Method for electrically connecting an energy source to a head of a disk drive
View Patent ↗The present invention generally relates to fabricating a bond pad for electrically connecting a laser diode to a slider and a TAR head in a HDD. The bond pad is deposited on a surface of the head that is perpendicular to the air bearing surface (ABS). The head is diced and lapped to expose the bond pad on a top surface of the head and mounted on a slider. The laser diode and a sub-mount may be coupled to the top surface of the slider—i.e., the surface opposite the ABS—by connecting to the bond pads. Specifically, both the laser diode and the sub-mount have electrodes thereon that are perpendicular to the bond pads. Conductive bonding material is used to bond the laser diode and the sub-mount to the bond pads.
1. A method for electrically connecting an energy source to a head of a disk drive, comprising:
depositing a conductive bond pad onto a surface of the head;
depositing an insulating material onto the surface such that the bond pad is embedded in the insulating material;
selectively removing the insulating material to expose a first surface of the bond pad;
after exposing the first surface, exposing a second surface of the bond pad; and
applying a conductive material on the second surface of the bond pad to electrically connect the second surface to the energy source, the bond pad is configured to provide, via the conductive material, an electrical signal for driving the energy source to heat a magnetic media.
2. The method of claim 1 , wherein exposing the second surface of the bond pad further comprises dicing the head such that a saw blade passes through the bond pad, wherein the second surface is parallel to an air bearing surface of the head.
3. The method of claim 1 , wherein the energy source is mounted on a top surface of the head that is parallel to the second surface of the bond pad.
4. The method of claim 3 ,
applying a conductive material on the second surface of the bond pad to
wherein the electrode is substantially perpendicular to the top surface of the head.
5. The method of claim 1 , wherein the bond pad is at least 20 microns wide in a direction perpendicular to the surface of the head on which the bond pad was deposited and between 10-40 microns thick in a direction perpendicular to the air bearing surface.
6. A method for electrically connecting an energy source to a head of a disk drive, comprising:
depositing a conductive bond pad onto a surface of the head;
depositing an insulating material onto the surface such that the bond pad is embedded in the insulating material;
selectively removing the insulating material to expose a first surface of the bond pad;
after selectively removing the insulating material, depositing a conductive material into a via that contacts the bond pad;
depositing a head bond pad, wherein the conductive material in the via electrically connects the head bond pad to the bond pad;
exposing a second surface of the bond pad; and
electrically connecting the second surface of the bond pad to the energy source.
7. The method of claim 6 , further comprising:
electrically connecting the head bond pad to a circuit driver that powers the energy source.