PRINTED ELECTRONIC CIRCUIT BOARDS AND OTHER ARTICLES HAVING PATTERNED CONDUCTIVE IMAGES

1 . A method of producing a printed electronic circuit, the method comprising performing the following steps in order:

providing an electrically insulating substrate;

depositing a first thermoplastic layer of thermoplastic particles on the substrate to form a patterned image;

depositing a first conductive powder layer over the substrate in registration with the first thermoplastic layer;

tacking the first conductive powder layer to the first thermoplastic layer on the substrate;

removing conductive powder from portions of the substrate other than that coated with the patterned image;

depositing a second conductive powder layer over the substrate in registration with the first thermoplastic layer;

heating the first thermoplastic layer above its glass transition temperature;

pressing a smooth material against the heated first thermoplastic layer so that conductive powder particles deposited as part of the first and the second conductive powder layers are brought closer to each other; and

removing conductive powder from portions of the substrate other than that coated with the patterned image.

2 . The method according to claim 1 , further including performing the following steps in order after removing the conductive powder:

applying a thermoset layer over the substrate;

depositing a second thermoplastic layer of thermoplastic particles over the thermoset layer to form a second patterned image;

depositing a third conductive powder layer over the thermoset layer in registration with the second thermoplastic layer;

tacking the third conductive powder layer to the second thermoplastic layer; and

removing conductive powder from portions of the thermoset layer other than that coated with the second patterned image.

3 . The method according to claim 2 , wherein the applying step includes depositing electrically-insulating thermoplastic particles over the substrate and cross-linking the electrically-insulating thermoplastic particles, wherein the electrically-insulating thermoplastic particles have a higher glass transition temperature than the first thermoplastic layer.

4 . The method according to claim 1 , wherein the electrically insulating substrate is selected from the group consisting of polyimides, PET, fiberglass, and paper.

5 . The method according to claim 1 , wherein the electrically insulating substrate contains holes so that electrical connections to the rear of the substrate can be made.

6 . The method according to claim 1 , wherein the thermoplastic particles have a glass transition temperature between 50° C. and 70° C.

7 . The method according to claim 6 , wherein the thermoplastic particles are selected from the group consisting of polyester, polystyrene, polyester amides, and polycarbonates.

8 . The method according to claim 1 , wherein the first conductive powder layer includes metals.

9 . The method according to claim 8 , wherein the metals include metallic particles selected from the group consisting of copper, tin, tin plated copper, and silver particles.

10 . The method according to claim 1 , wherein the first conductive powder layer includes conducting polymer particles.

11 . The method according to claim 1 , wherein the first conductive powder layer includes particles with conductive enhanced coatings that improve conduction between particles.

12 . The method according to claim 11 , wherein the conductive enhanced coatings include metal salts or carbon.

13 . The method according to claim 1 wherein the conductive powder includes particles having a size less than 20 μm.

14 . The method according to claim 1 wherein the conductive powder includes particles having a size between 2 and 8 μm.