Method of making electronic devices using selective deposition

1. A deposition method for forming a patterned thin film comprising:

applying a composition comprising a deposition inhibitor material to a receiver substrate,

simultaneously or subsequently to the applying step, patterning the deposition inhibitor material to provide selected areas on the receiver substrate where the deposition inhibitor material is absent, and

depositing an inorganic thin film on the receiver substrate by chemical vapor deposition only in those areas where the deposition inhibitor material is absent,

wherein the deposition inhibitor material is a polymer comprising recurring units represented by the following Structure (I):

wherein R 1 is hydrogen, an alkyl group, or a group as defined for R 2 , and

R 2 is a cyano, isocyanate, azide, chloro, nitro, phosphoric, heteroaryl, or —C(═X)—R 3 wherein X is oxygen, sulfur, or N + (R) 2 , R 3 is R, OR, OM + , OC(═O)OR, SR, NHC(═O)R, NHC(═O)N(R) 2 , N(R) 2 , or N + (R) 3 , M + is an alkali or ammonium cation, and R is hydrogen, a halogen, or an alkyl or cycloalkyl group.

2. The deposition method of claim 1 wherein the deposition inhibitor material is a cyanoacrylate polymer comprising recurring units that are represented by Structure (I) wherein R is hydrogen or an alkyl or cyano group, and at least one of R 1 and R 2 is a cyano group.

3. The deposition method of claim 1 wherein the deposition inhibitor material is a cyanoacrylate polymer comprising recurring units that are represented by Structure (I) wherein R 1 is hydrogen or an alkyl group having 1 to 8 carbon atoms, and R 2 is a cyano group.

4. The deposition method of claim 1 wherein the deposition inhibitor material is a cyanoacrylate polymer that comprises at least two different recurring units that are represented by Structure (I).

5. The deposition method of claim 1 wherein the deposition inhibitor material is a cyanoacrylate polymer that comprises the same or different recurring units that are represented by Structure (I) in an amount of at least 1 mol % and up to 100 mol % based on total polymer recurring units.

6. The deposition method of claim 1 wherein the deposition inhibitor material is a cyanoacrylate polymer that comprises the same or different recurring units represented by Structure (I) in an amount of at least 1 weight % and up to and including 100 weight %.

7. The deposition method of claim 1 comprising depositing the inorganic thin film on the receiver substrate by atomic layer deposition.

8. The deposition method of claim 1 comprising patterning the composition comprising the deposition inhibitor material on the receiver substrate by thermal transfer from a donor element comprising a thermal transfer layer comprising the composition comprising the deposition inhibitor material.

9. The deposition method of claim 7 comprising patterning the composition comprising the deposition inhibitor material on the receiver substrate by thermal transfer from a donor element during which the donor element and the receiver substrate are in direct contact or separated by up to and including 50 μm.

10. The deposition method of claim 8 comprising patterning the composition comprising the deposition inhibitor material on the receiver substrate by thermal transfer from a donor element using focused laser energy.

11. The deposition method of claim 8 comprising patterning the composition comprising the deposition inhibitor material on the receiver substrate by thermal transfer from a donor element that comprises a radiation absorber.

12. The deposition method of claim 8 comprising patterning the deposition inhibitor material by thermal transfer on the receiver substrate from a donor element that comprises a radiation absorber in an intermediate layer between a thermal transfer layer comprising the deposition inhibitor material and donor substrate in the donor element.

13. The deposition method of claim 12 comprising patterning the deposition inhibitor material by thermal transfer on the receiver substrate from a donor element that comprises an infrared radiation absorber in a thermal transfer layer comprising the deposition inhibitor material.

14. The deposition method of claim 1 comprising coating the composition comprising the deposition inhibitor material on the receiver substrate, followed by patterning the coated deposition inhibitor material by thermal ablation.

15. The deposition method of claim 1 comprising coating the composition comprising the deposition inhibitor material on the substrate, followed by patterning the coated deposition inhibitor material by thermal ablation using a focused laser.

16. The deposition method of claim 1 wherein the deposited inorganic thin film has an inhibition of at least 200 Å.

17. The deposition method of claim 1 wherein the deposited inorganic thin film is either a metal or a metal containing compound.

18. The deposition method of claim 1 wherein the thin film is deposited using spatially dependant ALD that comprises:

providing a series of gas channels, each in contact with a discrete separate region of a receiver substrate, and each gas channel having a gas composition, the gas composition comprising, in order, at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, and optionally repeating this sequence one or more times, and

moving the receiver substrate relative to the gas channels so that a portion of the receiver substrate comes into contact sequentially with at least two gas zones,

wherein the first reactive gaseous material is capable of reacting with the receiver substrate surface that has been treated with the second reactive gaseous material to form the inorganic thin film.

19. The method of claim 18 wherein the receiver substrate comprises a moving web.

20. An electronic device prepared using the method of claim 1 , which electronic device comprises a receiver substrate and a deposited pattern of the cyanoacrylate polymer comprising recurring units represented by the Structure (I).