NONVOLATILE STORAGE DEVICE
A nonvolatile storage device includes a tunnel insulating film disposed on a surface of a semiconductor substrate and a charge trap layer disposed in contact with an upper surface of the tunnel insulating film. The charge trap layer includes a second charge trap film disposed in contact with the upper surface of the tunnel insulating film and a first charge trap film disposed in contact with an upper surface of the second charge trap film.
1 . A nonvolatile storage device comprising:
a tunnel insulating film disposed on a surface of a semiconductor substrate; and
a charge trap layer disposed in contact with an upper surface of the tunnel insulating film, the charge trap layer including a second charge trap film disposed in contact with the upper surface of the tunnel insulating film and a first charge trap film disposed in contact with an upper surface of the second charge trap film.
2 . The nonvolatile storage device according to claim 1 , further comprising:
a control gate insulating film disposed in contact with an upper surface of the first charge trap film;
a control gate electrode disposed in contact with an upper surface of the control gate insulating film; and
a first metal silicide film disposed in contact with an upper surface of the control gate electrode.
3 . The nonvolatile storage device according to claim 2 ,
wherein the second charge trap film is formed of a second silicon nitride film, and
the first charge trap film is formed of a first silicon nitride film.
4 . The nonvolatile storage device according to claim 3 ,
wherein an optical absorption coefficient of the second silicon nitride film derived from spectroscopic ellipsometry is smaller than an optical absorption coefficient of the first silicon nitride film derived from spectroscopic ellipsometry.
5 . The nonvolatile storage device according to claim 3 ,
wherein an optical absorption coefficient of the second silicon nitride film derived from spectroscopic ellipsometry ranges from 0 to 0.20, and
an optical absorption coefficient of the first silicon nitride film derived from spectroscopic ellipsometry ranges from 0.6 to 1.26.
6 . The nonvolatile storage device according to claim 1 ,
wherein the second charge trap film has a thickness ranging from 0.1 to 2.0 nm, and
the first charge trap film has a thickness ranging from 12 to 15 nm.
7 . The nonvolatile storage device according to claim 1 ,
wherein the tunnel insulating film is formed of a silicon oxide film having a thickness ranging from 0.5 to 2.0 nm.
8 . The nonvolatile storage device according to claim 2 ,
wherein the control gate insulating film is formed of a silicon oxide film having a thickness ranging from 3.0 to 7.0 nm.
9 . The nonvolatile storage device according to claim 2 ,
wherein the tunnel insulating film (O), the charge trap layer (N) including the second charge trap film and the first charge trap film, the control gate insulating film (O), the first metal silicide film, and the control gate electrode (S) form a SONO structure, and
a sidewall of the SONO structure is covered with a sidewall insulating film.
10 . The nonvolatile storage device according to claim 9 , further comprising:
an isolation region provided in the semiconductor substrate; and
a plurality of active regions surrounded by the isolation region, the active regions extending in a first direction and being arranged and aligned in a second direction perpendicular to the first direction,
wherein the nonvolatile storage device comprises a plurality of the SONO structures each of which is arranged and aligned in the first direction on each of the active regions.
11 . The nonvolatile storage device according to claim 10 ,
wherein an impurity diffusion layer is provided in a surface of each of the active regions between the SONO structures adjacent in the first direction, and
a second metal silicide film is further provided on an upper surface of the impurity diffusion layer.
12 . The nonvolatile storage device according to claim 11 , further comprising
an interlayer insulating film that covers the SONO structures,
wherein a bit-line contact plug is connected to the upper surface of the impurity diffusion layer located at one end of each of the active regions, in order to penetrate through the interlayer insulating film.
13 . The nonvolatile storage device according to claim 12 , further comprising:
a bit line connected to an upper surface of the bit-line contact plug, the bit line being disposed on the interlayer insulating film and extending in the first direction.