IP Library Granted Patent US 8,482,959
Granted Patent B2
US 8,482,959 · App. 13/324,759 · Granted Jul 9, 2013

Method of programming, erasing and repairing a memory device

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Quick Facts
Patent No.
US 8,482,959
App. No.
13/324,759
Granted
Jul 9, 2013
Kind
B2
Abstract

A method of repairing a memory device is provided. If an erase process is unsuccessful, a repair process is performed. A programmed state of the memory device is determined, A subsequent erase process dependent on the programmed state is performed. Also, a method of programming and erasing a memory device is provided. The memory device includes first and second electrodes and a switching layer therebetween. A first on-state resistance characteristic of the memory device is provided in programming the memory device by application of a first voltage to the gate of a transistor in series with the memory device. Other on-state resistance characteristics of the memory device, different from the first on-state resistance characteristic, may be provided by application of other voltages, different from the first voltage, to the gate of the transistor.

Claims (35)

1. A method of repairing a memory device, comprising:

determining an erase process performed on the memory device is unsuccessful; and

performing a repair process to place the memory device in an erased state, wherein said performing the repair process includes:

determining a programmed state of the memory device resulting from the erase process, and

performing a subsequent erase process dependent on the programmed state.

2. The method of claim 1 , wherein said determining the erase process performed on the memory device is unsuccessful includes:

reading a memory state of the memory device; and

detecting an unexpected current level.

3. The method of claim 1 , wherein the programmed state is based on a voltage applied, during the erase process, to a gate of a transistor in series with the memory device.

4. The method of claim 3 , wherein the memory device comprises first and second electrodes and a switching layer between the first and second electrodes.

5. The method of claim 3 , wherein the memory device includes a plurality of selectable conductive on-resistance states.

6. The method of claim 5 , wherein a selected one of the plurality of selectable conductive on-resistance states of the memory device is determined by a selected voltage applied to the gate of the transistor.

7. The method of claim 6 , wherein the selected one of the plurality of selectable conductive on-resistance states provides one of a plurality of programmed states of the memory device, and wherein each programmed state of the memory device corresponds to one of the selectable conductive on-resistance states.

8. A method of repairing a memory device, comprising:

performing a first erase process on a memory device to erase a first programmed state;

after performance of the first erase process, determining a memory state of the memory device; and

if the memory state is a second programmed state, performing a repair process to place the memory device in an erased state.

9. The method of claim 8 , wherein said performing the repair process includes:

performing a second erase process dependent on the second programmed state.

10. The method of claim 8 , wherein said determining the memory state of the memory device includes:

reading the memory state of the memory device; and

detecting an unexpected current level.

11. The method of claim 8 , wherein the second programmed state is based on a voltage applied, during the first erase process, to a gate of a transistor in series with the memory device.

12. The method of claim 11 , wherein the memory device comprises first and second electrodes and a switching layer between the first and second electrodes.

13. The method of claim 11 , wherein the memory device includes a plurality of selectable conductive on-resistance states.

14. The method of claim 13 , wherein a selected one of the plurality of selectable conductive on-resistance states of the memory device is determined by a selected voltage applied to the gate of the transistor.

15. The method of claim 14 , wherein the selected one of the plurality of selectable conductive on-resistance states provides one of a plurality of programmed states of the memory device, and wherein each programmed state of the memory device corresponds to one of the selectable conductive on-resistance states.

16. A method of repairing a memory device, comprising:

reading the memory device and detecting an unexpected conductive on-resistance state corresponding to the memory device being programmed with a first voltage applied, during a previous attempt to erase the memory device, to a gate of a transistor in series with the memory device;

erasing the memory device by applying a second voltage higher than the first voltage to the gate of the transistor; and

reading a memory state of the memory device.

17. The method of claim 16 , wherein the memory device comprises first and second electrodes and a switching layer between the first and second electrodes.

18. The method of claim 16 , wherein the memory device includes a plurality of selectable conductive on-resistance states.

19. The method of claim 18 , wherein a selected one of the plurality of selectable conductive on-resistance states of the memory device is determined by a selected voltage applied to the gate of the transistor.

20. The method of claim 19 , wherein the selected one of the plurality of selectable conductive on-resistance states provides one of a plurality of programmed states of the memory device, and wherein each programmed state of the memory device corresponds to one of the selectable conductive on-resistance states.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036055/0276 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →