Semiconductor device and method of manufacturing same
View Patent ↗A semiconductor device includes a substrate and a ferroelectric capacitor including a lower electrode, a ferroelectric film, and an upper electrode. The upper electrode includes a first layer formed of an oxide whose stoichiometric composition is expressed as AOx 1 and whose actual composition is expressed as AOx 2 ; a second layer formed on the first layer and formed of an oxide whose stoichiometric composition is expressed as BOy 1 and whose actual composition is expressed as BOy 2 ; and a metal layer formed on the second layer. The second layer is higher in ratio of oxidation than the first layer. The composition parameters x 1 , x 2 , y 1 , and y 2 satisfy y 2 /y 1 >x 2 /x 1 , and the second layer includes an interface layer of the stoichiometric composition formed at an interface with the metal layer. The interface layer is higher in ratio of oxidation than the rest of the second layer.
1. A semiconductor device, comprising:
a substrate; and
a ferroelectric capacitor formed on the substrate, the ferroelectric capacitor including
a lower electrode;
a ferroelectric film formed on the lower electrode;
a first conductive oxide film formed on the ferroelectric film;
a second conductive oxide film formed on the first conductive oxide film; and
a metal layer formed on the second conductive oxide film,
wherein the second conductive oxide film is crystallized, and
the second conductive oxide film includes a first region at an interface with the metal layer, and
a second region between the first region and the first conductive oxide film, and
the second region is higher in ratio of oxidation than the first conductive oxide film, and
an oxygen concentration of the second conductive oxide film is higher in the first region than in the second region.
2. The semiconductor device as claimed in claim 1 , wherein a metal element of the first conductive oxide film is equal to a metal element of the second conductive oxide film.
3. The semiconductor device as claimed in claim 1 , wherein the first and second conductive oxide films are formed of an iridium oxide.
4. The semiconductor device as claimed in claim 1 , wherein a metal element of the first conductive oxide film is different from a metal element of the second conductive oxide film.
5. The semiconductor device as claimed in claim 1 , wherein an interface between the ferroelectric film and the first conductive oxide film is flat.
6. The semiconductor device as claimed in claim 1 , wherein the first conductive oxide film includes Pb and the second conductive oxide film is substantially free of Pb.
7. The semiconductor device as claimed in claim 1 , further comprising:
an insulating film covering the ferroelectric capacitor; and
an interconnection structure formed on the insulating film,
wherein the metal layer is connected to an interconnection pattern in the interconnection structure through a contact hole.
8. The semiconductor device as claimed in claim 6 , wherein the interface between the second conductive oxide film and the metal layer is flat.