IP Library Granted Patent US 9,005,744
Granted Patent B2
US 9,005,744 · App. 13/751,464 · Granted Apr 14, 2015

Conductive micro-wire structure

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Quick Facts
Patent No.
US 9,005,744
App. No.
13/751,464
Granted
Apr 14, 2015
Kind
B2
Abstract

A conductive micro-wire structure includes a substrate. A plurality of spaced-apart electrically connected micro-wires is formed on or in the substrate forming the conductive micro-wire structure. The conductive micro-wire structure has a transparency of less than 75% and greater than 0%.

Claims (32)

1. A conductive micro-wire structure, comprising:

a substrate;

a plurality of spaced-apart electrically connected micro-wires formed on or in the substrate; and

wherein the conductive micro-wire structure has a transparency of less than 75% and greater than 0%.

2. The conductive micro-wire structure of claim 1 , wherein the conductive micro-wire structure has a transparency of less than 70%.

3. The conductive micro-wire structure of claim 2 , wherein the conductive micro-wire structure has a transparency of less than or equal to 65%.

4. The conductive micro-wire structure of claim 3 , wherein the conductive micro-wire structure has a transparency of less than or equal to 50%.

5. The conductive micro-wire structure of claim 4 , wherein the conductive micro-wire structure has a transparency of less than or equal to 40%.

6. The conductive micro-wire structure of claim 1 , wherein the micro-wire conductor has a conductance of less than or equal to 4 ohms per square.

7. The conductive micro-wire structure of claim 6 , wherein the micro-wire conductor has a conductance of less than or equal to 3 ohms per square.

8. The conductive micro-wire structure of claim 7 , wherein the micro-wire conductor has a conductance of less than or equal to 2 ohms per square.

9. The conductive micro-wire structure of claim 8 , wherein the micro-wire conductor has a conductance of less than or equal to 1 ohm per square.

10. The conductive micro-wire structure of claim 1 , wherein at least one of the micro-wires has a width of less than or equal to 4 microns.

11. The conductive micro-wire structure of claim 10 , wherein at least one of the micro-wires has a width of less than or equal to 3 microns.

12. The conductive micro-wire structure of claim 11 , wherein at least one of the micro-wires has a width of less than or equal to 2 microns.

13. The conductive micro-wire structure of claim 1 , wherein the spaced-apart electrically connected micro-wires include:

a plurality of spaced-apart first micro-wires extending across the substrate in a first direction;

a plurality of spaced-apart second micro-wires extending across the substrate in a second direction different from the first direction, each second micro-wire electrically connected to at least two first micro-wires.

14. The conductive micro-wire structure of claim 13 , wherein at least one of the first micro-wires has a width greater than the width of at least one of the second micro-wires.

15. The conductive micro-wire structure of claim 13 , wherein two adjacent pairs of first micro-wires are spaced apart by a distance greater than the distance spacing apart two adjacent second micro-wires.

16. The conductive micro-wire structure of claim 13 , wherein at least one of the first micro-wires has a length greater than the length of at least one of the second micro-wires.

17. The conductive micro-wire structure of claim 1 , wherein at least one of the micro-wires has a thickness greater than width.

18. The conductive micro-wire structure of claim 1 , further comprising micro-channels formed in the substrate and the micro-wires are located in the micro-channels.

19. The conductive micro-wire structure of claim 18 , wherein a cross section of one or more of the channels substantially forms a rectangle or a trapezoid.

20. The conductive micro-wire structure of claim 1 , wherein the substrate has a surface and wherein the micro-wires are formed substantially on the surface.

21. The conductive micro-wire structure of claim 1 , wherein at least one of the micro-wires is a connection micro-wire that is wider than at least some of the other micro-wires.

22. The conductive micro-wire structure of claim 21 , wherein at least one of the micro-wires that is closer to the connection micro-wire is wider than at least one of the other micro-wires that is farther from the connection micro-wire.

23. The conductive micro-wire structure of claim 21 , wherein at least two of the micro-wires closer to the connection micro-wire are more closely spaced than at least two of the micro-wires that are farther from the connection micro-wire.

24. The conductive micro-wire structure of claim 13 , wherein adjacent first micro-wires are equally spaced apart or the adjacent second micro-wires are equally spaced apart.

25. The conductive micro-wire structure of claim 13 , wherein one or more of the second micro-wires is electrically connected to only two adjacent first micro-wires.

26. The conductive micro-wire structure of claim 1 , wherein one or more of the micro-wires has straight line segments.

27. The conductive micro-wire structure of claim 1 , wherein the micro-wires form an array of aligned or offset rectangles having an aspect ratio greater than four.

Assignments (14)
NOTICE OF SECURITY INTERESTS Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 056984/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056734/0233 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056734/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056733/0681 →
RELEASE OF SECURITY INTEREST Recorded Jan 24, 2020
From: BARCLAYS BANK PLC
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST) INC.; KODAK AMERICAS LTD.; KODAK REALTY INC.; LASER PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES LTD.; NPEC INC.
Reel/Frame 052773/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; PFC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 049901/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 22, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: QUALEX, INC.; EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 050239/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (ABL) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
To: BANK OF AMERICA N.A., AS AGENT
Reel/Frame 031162/0117 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (SECOND LIEN) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
To: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
Reel/Frame 031159/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (FIRST LIEN) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC; KODAK AMERICAS, LTD.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE
Reel/Frame 031158/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Sep 5, 2013
From: CITICORP NORTH AMERICA, INC., AS SENIOR DIP AGENT; WILMINGTON TRUST, NATIONAL ASSOCIATION, AS JUNIOR DIP AGENT
To: EASTMAN KODAK COMPANY; PAKON, INC.
Reel/Frame 031157/0451 →
PATENT SECURITY AGREEMENT Recorded Apr 1, 2013
From: EASTMAN KODAK COMPANY; PAKON, INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 030122/0235 →
CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA IS MISSING 4TH INVENTOR. PREVIOUSLY RECORDED ON REEL 029911 FRAME 0838. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNORS SHOULD BE JOHN ANDREW LEBENS, DAVID PAUL TRAUERNICHT, YONGCAI WANG AND RONALD STEVEN COK. Recorded Mar 7, 2013
From: LEBENS, JOHN ANDREW; TRAUERNICHT, DAVID PAUL; WANG, YONGCAI; COK, RONALD STEVEN
To: EASTMAN KODAK COMPANY
Reel/Frame 029940/0029 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2013
From: LEBENS, JOHN ANDREW; TRAUERNICHT, DAVID PAUL; WANG, YONGCAI
To: EASTMAN KODAK COMPANY
Reel/Frame 029911/0838 →