Semiconductor device and a method for producing semiconductor device

1. A method for producing semiconductor device comprising:

performing a first exposure of a photoresist film formed on a semiconductor wafer via an exposure mask;

performing a second exposure of the photoresist film via the exposure mask; and

performing a third exposure of the photoresist film via the exposure mask, wherein:

a second shot region projected onto the photoresist film by the second exposure is adjacent in a first direction to a first shot region projected onto the photoresist film by the first exposure, and a third shot region projected onto the photoresist film by the third exposure is adjacent in the first direction to the second shot region;

the exposure mask is such that a shot region projected on the semiconductor wafer by one exposure has a rectangular form;

the shot region includes a peripheral scribe region disposed at peripheral portion of the shot region and a chip region disposed inside the peripheral scribe region;

the peripheral scribe region has a first side and a second side opposite to each other and crossing the first direction, and a third side and a fourth side opposite to each other and parallel to the first direction;

a first pattern is disposed on the first side, and a second pattern is disposed on the second side at a position opposite to the first pattern;

the photoresist film is of positive type, and the first pattern is formed as a light shielding pattern while the second pattern is formed as a light transmitting region with a size to contain the first pattern, or

the photoresist film is of negative type, and the first pattern is formed as a light transmitting pattern while the second pattern is formed as a light transmitting region with a size to contain the first pattern;

the first exposure and the second exposure are performed in such a manner that the first shot region and the second shot region do not overlap each other and that the first pattern of either of the first shot region and the second shot region and the second pattern of the other of the first shot region and the second shot do not overlap each other; and

the second exposure and the third exposure are performed in such a manner that the first pattern of either of the second shot region and the third shot region and the second pattern of the other of the second shot region and the third shot region overlap each other.

2. The method for producing semiconductor device according to claim 1 , wherein:

the second exposure is performed in succession to the first exposure, and the third exposure is performed in succession to the second exposure;

the second exposure is performed in such a manner that the second pattern transferred by the second exposure does not overlap with the first pattern transferred to the photoresist film by the first exposure; and

the third exposure is performed in such a manner that the second pattern transferred by the third exposure overlaps with the first pattern transferred to the photoresist film by the second exposure.

3. The method for producing semiconductor device according to claim 1 , wherein:

the second exposure is performed in succession to the third exposure, and the first exposure is performed in succession to the second exposure;

the second exposure is performed in such a manner that the second pattern transferred by the second exposure overlaps with the first pattern transferred to the photoresist film by the third exposure; and

the first exposure is performed in such a manner that the second pattern transferred by the first exposure does not overlap with the first pattern transferred to the photoresist film by the second exposure.

4. The method for producing semiconductor device according to claim 1 , wherein:

the second exposure is performed in succession to the first exposure, and the third exposure is performed in succession to the second exposure;

the second exposure is performed in such a manner that the first pattern transferred by the second exposure does not overlap with the second pattern transferred to the photoresist film by the first exposure; and

the third exposure is performed in such a manner that the first pattern transferred by the third exposure overlaps with the second pattern transferred to the photoresist film by the second exposure.

5. The method for producing semiconductor device according to claim 1 , wherein:

the second exposure is performed in succession to the third exposure, and the first exposure is performed in succession to the second exposure;

the second exposure is performed in such a manner that the first pattern transferred by the second exposure overlaps with the second pattern transferred to the photoresist film by the third exposure; and

the first exposure is performed in such a manner that the first pattern transferred by the first exposure does not overlap with the second pattern transferred to the photoresist film by the second exposure.

6. The method for producing semiconductor device according to claim 1 , wherein the first exposure and the second exposure are performed in a state where the first shot region and the second shot region contact each other.

7. The method for producing semiconductor device according to claim 1 , wherein the first exposure and the second exposure are performed in a state where an edge of the first shot region on the second shot region side and an edge of the second shot region on the first shot region side are apart from each other by a distance equal to a width of the chip region.

8. The method for producing semiconductor device according to claim 1 , wherein the first shot region is disposed at a position crossing an edge of the semiconductor wafer.

9. The method for producing semiconductor device according to claim 1 , further comprising using a resist pattern formed by developing the photoresist film to which the first pattern is transferred by the first exposure and the second exposure, as a mask, to pattern a first film formed below the photoresist film, thereby forming a mark.

10. The method for producing semiconductor device according to claim 9 , wherein the first film is formed of wiring material.

11. The method for producing semiconductor device according to claim 9 , wherein

the first exposure, the second exposure and the third exposure are included in exposures performed for forming multiple semiconductor chips on the semiconductor wafer,

further comprising

specifying a reference chip among the multiple semiconductor chips on the basis of the mark.

12. The method for producing semiconductor device according to claim 11 , further comprising specifying the other chips among the multiple semiconductor chips on the basis of the reference chip, and testing the multiple semiconductor chips.

13. A semiconductor device comprising:

multiple chip regions formed on a semiconductor wafer and disposed in one direction;

gaps formed between the chip regions respectively adjacent to each other; and

a mark,

wherein:

a first gap between a first chip region among the multiple chip regions and a second chip region inside the semiconductor wafer and adjacent to the first chip region has a first width, and a second gap between the first chip region and a third chip region outside the semiconductor wafer and adjacent to the first chip region has a second width wider than the first width; and

the mark is formed on the second gap, and is not formed on the first gap.

14. A method for producing semiconductor device comprising:

preparing a semiconductor wafer which comprises

multiple chip regions formed on a semiconductor wafer and disposed in one direction,

gaps formed between the chip regions respectively adjacent to each other, and

a mark,

wherein

a first gap between a first chip region among the multiple chip regions and a second chip region inside the semiconductor wafer and adjacent to the first chip region has a first width, and a second gap between the first chip region and a third chip region outside the semiconductor wafer and adjacent to the first chip region has a second width wider than the first width, and

the mark is formed on the second gap, and is not formed on the first gap; and

specifying a reference chip region among the multiple chip regions on the basis of the mark.

15. The method for producing semiconductor device according to claim 14 , further comprising:

specifying the other chip regions among the multiple chip regions on the basis of the reference chip region; and

testing the multiple chip regions.