Programmable metallization cells and methods of forming the same
View Patent ↗A programmable metallization cell (PMC) that includes an active electrode; a nanoporous layer disposed on the active electrode, the nanoporous layer comprising a plurality of nanopores and a dielectric material; and an inert electrode disposed on the nanoporous layer. Other embodiments include forming the active electrode from silver iodide, copper iodide, silver sulfide, copper sulfide, silver selenide, or copper selenide and applying a positive bias to the active electrode that causes silver or copper to migrate into the nanopores. Methods of formation are also disclosed.
1. A programmable metallization cell (PMC) comprising:
an active electrode;
a nanoporous layer disposed on the active electrode, the nanoporous layer formed through formation and processing of a polymer selected from: polypyrrole, poly(3-methylothiophene), and polyaniline; and
dispersed nanopores, wherein the nanopores are at least partially filled with material from the active electrode; and
an inert electrode disposed on the nanoporous layer.
2. The PMC according to claim 1 , wherein the nanopores have diameters from about 2 nm to about 200 nm.
3. The PMC according to claim 1 , wherein the nanopores have diameters from about 4 nm to about 100 nm.
4. The PMC according to claim 1 , wherein the nanopores span the entire thickness of the nanoporous layer.
5. The PMC according to claim 1 , wherein the nanopores are regularly dispersed in the dielectric material.
6. The PMC according to claim 4 , wherein the nanopores are distributed in a hexagonally arranged pattern.
7. The PMC according to claim 1 further comprising a sink layer disposed on the active electrode.
8. The PMC according to claim 7 , wherein the material that at least partially fills the nanopores came from the sink layer.
9. A programmable metallization cell (PMC) comprising:
an active electrode, the active electrode having a thickness of about 50 Å to about 5000 Å, and the active electrode comprising silver iodide (AgI), silver sulfide (AgS), silver selenide (AgSe), copper iodide (CuI), copper sulfide (CuS), or copper selenide (CuSe);
a nanoporous layer disposed on the active electrode, the nanoporous layer having a thickness of about 100 Å to about 500 Å, and wherein the nanoporous layer comprises:
a continuous dielectric material, wherein the continuous dielectric material can comprise:
polymers selected from: polypyrrole, poly(3-methylothiophene), and polyaniline; and
dispersed nanopores, wherein the nanopores have diameters from about 2 nm to about 200 nm, and wherein the nanopores are at least partially filled with material from the active electrode; and
an inert electrode disposed on the nanoporous layer, the inert electrode having a thickness of about 50 Å to about 5000 Å, and the inert electrode comprising tungsten (W), nickel (Ni), molybdenum (Mo), platinum (Pt), gold (Au), palladium (Pd), or rhodium (Rh).
10. The PMC according to claim 9 , wherein the dielectric material comprises dielectric inorganic materials selected from alumina (Al 2 O 3 ), zirconia (ZrO 2 ), titania (TiO 2 ), or mesporous silica.
11. The PMC according to claim 9 , wherein the polymer is crosslinked.
12. The PMC according to claim 9 further comprising a sink layer disposed on the active electrode.
13. The PMC according to claim 12 , wherein the sink layer comprises silver iodide (AgI), silver sulfide (AgS), silver selenide (AgSe), copper iodide (CuI), copper sulfide (CuS), or copper selenide (CuSe).
14. The PMC according to claim 13 , wherein the active electrode and the sink layer are made of the same material.
15. A programmable metallization cell (PMC) comprising:
an active electrode;
a nanoporous layer disposed on the active electrode, the nanoporous layer formed through formation and processing of diblock polymers selected from: polypyrrole, poly(3-methylothiophene), and polyaniline; and
an inert electrode disposed on the nanoporous layer.