IP Library Granted Patent US 9,034,197
Granted Patent B2
US 9,034,197 · App. 13/615,131 · Granted May 19, 2015

Method for separately processing regions on a patterned medium

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Quick Facts
Patent No.
US 9,034,197
App. No.
13/615,131
Granted
May 19, 2015
Kind
B2
Abstract

The disclosure relates generally to a method for fabricating a patterned medium. The method includes providing a substrate with an exterior layer under a lithographically patterned surface layer, the lithographically patterned surface layer comprising a first pattern in a first region and a second pattern in a second region, applying a first masking material over the first region, transferring the second pattern into the exterior layer in the second region, forming self-assembled block copolymer structures over the lithographically patterned surface layer, the self-assembled block copolymer structures aligning with the first pattern in the first region, applying a second masking material over the second region, transferring the polymer block pattern into the exterior layer in the first region, and etching the substrate according to the second pattern transferred to the exterior layer in the second region and the polymer block pattern transferred to the exterior layer in the first region.

Claims (37)

1. A method for fabricating a patterned medium, comprising:

providing a substrate with an exterior layer under a lithographically patterned surface layer, the lithographically patterned surface layer comprising a first pattern in a first region and a second pattern in a second region;

applying a first masking material over the first region;

transferring the second pattern into the exterior layer in the second region;

removing the first masking material;

after transferring the second pattern into the exterior layer in the second region, forming self-assembled block copolymer structures, via annealing, over the lithographically patterned surface layer in both the first and second regions, the self-assembled block copolymer structures aligning with the first pattern in the first region and comprising a polymer block pattern;

after forming the self-assembled block copolymer structures, applying a second masking material over the second region;

transferring the polymer block pattern into the exterior layer in the first region;

removing the second masking material and the self-assembled block copolymer structures; and

etching the substrate according to the second pattern transferred to the exterior layer in the second region and the polymer block pattern transferred to the exterior layer in the first region.

2. The method of claim 1 , wherein the patterned medium is a template for fabricating other patterned media.

3. The method of claim 1 , wherein the first region is a data region and the second region is a servo region.

4. The method of claim 1 , wherein the first region is a first density data region and the second region is a second density data region.

5. The method of claim 1 , wherein the first region is a first density servo region and the second region is a second density servo region.

6. The method of claim 1 , wherein at least one of the first masking material and the second masking material comprises photo resist.

7. The method of claim 1 , wherein at least one of the first masking material and the second masking material comprises electron-beam resist.

8. The method of claim 7 , wherein the electron-beam resist comprises poly methyl-methacrylate.

9. A method for fabricating a patterned medium, comprising:

providing a substrate with an exterior layer under a lithographically patterned surface layer, the lithographically patterned surface layer comprising a first pattern in a first region and a second pattern in a second region;

applying a protective layer over the lithographically patterned surface layer;

applying a first masking material over the first region;

forming a protective layer pattern in the second region by lifting-off portions of the lithographically patterned surface layer in the second region according to the second pattern;

transferring the protective layer pattern into the exterior layer in the second region;

removing the first masking material and the protective layer;

after transferring the protective layer pattern into the exterior layer in the second region, forming self-assembled block copolymer structures, via annealing, over the lithographically patterned surface layer in both the first and second regions, the self-assembled block copolymer structures aligning with the first pattern in the first region and comprising a polymer block pattern;

after forming the self-assembled block copolymer structures, applying a second masking material over the second region;

transferring the polymer block pattern into the exterior layer in the first region;

removing the second masking material and self assembled block copolymer structures; and

etching the substrate according to the protective layer pattern transferred to the exterior layer in the second region and the polymer block pattern transferred to the exterior layer in the first region.

10. The method of claim 9 , wherein the patterned medium is a template for fabricating other patterned media.

11. The method of claim 9 , wherein the first region is a data region and the second region is a servo region.

12. The method of claim 9 , wherein the first region is a first density data region and the second region is a second density data region.

13. The method of claim 9 , wherein the first region is a first density servo region and the second region is a second density servo region.

14. The method of claim 9 , wherein at least one of the first masking material and the second masking material comprises photo resist.

15. The method of claim 9 , wherein at least one of the first masking material and the second masking material comprises electron-beam resist.

16. The method of claim 15 , wherein the electron-beam resist comprises poly methyl-methacrylate.

17. The method of claim 9 , wherein the protective layer comprises a metal.

Assignments (6)
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
RELEASE OF SECURITY INTEREST AT REEL 052915 FRAME 0566 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
SECURITY INTEREST Recorded Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040826/0327 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2012
From: LILLE, JEFFREY S.; RUBIN, KURT A.; RUIZ, RICARDO; WAN, LEI
To: HGST NETHERLANDS B.V.
Reel/Frame 028959/0338 →