Designing integrated circuits for high thermal reliability
Devices, systems and methods of this disclosure can provide integrated circuit devices operating above their specified operating temperate. The integrated circuit device can include functional blocks with power down circuitry and functional test blocks with built in self-test capabilities (BIST). The functional blocks can be implemented with timing constraint values to provide a timing margin for the device above a specified operation temperature. The functional test blocks can be implemented with timing constraint values that result in BIST failure when the device is operated above the specified operation temperature. As the temperature of the device rises above the operating temperature the functional test blocks can fail BIST prior to loss of functionality of the functional blocks. Upon BIST failure of the functional test blocks, circuitry in the functional blocks can be powered down to facilitate continued operation of the device with reduced functionality.
1. An integrated circuit device, comprising:
one or more functional block(s) comprising a first circuitry implemented with a first group of one or more timing constraint value(s), wherein the first group of timing constraint value(s) are specified for reliable operation of the integrated circuit device at a first temperature range;
one or more functional test block(s) associated with each of the functional block(s) comprising a second circuitry implemented with a second group of one or more timing constraint value(s), wherein the second group of timing constraint value(s) are specified at value(s) for reliable operation of the integrated circuit device at a second temperature range, wherein the second temperature range is less than the first temperature range;
a built-in self-test (BIST) circuitry implemented with the first group of timing constraint value(s) that is operable to test the one or more functional test block(s); and
an integrated circuit (IC) controller implemented with the first group of timing constraint value(s) that is operable to initiate the BIST circuitry, wherein the IC controller is further operable to receive the BIST circuitry results.
2. The integrated circuit device of claim 1 , wherein the integrated circuit device is one of a very large scale integration (VLSI) device, application specific integrated circuit (ASIC) and field programmable gate array (FPGA) device.
3. The integrated circuit device of claim 1 , wherein the first circuitry comprises one or more of combinatorial logic, sequential logic, memory, processing function, analog, and input/output (I/O).
4. The integrated circuit device of claim 3 , wherein the processing function is a digital signal processor (DSP).
5. The integrated circuit device of claim 3 , wherein the second circuitry comprises one or more of combinatorial logic, sequential logic, memory, processing function, analog, and input/output (I/O).
6. The integrated circuit device of claim 1 , wherein the integrated circuit device further comprises a power circuitry operable to power down portions of the first circuitry.
7. The integrated circuit device of claim 6 , wherein the IC controller controls the power circuitry.
8. The integrated circuit device of claim 1 , wherein the second temperature value is a maximum operating temperature specified by a manufacturer of the integrated circuit device.
9. The integrated circuit device of claim 1 , wherein the second circuitry partially replicates the first circuitry.
10. The integrated circuit device of claim 1 , wherein the second circuitry represents one or more portions of the first circuitry with the most stringent time constraint value(s).
11. A computer-implemented method, comprising:
continually testing a functional test block associated with each of one or more functional blocks within a hardware device;
powering down a circuitry in a functional block of the hardware device on test failure of an associated functional test block; and
powering up a circuitry in the functional block of the hardware device on test passage of the associated functional test block.
12. The method of claim 11 , wherein the functional block is implemented with one or more timing constraint(s) from a first group of timing constraint value(s) and the associated functional test block is implemented with one or more timing constraint value(s) from a second group of timing constraint value(s), wherein the timing constraint value(s) of the first group are more stringent than the timing constraint value(s) of the second group.
13. The method of claim 12 , wherein the one or more timing constraint value(s) from the first group of timing constraint value(s) provide a timing margin for operating the functional block above a temperature value.
14. The method of claim 13 , wherein the temperature value is a maximum operating temperature specified by a manufacturer of the integrated circuit device.
15. The method of claim 11 , wherein the method is performed by one of a very large scale integration (VLSI) device, application specific integrated circuit (ASIC) and field programmable gate array (FPGA) device.
16. A system, comprising:
a circuitry organized in one or more functional block(s) implemented with a first group of one or more timing constraint value(s), wherein a controller is operable to power down selective components of the circuitry;
one or more functional test block(s) operable to selectively replicate the circuitry implemented with a second group of one or more timing constraint value(s), wherein the second group of timing constraint value(s) are less stringent than the first group of timing constraint value(s); and
a built-in self-test (BIST) circuitry operable to test the one or more functional test block(s), wherein the BIST circuitry is implemented with the first group of timing constraint value(s);
wherein the BIST circuitry is further operable to communicate a BIST status to the controller, wherein the controller is implemented with the first group of timing constraint value(s); and
wherein the controller is further operable to initiate the BIST circuitry and selectively power down the circuitry on failure of the BIST circuitry.
17. The system of claim 16 , wherein the system is implemented by an integrated circuit device comprising one of, a very large scale integration (VLSI) device, application specific integrated circuit (ASIC) and field programmable gate array (FPGA) device.
18. The system of claim 17 , wherein the controller is implemented external to the integrated circuit device.
19. The system of claim 17 , wherein the controller powers on the circuitry after transition of the BIST status from failure to pass.
20. The system of claim 17 , wherein the first group of timing constraint value(s) provide a timing margin for operation of an integrated circuit device above a guaranteed maximum operating temperature.