenna section facilitates the RF signaling between the RFID and the remote RFID reader. A substrate is coupled to support the first integrated circuit die and at least a portion of the antenna section.

Claims (36)

1. An integrated circuit for use in an RFID tag, the integrated circuit comprising:

an integrated circuit die including:

a circuit that generates first data; and

a radio frequency identification (RFID) interface, coupled to the circuit, for providing communication between the circuit and a remote RFID reader via RF signaling between the RFID interface and the remote RFID reader, wherein the RF signaling between the RFID interface and the remote RFID reader includes millimeter wave RF signals that carry the first data in a V-band range of frequencies;

an antenna section, coupled to the integrated circuit die, for facilitating the RF signaling between the RFID interface and the remote RFID reader, wherein the antenna section includes at least one bonding wire that connects the integrated circuit die to couplers for electrically connecting the integrated circuit to at least one external device and further operates as at least a portion of the antenna section;

a substrate coupled to support the first integrated circuit die and at least a portion of the antenna section.

2. The integrated circuit of claim 1 wherein the RF signaling between the RFID interface and the remote RFID reader includes reception of a millimeter wave RFID signal from the remote RFID reader and backscattering of the millimeter wave RFID signal by the RFID interface.

3. The integrated circuit of claim 1 wherein the at least one bonding wire includes:

a first bonding wire that couples first signals between the circuit and the substrate; and

a second bonding wire that couples second signals between the circuit and the substrate.

4. The integrated circuit of claim 1 wherein the at least one bonding wire further provides impedance matching to the RFID interface and the antenna section.

5. The integrated circuit of claim 1 wherein the at least one bonding wire further provides a transmission line.

6. The integrated circuit of claim 1 wherein the antenna section includes at least one power supply line for coupling power to the integrated circuit from a direct current power source and that further operates as at least a portion of an antenna.

7. The integrated circuit of claim 6 wherein the at least one power supply line includes:

a first power supply line for coupling a power signal to the circuit; and

a second power supply line for coupling the power signal to the circuit.

8. The integrated circuit of claim 7 wherein the at least one power supply line further provides impedance matching to the RFID interface and the antenna section.

9. The integrated circuit of claim 7 wherein the at least one power supply line further provides a transmission line.

10. An integrated circuit for use in an RFID tag, the integrated circuit comprising:

an integrated circuit die including:

a circuit; and

a radio frequency identification (RFID) interface, coupled to the circuit, for providing communication between the circuit and a remote RFID reader via RF signaling between the RFID interface and the remote RFID reader in a millimeter wave band of frequencies;

an antenna section, coupled to the integrated circuit die, for facilitating the RF signaling between the RFID interface and the remote RFID reader, wherein the antenna section includes at least one bonding wire that connects the integrated circuit die to couplers for electrically connecting the integrated circuit to at least one external device and further operates as at least a portion of the antenna section;

a substrate coupled to support the first integrated circuit die and at least a portion of the antenna section.

11. The integrated circuit of claim 10 wherein the RF signaling between the RFID interface and the remote RFID reader includes reception of a millimeter wave RFID signal from the remote RFID reader and the backscattering of the millimeter wave RFID signal by the RFID interface.

12. The integrated circuit of claim 10 wherein the at least one bonding wire includes:

a first bonding wire that couples first signals between the circuit and the substrate; and

a second bonding wire that couples second signals between the circuit and the substrate.

13. The integrated circuit of claim 12 wherein the at least one bonding wire further provides impedance matching to the RFID interface and the antenna section.

14. The integrated circuit of claim 12 wherein the at least one bonding wire further provides a transmission line.

15. The integrated circuit of claim 10 wherein the antenna section includes at least one power supply line for coupling power to the integrated circuit from a direct current power source and that further operates as at least a portion of an antenna.

16. The integrated circuit of claim 15 wherein the at least one power supply line includes:

a first power supply line for coupling a power signal to the circuit; and

a second power supply line for coupling the power signal to the circuit.

17. The integrated circuit of claim 16 wherein the at least one power supply line further provides impedance matching to the RFID interface and the antenna section.

18. The integrated circuit of claim 16 wherein the at least one power supply line further provides a transmission line.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2017
From: ROFOUGARAN, AHMADREZA (REZA)
To: BROADCOM CORPORATION
Reel/Frame 043915/0058 →
MERGER AND CHANGE OF NAME Recorded May 22, 2017
From: FREESCALE SEMICONDUCTOR, INC.; NXP USA, INC.
To: NXP USA, INC.
Reel/Frame 042525/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ADD OMITTED PAGE 6 OF 22 TO THE ASSIGNMENT AGREEMENT PREVIOUSLY RECORDED AT REEL: 040569 FRAME: 0572. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 28, 2017
From: BROADCOM CORPORATION
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 042108/0597 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 5, 2016
From: BROADCOM CORPORATION
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040569/0572 →
RELEASE OF SECURITY INTEREST Recorded Sep 30, 2016
From: BANK OF AMERICA N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 040192/0701 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →