Method of manufacturing semiconductor device

1. A method of manufacturing a semiconductor device, comprising:

bonding a first principal surface of a substrate to a supporting substrate through a light-to-heat conversion film wherein there is a portion of the light-to-heat conversion film which extends beyond the bonded substrate on the supporting substrate; and then

selectively removing only the portion of the light-to-heat conversion film exposed on the supporting substrate.

2. The method according to claim 1 , further comprising:

grinding a second principal surface facing the first principal surface of the substrate in a thickness direction thereof, after bonding the substrate to the supporting substrate; and

cleaning the substrate, after the grinding the second principal surface of the substrate;

wherein the grinding the second principal surface of the substrate comprises finally polishing the second principal surface of the substrate by a chemical-mechanical polishing method, and

wherein the selectively removing the portion of the light-to-heat conversion film exposed on the supporting substrate is performed before or in the cleaning the substrate.

3. The method according to claim 1 , further comprising:

polishing a second principal surface facing the first principal surface of the substrate in a thickness direction thereof by a chemical-mechanical polishing method,

wherein the selectively removing the portion of the light-to-heat conversion film exposed on the supporting substrate comprises polishing the, substrate by the chemical-mechanical polishing method.

4. The method according to claim 3 ,

wherein in the polishing the substrate by the chemical-mechanical polishing method, a mixture solution of a first aqueous solution containing silicon dioxide and an organic compound and a second aqueous solution containing inorganic salt is used as a slurry, the first aqueous solution having a pH value of 8 or larger but not larger than 12, the second aqueous solution having a pH value of 10 or larger but not larger than 14, and

the substrate is polished by the chemical-mechanical polishing method using a polishing pad having a compressive elasticity modulus of 70% or higher but not higher than 90%.

5. The method according to claim 2 , further comprising selectively irradiating a laser to the portion of the light-to-heat conversion film exposed on the supporting substrate, after the bonding the substrate to the supporting substrate and before the cleaning the substrate,

wherein the selectively removing the portion of the light-to-heat conversion film exposed on the supporting substrate comprises:

selectively irradiating the laser to the portion of the light-to-heat conversion film exposed on the supporting substrate; and

performing at least one step of the grinding the second principal surface of the substrate and the cleaning the substrate.

6. The method according to claim 5 ,

wherein in the selectively irradiating the laser to the portion of the light-to-heat conversion film exposed on the supporting substrate, the laser is irradiated from a side of the second principal surface of the substrate toward a surface of the supporting substrate by using the substrate as a mask.

7. The method according to claim 6 ,

wherein the selectively irradiating the laser to the portion of the light-to-heat conversion film exposed on the supporting substrate is performed before the grinding the second principal surface of the substrate.

8. The method according to claim 5 ,

wherein in the selectively irradiating the laser to the portion of the light-to-heat conversion film exposed on the supporting substrate, the laser is irradiated toward a surface of the supporting substrate by using a protective member arranged in a position between the substrate and a light source of the laser and corresponding to a position of the substrate as a mask.

9. The method according to claim 8 ,

wherein the supporting substrate includes glass transmissive to the laser, and

in the selectively irradiating the laser to the portion of the light-to-heat conversion film exposed on the supporting substrate, the laser is irradiated from a surface on an opposite side of a surface of the supporting substrate to which the substrate is bonded, toward the surface of the supporting substrate.

10. The method according to claim 5 ,

wherein the grinding the second principal surface of the substrate comprises finally polishing the second principal surface of the substrate by a chemical-mechanical polishing method,

in the polishing the substrate by the chemical-mechanical polishing method, a mixture solution of a first aqueous solution containing silicon dioxide and an organic compound and a second aqueous solution containing inorganic salt is used as a slurry, the first aqueous solution having a pH value of 8 or larger but not larger than 12, the second aqueous solution having a pH value of 10 or larger but not larger than 14, and

the substrate is polished by the chemical-mechanical polishing method using a polishing pad having a compressive elasticity modulus of 70% or higher but not higher than 90%.

11. The method according to claim 2 ,

wherein the selectively removing the portion of the light-to-heat conversion film exposed on the supporting substrate is selectively coating a first chemical on the portion of the light-to-heat conversion film exposed on the supporting substrate, to selectively remove the portion of the light-to-heat conversion film.

12. The method according to claim 2 , further comprising selectively coating a first chemical on the portion of the light-to-heat conversion film exposed on the supporting substrate, after the bonding the substrate to the supporting substrate and before the cleaning the substrate,

wherein the selectively removing the portion of the light-to-heat conversion film exposed on the supporting substrate comprises:

selectively coating the first chemical on the portion of the light-to-heat conversion film exposed on the supporting substrate; and

performing at least one step of the grinding the second principal surface of the substrate and the cleaning the substrate.

13. The method according to claim 11 ,

wherein the first chemical is a chemical including ammonia and a hydrogen peroxide aqueous solution.

14. The method according to claim 2 ,

wherein the method further comprises, before the bonding the substrate to the supporting substrate:

forming an interlayer insulating film on the first principal surface of the substrate;

forming part of a through silicon via plug, so as to penetrate through part of the interlayer insulating film; and

grinding an outer circumferential portion of the substrate, so that a diameter of the substrate becomes smaller than a diameter of the supporting substrate, and

wherein the method further comprises forming a remaining part of the through silicon via plug, so as to penetrate through a protective film, the substrate, and a remaining part of the interlayer insulating film and so as to connect to the part of the through silicon via plug from a side of the second principal surface of the substrate, after the forming the protective film on the second principal surface of the substrate.

15. The method according to claim 14 , further comprising forming an insulating ring extending from a side of the first principal surface of the substrate in the thickness direction thereof and surrounding a predetermined region of the substrate positioned below the part of the through silicon via plug, before the forming the interlayer insulating film,

wherein in the forming the remaining part of the through silicon via plug, the remaining part of the through silicon via plug is formed so as to penetrate through the protective film, the predetermined region of the substrate, and the remaining part of the interlayer insulating film.

16. The method according to claim 14 ,

wherein in the forming the remaining part of the through silicon via plug, an insulating film is further formed so as to cover the protective film, the substrate, and a sidewall of the remaining part of the through silicon via plug buried in the remaining part of the interlayer insulating film.