System and method for controlling radio frequency transmissions from an electronic device

1. A printed circuit board (PCB) for an electronic circuit for a power amplifier of a wireless communication device, comprising:

a substrate;

a ground reference in the substrate;

a first location in the substrate for placement of the power amplifier;

a first pad in the substrate at the first location for a high band power input terminal of the power amplifier;

a second location in the substrate for a battery terminal for the power amplifier;

a first electrical track in the substrate providing part of an electrical connection from the first pad to the second location;

a third location in the first electrical track for placement of a first capacitor in a circuit between the first pad and the ground reference;

a second pad in the substrate at the first location for an output terminal of the power amplifier;

a second electrical track in the substrate providing part of an electrical connection from the second pad to an output filtering stage circuit for the power amplifier; and

a fourth location for placement of a 0 ohm component in the output stage,

wherein

the 0 ohm component, when populated in the output filtering stage, delays output signals from the output terminal; and

the first capacitor provides part of a low pass filter to attenuate signals from the power amplifier to the battery.

2. The PCB as claimed in claim 1 , further comprising:

a fifth location in the first electrical track for placement of a second capacitor connected in parallel to the first capacitor between the high band power input terminal and the ground reference,

wherein

the second capacitor provides part of the low pass filter to attenuate signals from the power amplifier to the battery.

3. The PCB as claimed in claim 1 , further comprising:

a third pad in the substrate at the first location for a low band power input terminal of the power amplifier;

a sixth location for a first high filter choke having a first end connected to the first electrical track and a second end connected to the second location;

a second electrical track connected to the third pad; and

a seventh location for a second high filter choke a having a first end connected to the second electrical track and a second end connected to the second location.

4. The PCB as claimed in claim 3 , further comprising:

an eighth location in the first electrical track for placement of a third capacitor connected between the sixth location and the second location.

5. The PCB as claimed in claim 4 , wherein the third capacitor provides a second low pass filter to attenuate signals over the 2 GHz frequency band.

6. The PCB as claimed in claim 1 , wherein the first capacitor attenuates signals over 2 GHz.

7. The PCB as claimed in claim 6 , wherein the first capacitor has a capacitance of 0.01 uF or 1000 pf.

8. The PCB as claimed in claim 1 , wherein the second capacitor has a capacitance of 0.01 uF or 33 pf.

9. The PCB as claimed in claim 1 , wherein:

the output filtering stage circuit comprises a first filtering module and a harmonic low pass filter, the first filtering module connected to the fourth location which is connected to the harmonic low pass filter.

10. The PCB as claimed in claim 1 , wherein the output filtering stage comprises:

a filtering stage connected to the third pad; and

a harmonic filter providing a second low pass filter having a frequency cut-off point that attenuates first order harmonics of an output signal of the power amplifier at the output terminal.

11. The PCB as claimed in claim 10 , wherein:

the fourth location is for one component for the second low pass filter; and

components for the second low pass filter are not populated in remaining locations for other components of the second low pass filter.