On-die bond wires system and method for enhancing routability of a redistribution layer
View Patent ↗An integrated circuit includes a first die and a second die positioned in a package. The first die has a redistribution layer formed on the die and including a plurality of relocated bond pads. The relocated bond pads are positioned near an inner edge of the first die that is adjacent to an inner edge of the second die. Each relocated bond pad is coupled to a corresponding bond pad on the second die through a respective bonding wire. The first die further includes a plurality of original bond pads. The redistribution layer further includes at least one intermediate bond pad electrically interconnected through a respective conductive trace to a corresponding original bond pad. Each intermediate bond pad is electrically connected to a corresponding relocated bond pad through a respective bond wire.
1. An integrated circuit including:
a first die positioned in a package, the first die comprising a first bond pad; and
a second die positioned in the package, the second die including
a redistribution layer formed on the second die, and
a second bond pad,
wherein the redistribution layer includes
a third bond pad, the third bond pad positioned to provide electrical interconnection via a first bonding wire to the first bond pad of the first die,
a first intermediate bond pad electrically interconnected through a first conductive trace to the second bond pad, and
a second intermediate bond pad electrically interconnected through a second conductive trace to the third bond pad,
wherein (i) the first intermediate bond pad and (ii) the second intermediate bond pad are electrically connected through a second bond wire.
2. The integrated circuit of claim 1 , wherein the first die is stacked on top of the second die.
3. The integrated circuit of claim 1 , wherein the first die and the second die are positioned side-by-side.
4. The integrated circuit of claim 3 , wherein the third bond pad is positioned along an inner edge of the second die, the inner edge of the second die being positioned adjacent to an inner edge of the first die.
5. The integrated circuit of claim 1 , wherein the third bond pad is configured to communicate one or more of (i) control signals, (ii) address signals, and (iii) data signals between the first die and the second die.
6. The integrated circuit of claim 1 , wherein (i) the first die and (ii) the second die are arranged within a lead frame package.
7. The integrated circuit of claim 6 , wherein the lead frame package comprises a quad flat package.
8. The integrated circuit of claim 7 , wherein:
the quad flat package includes a lead frame having a die paddle; and
each of (i) the first die and (ii) the second die is mounted on the die paddle.
9. The integrated circuit of claim 1 , wherein:
the first die includes memory circuitry; and
the second die includes memory controller circuitry.
10. The integrated circuit of claim 1 , wherein (i) the first die and (ii) the second die are arranged in a system-in-package.
11. The integrated circuit of claim 1 , further comprising a third die including another redistribution layer, the another redistribution layer of the third die including (i) a fourth bond pad and (ii) an intermediate bond pad connected to the fourth bond pad through a third bonding wire.
12. An electronic system, comprising:
an input device;
an output device;
a storage device; and
computer circuitry coupled to each of (i) the input device, (ii) the output device, and (iii) the storage device, the computer circuitry including an integrated circuit, the integrated circuit including
a first die positioned in a package, the first die comprising a first bond pad, and
a second die positioned in the package, the second die including
a redistribution layer formed on the second die, and
a second bond pad,
wherein the redistribution layer includes
a third bond pad, the third bond pad positioned to provide electrical interconnection via a first bonding wire to the first bond pad of the first die,
a first intermediate bond pad electrically interconnected through a first conductive trace to the second bond pad, and
a second intermediate bond pad electrically interconnected through a second conductive trace to the third bond pad,
wherein (i) the first intermediate bond pad and (ii) the second intermediate bond pad are electrically connected through a second bond wire.
13. The electronic system of claim 12 wherein the package comprises a quad flat package.
14. The electronic system of claim 13 , wherein:
the quad flat package includes a lead frame having a die paddle; and
each of (i) the first die and (ii) the second die is mounted on the die paddle.
15. The electronic system of claim 12 , wherein (i) the first die and (ii) the second die are arranged in a system-in-package.
16. The electronic system of claim 12 , wherein:
the first die includes memory circuitry; and
the second die includes memory controller circuitry.
17. The electronic system of claim 12 , wherein the electronic system comprises one of (i) a computer system, (ii) a communications system, (iii) a printing system, and (iv) an embedded system for controlling an instrumentation system.
18. The electronic system of claim 12 , wherein:
the integrated circuit further comprises a third die including another redistribution layer, the another redistribution layer of the third die including (i) a fourth bond pad and (ii) an intermediate bond pad connected to the fourth bond pad through a third bonding wire.
19. The electronic system of claim 12 , wherein:
(i) the first die and (ii) the second die are positioned side-by-side; and
the third bond pad is positioned along an inner edge of the second die, the inner edge of the second die being positioned adjacent to an inner edge of the first die.
20. The electronic system of claim 12 , wherein the third bond pad is configured to communicate one or more of (i) control signals, (ii) address signals, and (iii) data signals between the first die and the second die.