IP Library Granted Patent US 8,426,904
Granted Patent B2
US 8,426,904 · App. 13/223,380 · Granted Apr 23, 2013

Semiconductor device

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Quick Facts
Patent No.
US 8,426,904
App. No.
13/223,380
Granted
Apr 23, 2013
Kind
B2
Abstract

A semiconductor device includes a plurality of nonvolatile memory cells ( 1 ). Each of the nonvolatile memory cells comprises a MOS type first transistor section ( 3 ) used for information storage, and a MOS type second transistor section ( 4 ) which selects the first transistor section. The second transistor section has a bit line electrode ( 16 ) connected to a bit line, and a control gate electrode ( 18 ) connected to a control gate control line. The first transistor section has a source line electrode ( 10 ) connected to a source line, a memory gate electrode ( 14 ) connected to a memory gate control line, and a charge storage region ( 11 ) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a relationship of tc<tm.

Claims (52)

1. An integrated microcomputer comprising:

a bus;

a central processing unit coupled to the bus; and

a non-volatile memory coupled to the bus and including:

a plurality of nonvolatile memory cells each having a first gate and a second gate;

a first circuit coupled to the first gates of the plurality of nonvolatile memory cells;

a second circuit coupled to the second gates of the plurality of nonvolatile memory cells; and

a voltage generation circuit which supplies a first voltage to the first circuit and supplies a second voltage to the second circuit,

wherein a gate insulating film thickness of the first circuit is less than that of the second circuit.

2. An integrated microcomputer according to claim 1 ,

wherein each of the plurality of nonvolatile memory cells has a charge storage region between the second gate thereof and a channel region.

3. An integrated microcomputer according to claim 1 ,

wherein the first circuit is arranged on a first side of the plurality of nonvolatile memory cells.

4. An integrated microcomputer according to claim 1 ,

wherein the central processing unit has a MOS transistor, and

wherein a gate insulating film thickness of the MOS transistor in the central processing unit is less than that of the second circuit.

5. An integrated microcomputer according to claim 1 ,

wherein the second circuit is arranged on a second side, which is opposite side to the first side, of the plurality of nonvolatile memory cells.

6. A microcomputer on a semiconductor chip, comprising:

a bus;

a central processing unit coupled to the bus and having a MOS transistor; and

a flash memory coupled to the bus and including:

a plurality of nonvolatile memory cells each having a first gate and a second gate;

a first driver coupled to the first gate of one of the plurality of nonvolatile memory cells;

a second driver coupled to the second gate of the one of the plurality of nonvolatile memory cells; and

a voltage generator which supplies a first voltage to the first driver and supplies a second voltage to the second driver,

wherein a gate insulating film thickness of the first driver and a gate insulating film thickness of the MOS transistor in the central processing unit are less than that of the second driver.

7. An integrated microcomputer according to claim 6 ,

wherein each of the plurality of nonvolatile memory cells has a charge storage region between the second gate thereof and a channel region.

8. An integrated microcomputer according to claim 6 ,

wherein the first driver is arranged on a first side of the plurality of nonvolatile memory cells.

9. An integrated microcomputer according to claim 8 ,

wherein the second driver is arranged on a second side, which is opposite side to the first side, of the plurality of nonvolatile memory cells.

10. An integrated data processor on a semiconductor chip, comprising:

a bus;

a central processing unit coupled to the bus and having a MOS transistor; and

a flash memory coupled to the bus and including:

a plurality of nonvolatile memory cells each having a first control gate and a second control gate;

a plurality of word lines, a plurality of bit lines, a plurality of control lines, and a plurality of source lines coupled to the plurality of memory cells such that one word line, one bit line, one control line, and one source line are coupled to one nonvolatile memory cell;

a first driver coupled to the first control gate of one of the plurality of nonvolatile memory cells via the corresponding word line;

a second driver coupled to the second control gate of the one nonvolatile memory cell via the corresponding control line; and

a voltage generator which supplies a first voltage to the first driver and supplies a second voltage to the second driver, and

wherein a gate insulating film thickness of the first driver is less than that of the second driver.

11. An integrated data processor according to claim 10 ,

wherein each of the plurality of nonvolatile memory cells has a charge storage region between the second control gate thereof and a channel region.

12. An integrated data processor according to claim 10 ,

wherein the central processing unit has a MOS transistor, and

wherein a gate insulating film thickness of the MOS transistor in the central processing unit is less than that of the second driver.

13. An integrated data processor according to claim 10 ,

wherein the first driver is arranged on a first side of the plurality of nonvolatile memory cells.

14. An integrated microcomputer according to claim 13 ,

wherein the second driver is arranged on a second side, which is opposite side to the first side, of the plurality of nonvolatile memory cells.

Assignments (2)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 9, 2014
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 032859/0252 →