Method of making an electronic device
View Patent ↗An electronic device includes an electronic component with a mating surface. A thermal interface sheet is attached to the mating surface. A substrate carries the electronic device and includes a face. The electronic component is secured to the substrate with the thermal interface sheet positioned between the mating surface and the face. The mating surface is relatively less flat than the face and the mating surface is relatively smoother than the face.
1. An electronic device comprising:
an electronic component having a mating surface;
a thermal interface sheet attached to the mating surface;
a substrate having a face, the electronic component secured to said substrate and said thermal interface sheet positioned between said mating surface and said face; and
wherein the mating surface has a flatness value and the face has a surface roughness, the mating surface flatness value at least about 15% greater than the face surface roughness when measured in the same units.
2. The method of claim 1 wherein the mating surface has a concave configuration.
3. The method of claim 1 wherein the mating surface has a saddle point configuration.
4. The method of claim 1 wherein the mating surface has a generally corrugated configuration.
5. The method of claim 1 wherein an adhesive attaches the thermal interface sheet to the mating surface.
6. The method of claim 1 wherein the mating surface flatness value at least about 20% greater than the face surface roughness when measured in the same units.
7. The method of claim 1 wherein a surface area of a major surface of the thermal interface sheet not larger than about the surface of the face of the substrate.
8. The method of claim 1 wherein the electronic component comprises a PCB having an LED or an OLED.
9. The method of claim 1 wherein said thermal interface sheet comprises a compressed mass of exfoliated graphite particles.
10. The method of claim 1 wherein said thermal interface sheet comprises a graphitized polyimide sheet.
11. The method of claim 5 wherein said adhesive comprises a layer no more than about 0.0015 mm thick.
12. The method of claim 1 further including a protective coating adjacent to said thermal interface sheet.
13. The method of claim 12 wherein said protective coating not more than about 0.025 mm thick.
14. The method of claim 13 wherein said protective coating not more than about 0.005 mm thick.
15. The method of claim 1 wherein said substrate comprises a heat dissipating device.
16. The method of claim 1 wherein said substrate substantially surrounds said device.