IP Library Granted Patent US 8,274,763
Granted Patent B2
US 8,274,763 · App. 13/420,474 · Granted Sep 25, 2012

Magnetoresistive sensor having a quantum well structure and a P-doped trapping layer to prevent surface charge carriers from migrating to the quantum well structure

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Quick Facts
Patent No.
US 8,274,763
App. No.
13/420,474
Granted
Sep 25, 2012
Kind
B2
Abstract

A Lorentz Magnetoresistive sensor having an ultrathin trapping layer disposed between a quantum well structure and a surface of the sensor. The trapping layer prevents charge carriers from the surface of the sensor from affecting the quantum well structure. This allows the quantum well structure to be formed much closer to the surface of the sensor, and therefore, much closer to the magnetic field source, greatly improving sensor performance. A Lorentz Magnetoresistive sensor having a top gate electrode to hinder surface charge carriers diffusing into the quantum well, said top gate electrode being either a highly conductive ultrathin patterned metal layer or a patterned monoatomic layer of graphene.

Claims (24)

1. A magnetoresistive sensor, comprising:

a quantum well structure that includes first and second barrier layers and an active layer sandwiched between the first and second barrier layers, the second barrier layer being nearer to a surface of the sensor than the first barrier layer is; and

a p-doped layer formed within the second barrier layer, the p-doped layer acting as a trapping layer to prevent migration of surface charge carriers to the active layer of the quantum well structure.

2. The magnetoresistive sensor as in claim 1 wherein the second barrier layer comprises Be delta doped AlSb.

3. The magnetoresistive sensor as in claim 1 wherein the p-doped layer is about 5 nm from the active layer and about 15 nm from the surface of the sensor.

4. The magnetoresistive sensor as in claim 1 wherein the p-doped layer is in a portion of the second barrier layer that is closest to the surface of the sensor.

5. The magnetoresistive sensor as in claim 1 wherein the second barrier layer comprises p-doped AlSb.

6. The magnetoresistive sensor as in claim 1 wherein the second barrier layer comprises AlSb and the p-doped layer is doped with Si or Be.

7. The magnetoresistive sensor as in claim 1 wherein the p-doped layer is an ion implanted layer.

8. The magnetoresistive sensor as in claim 1 further comprising, a capping layer located between the second barrier layer and the surface of the sensor.

9. The magnetoresistive sensor as in claim 1 further comprising a capping layer comprising InAs located between the second barrier layer and the surface of the sensor.

10. The magnetoresistive sensor as in claim 1 further comprising a metal gate electrode formed at the surface of the sensor.

11. The magnetoresistive sensor as in claim 1 further comprising a graphene gate electrode formed at the surface of the sensor.

12. The magnetoresistive sensor as in claim 1 wherein each of the first and second barrier layers comprises AlSb and the active layer comprises InAs.

13. The magnetoresistive sensor as in claim 1 further comprising a biased gate electrode formed at the surface of the sensor and patterned to define a modulation of a sheet carrier density in the quantum well.

14. A magnetoresistive sensor, comprising:

a quantum well structure that includes first and second barrier layers and an active layer sandwiched between the first and second barrier layers; and

a capping layer disposed between the quantum well structure and a surface, the capping layer including an intercalated p-doped layer.

15. The magnetoresistive sensor as in claim 14 wherein the capping layer comprises InAs.

16. The magnetoresistive sensor as in claim 14 wherein the capping layer comprises In As and each of the barrier layers comprises AlSb.

17. The magnetoresistive sensor as in claim 14 wherein each of the first and second barrier layers comprises AlSb and the active layer comprises InAs.

18. The magnetoresistive sensor as in claim 14 further comprising a metal gate electrode located at the surface of the sensor.

19. The sensor as in claim 14 further comprising a graphene gate electrode located at the surface of the sensor.

20. The magnetoresistive sensor as in claim 14 further comprising a biased gate electrode formed at the surface of the sensor and patterned to define a modulation of a sheet carrier density in the quantum well.

Assignments (7)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 052915 FRAME 0566 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
SECURITY INTEREST Recorded Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040826/0327 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2012
From: GURNEY, BRUCE ALVIN; MARINERO, ERNESTO E.
To: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
Reel/Frame 028760/0414 →