IP Library Granted Patent US 9,348,469
Granted Patent B2
US 9,348,469 · App. 13/338,015 · Granted May 24, 2016

Patterned conductive layers for sensor assembly and method of making the same

Inventors: Kusuma Adi Ningrat (Singapore, SG); Wah Wah Soe (Singapore, SG)
Assignee: STMicroelectronics Asia Pacific Pte Ltd
G06F3/044G02F1/13338H03K17/9622G06F2203/04107H03K2217/96031H03K2217/960775Y10T29/49124
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Quick Facts
Patent No.
US 9,348,469
App. No.
13/338,015
Granted
May 24, 2016
Kind
B2
Abstract

An ITO sensor design and method for making the same is optimized to minimize noise from an LCD. The design includes a two layer sensor design having a transmitter line (Tx) placed in a first layer and a receiver line (Rx) placed in a second layer in a diamond-shaped pattern. The diamond shape maximizes the sensitivity of the sensor.

Claims (28)

1. A sensor assembly apparatus, comprising:

a transmit portion including a plurality of columns of transmit lines, each transmit line having a conductive rectangular shape in a top view; and

a receive portion including a plurality of rows of receive lines, each receive line having a plurality of series connected conductive diamond shapes in the top view,

wherein each diamond shape includes a single slot opening that is aligned with a gap between adjacent ones of the transmit lines.

2. The apparatus of claim 1 , wherein a conductive material used for the transmit lines in the transmit portion and used for the receive lines in the receive portion comprises indium tin oxide (ITO).

3. The apparatus of claim 1 , wherein each transmit line includes an opening along an edge of the rectangular shape and wherein adjacent openings in the edges of adjacent ones of the transmit lines form a diamond shape in the top view that is aligned with one of the series connected diamond shapes of the receive line.

4. The apparatus of claim 1 , further comprising a liquid crystal display (LCD) arranged under the transmit and receive portions and separated therefrom by an air gap.

5. The apparatus of claim 1 , wherein edges of the single slot opening are aligned with edges of adjacent ones of the transmit lines.

6. The apparatus of claim 1 , further comprising a plurality of floating conductive diamond shapes arranged in the top view over the rectangular shapes of the transmit lines and positioned between the receive lines.

7. A sensor assembly apparatus, comprising:

a transmit portion including a plurality of columns of transmit lines, each transmit line having a rectangular shape in a top view; and

a receive portion including a plurality of rows of receive lines, each receive line having a plurality of series connected diamond shapes in the top view,

wherein each diamond shape includes a single diamond shaped opening having edges parallel to edges of the diamond shape.

8. The apparatus of claim 7 , wherein a conductive material used for the transmit lines in the transmit portion and used for the receive lines in the receive portion comprises indium tin oxide (ITO).

9. The apparatus of claim 7 , wherein each transmit line includes an opening along an edge of the rectangular shape and wherein adjacent openings in the edges of adjacent ones of the transmit lines form a diamond shape in the top view that is aligned with one of the series connected diamond shapes of the receive line.

10. The apparatus of claim 7 , further comprising a liquid crystal display (LCD) arranged under the transmit and receive portions and separated therefrom by an air gap.

11. The apparatus of claim 7 , further comprising a plurality of floating conductive diamond shapes arranged in the top view over the rectangular shapes of the transmit lines and positioned between the receive lines.

12. The apparatus of claim 7 , further comprising a plurality of floating conductive diamond shapes arranged in the top view within the diamond shaped openings.

13. The apparatus of claim 12 , wherein each floating conductive diamond shape includes a single slot opening that is aligned with a gap between adjacent ones of the transmit lines.

14. A sensor assembly apparatus, comprising:

a transmit portion including a plurality of columns of transmit lines, each transmit line having a rectangular shape in a top view; and

a receive portion including a plurality of rows of receive lines, each receive line having a plurality of series connected diamond shapes in the top view,

wherein each transmit line includes an opening along an edge of the rectangular shape and wherein adjacent openings in the edges of adjacent ones of the transmit lines form a diamond shape in the top view that is aligned with one of the series connected diamond shapes of the receive line.

15. The apparatus of claim 14 , wherein a conductive material used for the transmit lines in the transmit portion and used for the receive lines in the receive portion comprises indium tin oxide (ITO).

16. The apparatus of claim 14 , further comprising a liquid crystal display (LCD) arranged under the transmit and receive portions and separated therefrom by an air gap.

17. The apparatus of claim 14 , further comprising a plurality of floating conductive diamond shapes arranged in the top view over the rectangular shapes of the transmit lines and positioned between the receive lines.

18. The apparatus of claim 14 , wherein each diamond shape includes a single diamond shaped opening having edges parallel to edges of the diamond shape.

19. The apparatus of claim 14 , wherein each diamond shape includes a single slot opening that is aligned with a gap between adjacent ones of the transmit lines.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2024
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068434/0215 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 14, 2012
From: NINGRAT, KUSUMA ADI
To: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
Reel/Frame 028205/0284 →
Continuity (2)
Provisional Application 61427645 · Dec 28, 2010
Related Publication 20120300140A1 · Nov 29, 2012