IP Library Granted Patent US 8,233,321
Granted Patent B2
US 8,233,321 · App. 13/197,264 · Granted Jul 31, 2012

Semiconductor memory device and method for driving semiconductor memory device

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Quick Facts
Patent No.
US 8,233,321
App. No.
13/197,264
Granted
Jul 31, 2012
Kind
B2
Abstract

A semiconductor memory device includes a plurality of memory cell transistors arranged in a matrix; a plurality of word lines commonly coupling the control gates of the plural memory cell transistors present in a identical first direction; a plurality of source lines commonly coupling the sources of the plural memory cell transistors present in the identical first direction; a plurality of bit lines commonly coupling the drains of the plural memory cell transistors present in a identical second direction intersecting the first direction; a first transistor having a drain coupled to the source line; a second transistor having a drain coupled to a source of the first transistor, a gate coupled to the word line and a source grounded; and a control line commonly coupling the gates of the plural first transistors.

Claims (65)

1. A semiconductor memory device comprising:

a plurality of memory cell transistors arranged in a matrix;

a plurality of bit lines coupled to a bit line drive circuit controlling a first potential of the plurality of bit lines, the plurality of bit lines include:

(i) a bit line coupling to drains of a first set of the plurality of memory cell transistors arranged in a first column and (ii) a second bit line coupling to drains of a second set of the plurality of memory cell transistors arranged in a second column;

a plurality of word lines coupled to a word line driver circuit controlling a second potential of the plurality of word lines, the plurality of word lines include:

(i) a first word line coupling to gate electrodes of a first set of the plurality of memory cell transistors arranged in a first row and (ii) a second word line coupling to gate electrodes of a second set of the plurality of memory cell transistors arranged in a second row;

a plurality of source lines include: a source line coupling to sources of the plurality of memory cell transistors arranged in the first and second rows;

a first transistor having a drain coupled to at least one of the plurality of source lines;

a second transistor having a drain coupled to a source of the first transistor, and a source coupled to a third potential.

2. The semiconductor memory device according to claim 1 , further comprising

a control circuit for controlling at least one of the plural first or second transistors.

3. The semiconductor memory device according to claim 1 , wherein

the memory cell transistors are formed in a first well formed in a semiconductor substrate,

the first and second transistors are formed in a second well formed in the semiconductor substrate, and

the first well and the second well are electrically isolated from each other.

4. The semiconductor memory device according to claim 1 , wherein the memory cell transistors are formed in a well formed in a semiconductor substrate, the first and second transistors are formed in the semiconductor substrate.

5. The semiconductor memory device according to claim 1 , wherein the first and second transistors have a gate breakdown voltage which is less than or equal to an erase voltage to be applied to the memory cell transistors when information stored in the memory cell transistors is erased.

6. A semiconductor memory device comprising:

a plurality of memory cell transistors arranged in a matrix;

a plurality of bit lines coupled to a bit line drive circuit controlling a first potential of the plurality of bit lines, the plurality of bit lines include:

(i) a bit line coupling to drains of a first set of the plurality of memory cell transistors arranged in a first column and (ii) a second bit line coupling to drains of a second set of the plurality of memory cell transistors arranged in a second column;

a plurality of word lines coupled to a word line driver circuit controlling a second potential of the plurality of word lines, the plurality of word lines include:

(i) a first word line coupling to gate electrodes of a first set of the plurality of memory cell transistors arranged in a first row and (ii) a second word line coupling to gate electrodes of a second set of the plurality of memory cell transistors arranged in a second row;

a plurality of source lines include: a source line coupling to sources of the plurality of memory cell transistors arranged in the first and second rows;

a first transistor having a drain coupling to at least one of the plurality of source lines;

a second transistor having a drain coupling to a source of the first transistor and a source coupled to a third potential; and

a power circuit controlling another potential of the plurality of source lines.

7. The semiconductor memory device according to claim 6 , further comprising

a control circuit for controlling at least one of the plural first or second transistors.

8. The semiconductor memory device according to claim 6 , wherein

the memory cell transistors, the first and second transistors are formed in a semiconductor substrate.

9. A semiconductor memory device comprising:

a plurality of memory cell transistors arranged in a matrix;

a plurality of bit lines coupled to a bit line drive circuit controlling a first potential of the plurality of bit lines, the plurality of bit lines include:

(i) a bit line coupling to drains of a first set of the plurality of memory cell transistors arranged in a first column and (ii) a second bit line coupling to drains of a second set of the plurality of memory cell transistors arranged in a second column;

a plurality of word lines coupled to a word line driver circuit controlling a second potential of the plurality of word lines, the plurality of word lines include:

(i) a first word line coupling to gate electrodes of a first set of the plurality of memory cell transistors arranged in a first row and (ii) a second word line coupling to gate electrodes of a second set of the plurality of memory cell transistors arranged in a second row;

a plurality of source lines include: a source line coupling to sources of the plurality of memory cell transistors arranged in the first and second rows;

a transistor having a drain coupling to at least one of the plurality of source lines and a source coupled to a third potential; and

a control line coupling to at least one of gates of the plural transistors.

10. The semiconductor memory device according to claim 9 , further comprising

a control circuit for controlling at least one of the plural transistors, coupled to the control line.

11. The semiconductor memory device according to claim 9 , wherein

the memory cell transistors are formed in a first well formed in a semiconductor substrate,

the transistors, coupled to the control line, are formed in a second well formed in the semiconductor substrate, and

the first well and the second well are electrically isolated from each other.

12. The semiconductor memory device according to claim 9 , wherein

the memory cell transistors are formed in a well formed in a semiconductor substrate, and

the transistors, coupled to the control line, are formed in the semiconductor substrate.

13. The semiconductor memory device according to claim 9 , wherein

the transistors coupled to the control line have a gate breakdown voltage which is less than or equal to an erase voltage to be applied to the memory cell transistors when information stored in the memory cell transistors is erased.

14. A semiconductor memory device comprising:

a plurality of memory cell transistors arranged in a matrix;

a plurality of bit lines coupled to a bit line drive circuit controlling a first potential of the plurality of bit lines, the plurality of bit lines include:

(i) a bit line coupling to drains of a first set of the plurality of memory cell transistors arranged in a first column and (ii) a second bit line coupling to drains of a second set of the plurality of memory cell transistors arranged in a second column;

a plurality of word lines coupled to a word line driver circuit controlling a second potential of the plurality of word lines, the plurality of word lines include:

(i) a first word line coupling to gate electrodes of a first set of the plurality of memory cell transistors arranged in a first row and (ii) a second word line coupling to gate electrodes of a second set of the plurality of memory cell transistors arranged in a second row;

a plurality of source lines include: a source line coupling to sources of the plurality of memory cell transistors arranged in the first and second rows;

a transistor having a drain coupling to at least one of the plurality of source lines and a source coupled to a third potential;

a control line coupling to at least one of gates of the plural transistors; and

a power circuit controlling another potential of the plurality of source lines.

15. The semiconductor memory device according to claim 14 , further comprising

a control circuit for controlling at least one of the plural transistors, coupled to the control line.

16. The semiconductor memory device according to claim 14 , wherein

the memory cell transistors, the transistors, coupled to the control line, are formed in a semiconductor substrate.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
MERGER Recorded May 24, 2023
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU LIMITED
Reel/Frame 064221/0545 →
CHANGE OF NAME AND CHANGE OF ADDRESS Recorded Jul 16, 2020
From: AIZU FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 053481/0962 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2020
From: FUJITSU SEMICONDUCTOR LIMITED
To: AIZU FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 053209/0468 →
CHANGE OF ADDRESS Recorded Dec 23, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 041188/0401 →