Method for forming semiconductor device
A method of forming a semiconductor device includes the following processes. A first interlayer insulating film is formed over a cell transistor and a peripheral transistor. A cell contact hole is formed in the first interlayer insulating film, the cell contact hole reaching the cell transistor. A lower contact plug is formed at a bottom of the cell contact hole. A peripheral contact hole is formed in the first interlayer insulating film, the peripheral contact hole reaching the peripheral transistor. A first peripheral contact plug is simultaneously formed in the peripheral contact hole and an upper contact plug in the cell contact hole, the upper contact plug being disposed on the lower contact plug.
1. A method of forming a semiconductor device, the method comprising:
forming a first transistor including a gate, and a first diffusion layer in a cell region of a semiconductor substrate, the first diffusion layer including a source region and a drain region;
forming a second transistor including a second diffusion layer in a peripheral circuit region of the semiconductor substrate;
forming a first contact layer comprising silicon, the first contact layer being in contact with the source region and the drain region of the first diffusion layer; and
forming a metal film over the first and second transistors, the metal film being in contact with the first contact layer on the source region and the first contact layer on the drain region, the metal film being in contact with the second diffusion layer;
patterning the metal film to form a first contact plug being in contact with the first contact layer and a second contact plug being in contact with the second diffusion layer; and
forming a first suicide layer between the first contact layer and the first contact plug and a second silicide layer between the second diffusion layer and the second contact plug.
2. The method according to claim 1 , further comprising:
forming a first interlayer film over the first and second transistors; and
forming a first contact hole, the first contact hole reaching the first diffusion layer,
wherein forming the first contact layer comprises:
forming a silicon film to fill the first contact hole; and
etching back the silicon film so that a top of the silicon film is lower than a top of the first interlayer film.
3. The method according to claim 2 , further comprising:
forming a second contact hole before forming the metal film, the second contact hole reaching the second diffusion layer.
4. The method according to claim 1 , wherein forming the metal film comprises:
forming a second contact layer;
forming a barrier layer on the second contact layer; and
forming a core layer on the barrier layer,
wherein the second contact layer comprises at least one of titanium and cobalt.
5. A semiconductor device formed by the method according to claim 1 .