Semiconductor device having cell capacitors

1. A semiconductor device comprising:

a substrate;

first and second electrodes formed on the substrate arranged in a first direction, the first and second electrodes being included in a first cell transistor;

a first contact plug having bottom and top surfaces, the bottom surface thereof being in contact with the first electrode;

a second contact plug having bottom, first side and top surfaces, the bottom surface thereof being in contact with the second electrode;

a first insulation film formed on the top surfaces of the first and second contact plugs;

a bit line formed on the first insulation film, the bit line extending in the first direction;

a bit line contact plug formed through the first insulation film so as to connect the bit line and the top surface of the first contact plug;

a first cell capacitor including a first lower electrode, the first lower electrode and the bit line being arranged in a second direction different from the first direction;

a second insulation film arranged between the bit line and the first lower electrode so as to insulate from each other; and

a first contact conductor connecting the first lower electrode to the first side surface of the second contact plug.

2. The semiconductor device as claimed in claim 1 , wherein

the second contact plug further has a second side surface,

the first cell capacitor further includes a second lower electrode, the bit line being arranged between the first and second lower electrodes in the second direction, and

the semiconductor device further comprises:

a third insulation film arranged between the bit line and the second lower electrode so as to insulate from each other; and

a second contact conductor connecting the second lower electrode to the second side surface of the second contact plug.

3. The semiconductor device as claimed in claim 2 , wherein

each of the first and second lower electrodes has a plate-shaped,

the first contact conductor has a bended shape to connect a bottom end of the first lower electrode to the first side surface of the second contact plug, and

the second contact conductor has a bended shape to connect a bottom end of the second lower electrode to the second side surface of the second contact plug.

4. The semiconductor device as claimed in claim 2 , wherein

the first cell capacitor further includes:

an upper electrode covering the first and second lower electrodes; and

a capacitor insulation film provided between the first and second lower electrodes and the upper electrode, and

the semiconductor device further comprises a fourth insulation film formed on the bit line so as to insulate the bit line from the upper electrode.

5. The semiconductor device as claimed in claim 1 , further comprising:

a first word line arranged between the first and second contact plugs and extending in the second direction; and

a first gate insulation film arranged between the first word line and the substrate.

6. The semiconductor device as claimed in claim 2 , further comprising:

a third electrode formed on the substrate, the first to third electrodes being arranged in the first direction so that the first electrode is arranged between the second and third electrodes, the first and third electrodes being included in a second cell transistor;

a third contact plug having bottom, first side, second side and top surfaces, the bottom surface thereof being in contact with the third electrode;

a second cell capacitor including third and fourth lower electrodes, the bit line being arranged between the third and fourth lower electrodes in the second direction;

a fifth insulation film arranged between the bit line and the third lower electrode so as to insulate from each other;

a sixth insulation film arranged between the bit line and the fourth lower electrode so as to insulate from each other;

a third contact conductor connecting the third lower electrode to the first side surface of the third contact plug; and

a fourth contact conductor connecting the fourth lower electrode to the second side surface of the third contact plug.

7. The semiconductor device as claimed in claim 6 , wherein

each of the first to fourth lower electrodes has a plate-shaped,

the first contact conductor has a bended shape to connect a bottom end of the first lower electrode to the first side surface of the second contact plug,

the second contact conductor has a bended shape to connect a bottom end of the second lower electrode to the second side surface of the second contact plug,

the third contact conductor has a bended shape to connect a bottom end of the third lower electrode to the first side surface of the third contact plug, and

the fourth contact conductor has a bended shape to connect a bottom end of the fourth lower electrode to the second side surface of the third contact plug.

8. The semiconductor device as claimed in claim 6 , further comprising:

an upper electrode covering the first to fourth lower electrodes;

a capacitor insulation film provided between the first to fourth lower electrodes and the upper electrode; and

a fourth insulation film formed on the bit line so as to insulate the bit line from the upper electrode.

9. The semiconductor device as claimed in claim 6 , comprising:

a first word line arranged between the first and second contact plugs and extending in the second direction;

a first gate insulation film arranged between the first word line and the substrate;

a second word line arranged between the first and third contact plugs and extending in the second direction; and

a second gate insulation film arranged between the second word line and the substrate.