IP Library Granted Patent US 8,749,772
Granted Patent B2
US 8,749,772 · App. 13/383,406 · Granted Jun 10, 2014

Integrated photodiode wavelength monitor

Inventors: Giacinto Busico (Northampton, GB); Neil David Whitbread (Northampton, GB); Andrew John Ward (Northampton, GB); Andrew Moseley (Northamptonshire, GB)
Assignee: Oclaro Technology Limited
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Quick Facts
Patent No.
US 8,749,772
App. No.
13/383,406
Granted
Jun 10, 2014
Kind
B2
Abstract

An optical wavelength monitor photodiode integrated on a wafer and/or an optical device and coupled to optical components thereof provides wavelength measurement. The optical wavelength monitor includes a photodiode configured to output a signal that is representative of a wavelength of the light. An additional photodiode may be included in the optical wavelength monitor, each photodiode differing from the other in operating characteristics. The monitor may be used in testing the optical device while in wafer form and when the optical device has been cleaved from the wafer at the bar level. Testing/monitoring of the optical device may also be performed during use, for example, to control the wavelength of a laser such as a tunable laser.

Claims (24)

1. A wafer including:

a plurality of optical devices separable by cleaving, each optical device including a light source including a waveguide, and each light source being configured to output light; and

at least one optical wavelength monitor including a photodiode, the optical wavelength monitor being configured to output a signal that is representative of a wavelength of the light output by the light source of at least one optical device included on the wafer,

wherein at least a portion of the optical wavelength monitor is arranged on the wafer to remain on at least one of, selected from a group consisting of: an adjacent optical device and a discardable portion of the wafer subsequent to cleaving.

2. The wafer of claim 1 , wherein the photodiode includes a semiconductor material having a band-gap wavelength that is shorter than the wavelength of the light output through the waveguide.

3. The wafer of claim 1 , wherein the photodiode is configured to absorb a portion of the light output from the light source, the absorption being wavelength dependent.

4. The wafer of claim 1 , wherein the wavelength monitor includes an additional photodiode configured to output an additional signal that is representative of the wavelength of the light, wherein the outputs of the photodiodes respond differently to wavelength.

5. The wafer of claim 1 , wherein the wavelength monitor includes an additional photodiode configured to output an additional signal that is representative of the total optical power of the light.

6. The wafer of claim 4 , wherein the photodiode and the additional photodiode are arranged in series along the waveguide.

7. The wafer of claim 6 , wherein the photodiode is arranged within the light source and the additional photodiode is coupled to the light source.

8. The wafer of claim 4 , wherein

the integrated wavelength monitor includes a splitter; and

the photodiode and the additional photodiode are arranged in parallel along the waveguide.

9. A method of manufacturing and testing an optical device among a plurality of optical devices on a wafer, the method including:

forming a plurality of optical devices on the wafer, each optical device including a light source including a waveguide, and each light source being configured to output light;

forming at least one optical wavelength monitor including a photodiode, the optical wavelength monitor being configured to output a signal that is representative of a wavelength of the light output by the light source of at least one optical device included on the wafer;

monitoring the light output from the light source at the optical wavelength monitor;

outputting a signal from the optical wavelength monitor that is representative of the wavelength of the light; and then

cleaving the optical devices from the wafer,

wherein at least a portion of the optical wavelength monitor is arranged on the wafer to remain on at least one of, selected from a group consisting of: an adjacent optical device and a discardable portion of the wafer subsequent to cleaving.

10. The method of claim 9 , wherein the photodiode is configured to absorb a portion of the light output from the light source, the absorption being wavelength dependent.

11. The method of claim 9 , wherein the wavelength monitor includes an additional photodiode configured to output an additional signal that is representative of the wavelength of the light, wherein the outputs of the photodiodes respond differently to wavelength.

12. The method of claim 9 , wherein the wavelength monitor includes an additional photodiode configured to output an additional signal that is representative of the total optical power of the light.

13. The method of claim 9 , wherein monitoring is performed over a range of wavelengths.

Assignments (4)
CHANGE OF NAME Recorded Jul 17, 2019
From: OCLARO TECHNOLOGY LIMITED
To: LUMENTUM TECHNOLOGY UK LIMITED
Reel/Frame 049783/0871 →
RELEASE OF SECURITY INTEREST Recorded May 9, 2017
From: SILICON VALLEY BANK
To: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
Reel/Frame 042430/0235 →
SECURITY INTEREST Recorded Apr 2, 2014
From: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
To: SILICON VALLEY BANK
Reel/Frame 032589/0948 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2012
From: BUSICO, GIACINTO; WHITBREAD, NEIL DAVID; WARD, ANDREW JOHN; MOSELEY, ANDREW
To: OCLARO TECHNOLOGY LIMITED
Reel/Frame 027833/0719 →
Continuity (2)
Provisional Application 61224933 · Jul 13, 2009
Related Publication 20120162648A1 · Jun 28, 2012