Sacrificial waveguide test structures
Sacrificial optical test structures are constructed upon a wafer of pre-cleaved optical chips for testing the optical functions of the pre-cleaved optical chips. The sacrificial optical structures are disabled upon the cleaving the optical chips from the wafer and the cleaved optical chips can be used for their desired end functions. The test structures may remain on the cleaved optical chips or they may be discarded.
1. A planar wafer from which a plurality of optical chips are cleaved, each optical chip being configured to perform a corresponding optical function, the wafer including:
a first optical chip among the plurality of optical chips, the first optical chip comprising a circuitry for performing the corresponding optical function and a plurality of waveguides;
a sacrificial test structure configured to be contacted, controlled, and monitored for testing the optical function of the first optical chip or an adjoining optical chip on the wafer, the sacrificial test structure being arranged on the wafer such that at least a portion of the sacrificial test structure is severed from the first optical chip upon cleaving the first optical chip from the wafer; and
a plurality of waveguides that optically couple the circuitry of the first optical chip or an adjoining optical chip to the sacrificial test structure and that are substantially parallel to the plane of the wafer.
2. The wafer according to claim 1 , wherein the at least a portion of the sacrificial test structure is arranged on a second optical chip among the plurality of optical chips on the wafer.
3. The wafer according to claim 2 , wherein the second optical chip is adjacent the first optical chip.
4. The wafer according to claim 2 , wherein the second optical chip is laterally offset from the first optical chip.
5. The wafer according to claim 2 , wherein at least another portion of the sacrificial test structure is arranged on a third optical chip among the plurality of optical chips on the wafer.
6. The wafer according to claim 5 , wherein the third optical chip is adjacent the first optical chip.
7. The wafer according to claim 5 , wherein the third optical chip is laterally offset from the first optical chip.
8. The wafer according to claim 2 , wherein at least another portion of the sacrificial test structure is arranged on a discardable portion of the wafer.
9. The wafer according to claim 1 , wherein the at least a portion of the sacrificial test structure is arranged on a discardable portion of the wafer.
10. The wafer according to claim 1 , wherein the sacrificial test structure includes at least a portion of the plurality of waveguides.
11. The wafer according to claim 1 , wherein the sacrificial test structure includes at least one light source.
12. The wafer according to claim 11 , wherein the light source is at least one of a laser or a waveguide grating,
13. The wafer according to claim 1 , wherein the sacrificial test structure includes at least one receiver.
14. The wafer according to claim 13 , wherein the receiver is at least one of a photodiode, optical power monitor, or wavelength monitor.
15. An optical chip cleaved from a planar wafer from which a plurality of optical chips are cleaved, the optical chip being configured to perform an optical function and including:
a circuitry for performing the optical function;
at least a portion of a sacrificial test structure, the sacrificial test structure configured to be contacted, controlled, and monitored for testing the optical function of the circuitry of the optical chip or an adjoining optical chip prior to the optical chip being cleaved from the wafer; and
a plurality of waveguides that optically couple the circuitry of the first optical chip or an adjoining optical chip to the sacrificial test structure and that are substantially parallel to the plane of the wafer.
16. The optical chip according to claim 15 , wherein the sacrificial test structure includes at least one of a light source, receiver, or severed portion of a waveguide.
17. A method of testing and processing a first optical chip among a plurality of optical chips on a planar wafer, each optical chip being configured to perform a corresponding optical function, the method including:
contacting a sacrificial test structure for testing the properties of the first optical chip or an adjoining optical chip on the wafer, the sacrificial test structure being arranged on the wafer;
optically coupling the sacrificial test structure to a circuitry of the first optical chip or an adjoining optical chip on the wafer via a plurality of waveguides, wherein the waveguides are substantially parallel to the plane of the wafer;
controlling and monitoring the sacrificial test structure; and
cleaving the first optical chip from the wafer such that at least a portion of the sacrificial test structure is severed from the first optical chip upon cleaving the first optical chip from the wafer.
18. The method according to claim 17 , wherein the at least a portion of the sacrificial test structure is arranged on at least one of a second optical chip among the plurality of optical chips on the wafer or a discardable portion of the wafer.
19. The method according to claim 17 , wherein the sacrificial test structure includes at least a portion of the plurality of waveguides.
20. The method according to claim 17 , wherein the sacrificial test structure includes at least one light source and at least one receiver.