Method and apparatus for coupling a laser diode to a magnetic writer
A write head includes a cavity configured to couple a laser diode to the write head. A bottom of the cavity includes a heat conductive element configured to contact the laser diode, a plurality of thermal studs disposed below the heat conductive element, and a substrate disposed below the thermal studs. The heat conductive element, thermal studs, and substrate are thermally coupled to draw heat from the laser diode.
1. A write head comprising:
a cavity configured to couple a laser diode to the magnetic writer, wherein a bottom of the cavity includes:
a heat conductive element configured to contact the laser diode;
a plurality of thermal studs disposed below the heat conductive element; and
a substrate disposed below the thermal studs, wherein the heat conductive element, thermal studs, and substrate are thermally coupled to draw heat from the laser diode.
2. The write head of claim 1 , wherein the heat conductive element comprises a shield coupled to the thermal studs and an electrode thermally coupled to the shield, wherein the electrode is configured to be electrically and thermally coupled to the laser diode.
3. The write head of claim 2 , further comprising an electrical insulation layer disposed between the electrode and the shield, wherein the electrical insulation layer thermally couples the electrode and the shield.
4. The write head of claim 1 , further comprising electrical pathways routed between the thermal studs.
5. The write head of claim 4 , wherein the electrical pathways comprise top bond pad connections that electrically couple to the laser diode.
6. The write head of claim 1 , wherein the write head comprises a hard drive slider, and wherein the surface comprises a trailing edge of the slider.
7. The write head of claim 1 , wherein the laser diode comprises an edge firing laser diode.
8. A write head comprising:
a cavity configured to couple a laser diode to the write head, wherein the cavity includes:
a waveguide coupler configured for optical coupling of a waveguide of the write head to an output of the laser diode;
a plurality of solder bumps on a bottom of the cavity configured to electrically couple the laser diode to the writer; and
at least one mechanical stopper disposed in the cavity, wherein the mechanical stopper facilitates vertical alignment of the output of the laser diode to the waveguide coupler in response to a reflow of the solder bumps.
9. The write head of claim 8 , wherein the laser diode comprises an edge firing laser diode, and wherein the waveguide coupler is disposed at an edge of the cavity.
10. The write head of claim 8 , further comprising:
an electrical insulation layer disposed below the solder bumps;
a shield below the electrical insulation layer;
a plurality of thermal studs disposed below the shield; and
a substrate disposed below the thermal studs, wherein the solder bumps, electrical insulation layer, shield, thermal studs, and substrate are thermally coupled to draw heat from the laser diode.
11. The write head of claim 10 , further comprising electrical pathways routed between the thermal studs.
12. The write head of claim 11 , wherein the electrical pathways comprise top bond pad connections that electrically couple to the laser diode.
13. The write head of claim 8 , wherein the write head comprises a hard drive slider.