IP Library Patent Application 13759106
Patent Application
App. No. 13/759,106

CONDUCTIVE MICRO-WIRE STRUCTURE WITH OFFSET INTERSECTIONS

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Quick Facts
Patent No.
US None
App. No.
13/759,106
Abstract

A conductive micro-wire structure includes a substrate and a plurality of micro-wires formed on or in the substrate in an intersecting pattern and forming intersection corners. A portion of a first micro-wire is coincident with a portion of a second micro-wire to form a coincident portion such that the coincident portion is non-visually resolvable by the human visual system and the coincident portion has a length greater than the sum of the widths of the first and second micro-wires or has one or more rounded intersection corners.

Claims (26)

1 . A conductive micro-wire structure, comprising:

a substrate;

an array of first micro-wires arranged in a regular repeating pattern formed on or in the substrate, an array of second micro-wires arranged in a regular repeating pattern formed on or in the substrate, the array of first micro-wires intersecting with the array of second micro-wires at an angle forming intersection corners, wherein a portion of a first micro-wire is coincident with a portion of a second micro-wire to form a coincident portion such that the coincident portion has a length that is non-visually resolvable by the human visual system and the coincident portion has a length greater than the sum of the widths of the first and second micro-wires.

2 . The conductive micro-wire structure of claim 1 , wherein the substrate defines a plurality of micro-channels and wherein each of the plurality of micro-wires is located only in one micro-channel.

3 . The conductive micro-wire structure of claim 2 , wherein a cross section of at least one of the micro-channels is rectangular or trapezoidal.

4 . The conductive micro-wire structure of claim 3 wherein the depth of the rectangular micro-channel is at least 2 microns and at most 10 microns.

5 . The conductive micro-wire structure of claim 1 , wherein the substrate defines a surface and wherein the plurality of micro-wires is located in or on the surface.

6 . The conductive micro-wire structure of claim 1 wherein the micro-wires include metals or metal alloys.

7 . The conductive micro-wire structure of claim 6 wherein the metals or metal alloys include gold, silver, aluminum, titanium, copper, or tin.

8 . The conductive micro-wire structure of claim 1 wherein the micro-wires include sintered nano-particles.

9 . The conductive micro-wire structure of claim 1 wherein the substrate is a cured polymer and wherein the substrate is substantially transparent.

10 . The conductive micro-wire structure of claim 9 wherein the micro-wires are embossed in the cured polymer.

11 . The conductive micro-wire structure of claim 1 wherein the conductive micro-wire structure forms a substantially transparent electrode.

12 . The conductive micro-wire structure of claim 10 further including an electronic device having integrated circuits that control the substantially transparent electrode.

13 . The conductive micro-wire structure of claim 1 wherein the coincident portion has a length less than a predetermined viewing distance multiplied by the tangent of a predetermined human resolution angle such that the intersections of the micro-wires are not visually resolvable.

14 . A conductive micro-wire structure, comprising:

a substrate;

an array of first micro-wires arranged in a regular repeating pattern formed on or in the substrate; and

an array of second micro-wires arranged in a regular repeating pattern formed on or in the substrate intersecting with the first micro-wires and forming intersection corners; and

wherein at least one intersection corner joining one of the first micro-wires with one of the second micro-wires is rounded and has a radius of curvature greater than one quarter of the width of the first or second micro-wires.

15 . The conductive micro-wire structure of claim 14 wherein the micro-wires are embossed in the substrate.

16 . The micro-wire structure of claim 14 , wherein the radius of curvature of the one or more intersection corners has a radius of curvature greater than or equal to one third of the first or second micro-wire width.

17 . The micro-wire structure of claim 14 , wherein the radius of curvature of the one or more intersection corners has a radius of curvature greater than or equal to one half of the first or second micro-wire width.

18 . The micro-wire structure of claim 14 , wherein the width of the first micro-wire is equal to the width of the second micro-wire.

19 . The conductive micro-wire structure of claim 14 wherein the substrate is an embossed polymer.

20 . The conductive micro-wire structure of claim 1 wherein the coincident portion has one or more rounded intersection corners.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Jan 24, 2020
From: BARCLAYS BANK PLC
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST) INC.; KODAK AMERICAS LTD.; KODAK REALTY INC.; LASER PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES LTD.; NPEC INC.
Reel/Frame 052773/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; PFC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 049901/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 22, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: QUALEX, INC.; EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 050239/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (ABL) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
To: BANK OF AMERICA N.A., AS AGENT
Reel/Frame 031162/0117 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (SECOND LIEN) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
To: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
Reel/Frame 031159/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Sep 5, 2013
From: CITICORP NORTH AMERICA, INC., AS SENIOR DIP AGENT; WILMINGTON TRUST, NATIONAL ASSOCIATION, AS JUNIOR DIP AGENT
To: EASTMAN KODAK COMPANY; PAKON, INC.
Reel/Frame 031157/0451 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (FIRST LIEN) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC; KODAK AMERICAS, LTD.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE
Reel/Frame 031158/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 19, 2013
From: TRAUERNICHT, DAVID P.; LEBENS, JOHN A.; WANG, YONGCAI
To: EASTMAN KODAK COMPANY
Reel/Frame 030834/0010 →
PATENT SECURITY AGREEMENT Recorded Apr 1, 2013
From: EASTMAN KODAK COMPANY; PAKON, INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 030122/0235 →