Semiconductor thin film, thin film transistor, method for manufacturing same, and manufacturing equipment of semiconductor thin film
View Patent ↗A method for manufacturing a semiconductor thin film is provided which can form its crystal grains having a uniform direction of crystal growth and being large in size and a manufacturing equipment using the above method, and a method for manufacturing a thin film transistor. In the above method, by applying an energy beam partially intercepted by a light shielding element, melt and re-crystallization occur with a light-shielded region as a starting point. The irradiation of the beam gives energy to the light-shielded region of the silicon thin film so that melt and re-crystallization occur with the light-shielded region as the starting point and so that a local temperature gradient in the light-shielded region is made to be 1200° C./μm or more. In the manufacturing method, a resolution of an optical system used to apply the energy beam is preferably 4 μm or less.
1. A method, comprising:
applying an energy beam to at least one light-shielding element arranged between a preformed semiconductor thin film and an energy beam irradiating source including generating a lighted shielded region on the preformed semiconductor thin film via the at least one light-shielding element; and
in response to the applying, growing a crystal in a pre-defined direction with the light-shielded region as a starting point.
2. The method of claim 1 , further comprising:
forming a light shielding mask including forming a light-shielding pattern on a transparent substrate; and
maintaining a ratio of a pitch of the light-shielding pattern to a light-shielding width of the light-shielding pattern to be one or more,
wherein the applying the energy beam includes applying the energy beam to the light-shielding mask.
3. The method of claim 2 , wherein the maintaining the ratio includes maintaining the light-shielding width of the light-shielding pattern to be at least 0.3 μm.
4. The method of claim 1 , wherein the applying the energy includes applying the energy beam with one pulse irradiation; and
in response to the applying the energy beam with one pulse irradiation, concurrently melting and re-crystallizing surfaces of the preformed semiconductor thin film.
5. The method of claim 1 , further comprising:
creating a local temperature gradient in the light-shielded region of at least 300° C./μm, wherein the growing comprises growing the crystal in a direction of the temperature gradient; and
at least partially inhibiting the growing of the crystal in a direction vertical to the temperature gradient.
6. A method, comprising:
applying an energy beam to a semiconductor thin film using a gate electrode formed with a gate insulating film interposed between the gate electrode and a preformed semiconductor thin film as a light-shielding element including generating a lighted shielded region on the semiconductor thin film via the light-shielding element; and
in response to the applying, growing a crystal to grow in a direction with the light-shielded region as a starting point.
7. The method of claim 6 , wherein at least one light-shielding width of the at least one light-shielding element is at least 0.3 μm.
8. The method of claim 6 , wherein the applying the energy includes applying the energy beam with one pulse irradiation; and
in response to the applying the energy beam with one pulse irradiation, concurrently melting and re-crystallizing surfaces of the preformed semiconductor thin film.
9. The method of claim 6 , further comprising:
creating a local temperature gradient in the light-shielded region of at least 300° C./μm, wherein the growing comprises growing the crystal in a direction of the temperature gradient; and
at least partially inhibiting the growing of the crystal in a direction vertical to the temperature gradient.
10. The method of claim 6 , wherein the applying the energy includes applying the energy beam to the light-shielded region with an intensity gradient of at least 220 mJ/cm2/μm.
11. A method comprising:
irradiating an energy beam on a preformed semiconductor film with direct-light shielded regions; and
melting and re-crystallizing the preformed semiconductor thin film with the direct-light shielded regions as starting points.
12. The method of claim 11 , further comprising:
forming a light shielding mask including forming a light-shielding pattern on a transparent substrate; and
maintaining a ratio of a pitch of the light-shielding pattern to a light-shielding width of the light-shielding pattern to be one or more,
wherein the light shielding mask forms the direct-light shielded regions.
13. The method of claim 12 , wherein the maintaining the ratio includes maintaining the light-shielding width of the light-shielding pattern to be at least 0.3 μm.
14. The method of claim 11 , wherein the applying the energy includes applying the energy beam with one pulse irradiation; and
in response to the irradiating the energy beam with one pulse irradiation, concurrently melting and re-crystallizing surfaces of the preformed semiconductor thin film.
15. The method of claim 11 , further comprising:
creating a local temperature gradient in the light-shielded region of at least 300° C./μm, wherein the growing comprises growing the crystal in a direction of the temperature gradient; and
at least partially inhibiting the growing of the crystal in a direction vertical to the temperature gradient.
16. A method, comprising:
receiving an energy beam at a semiconductor thin film;
forming a light-shielded region on the semiconductor thin film with a gate electrode formed on the semiconductor thin film; and
growing a crystal in a direction with the light-shielded region of the semiconductor thin film as a starting point.
17. The method of claim 16 , wherein the gate electrode has a width of at least 0.3 μm.
18. The method of claim 16 , wherein the applying the energy includes applying the energy beam with one pulse irradiation; and
in response to the receiving the energy beam with one pulse irradiation, concurrently melting and re-crystallizing surfaces of the semiconductor thin film.
19. The method of claim 16 , further comprising:
creating a local temperature gradient in the light-shielded region of at least 300° C./μm, wherein the growing comprises growing the crystal in a direction of the temperature gradient; and
at least partially inhibiting the growing of the crystal in a direction vertical to the temperature gradient.
20. The method of claim 16 , wherein the receiving the energy beam includes receiving the energy beam at the light-shielded region with an intensity gradient of at least 220 mJ/cm2/μm.
21. A system, comprising:
means for applying an energy beam to a semiconductor thin film;
means for forming a light shielded region on the semiconductor thin film with a gate electrode formed on the semiconductor thin film; and
means for causing a crystal to grow in a direction with the light-shielded region of the semiconductor thin film as a starting point.
22. The system of claim 21 , wherein the gate electrode has a width of at least 0.3 μm.
23. The system of claim 21 , wherein the means for applying the energy includes:
means for applying the energy beam with one pulse irradiation; and
means for concurrently melting and re-crystallizing surfaces of the preformed semiconductor thin film.
24. The system of claim 21 , further comprising:
means for creating a local temperature gradient in the light-shielded region of at least 300° C./μm, wherein the means for causing the crystal to grow comprises means for causing the crystal to grow in a first direction of the temperature gradient; and
means for at least partially inhibiting growth of the crystal in a second direction vertical to the temperature gradient.
25. The system of claim 21 , wherein the means for applying the energy includes means for applying the energy beam to the light-shielded region with an intensity gradient of at least 220 mJ/cm2/μm.