MICRO-CHANNEL CONNECTION PAD
A connection-pad structure includes a substrate and a cured layer formed in the substrate. A group of intersecting micro-channels is embossed in the cured layer opposite the substrate. Each micro-channel extends from the cured-layer surface into the cured layer toward the substrate; the intersecting micro-channels form a connection pad. An electrically continuous cured electrical conductor forms an electrically continuous micro-wire in the group of intersecting micro-channels and an electrical connector is electrically connected to the cured electrical conductor.
1 . A connection-pad structure, comprising:
a substrate;
a cured layer formed in the substrate, the cured layer having a cured-layer surface opposite the substrate and a group of intersecting micro-channels embossed in the cured layer, each micro-channel extending from the cured-layer surface into the cured layer toward the substrate, wherein the intersecting micro-channels form a connection pad;
an electrically continuous cured electrical conductor forming an electrically continuous micro-wire in the group of intersecting micro-channels; and
an electrical connector electrically connected to the cured electrical conductor.
2 . The connection-pad structure of claim 1 , further including a conductive particle located in at least one of the intersecting micro-channels electrically connected to the micro-wire.
3 . The connection-pad structure of claim 2 , wherein the conductive particle extends to or above the cured-layer surface.
4 . The connection-pad structure of claim 2 , further including a plurality of conductive particles located in one or more of the intersecting micro-channels, each conductive particle electrically connected to the micro-wire.
5 . The connection-pad structure of claim 2 , wherein the conductive particle is in electrical contact with the electrical connector.
6 . The connection-pad structure of claim 14 , wherein the intersecting micro-channels each have a width that is greater than a largest diameter of the conductive particles.
7 . The connection-pad structure of claim 1 , further including a conductive paste electrically connecting the electrical connector to the micro-wire.
8 . The connection-pad structure of claim 1 , wherein the conductive paste is a solder.
9 . The connection-pad structure of claim 1 , wherein the conductive particle includes a metal, or a metal alloy.
10 . The connection-pad structure of claim 1 , further including:
a plurality of groups of intersecting micro-channels embossed in the cured layer, each micro-channel extending from the cured-layer surface into the cured layer toward the substrate, wherein each group of intersecting micro-channels forms an electrically distinct connection pad;
an electrically distinct and electrically continuous cured electrical conductor forming an electrically continuous micro-wire in the intersecting micro-channels of each connection pad; and
a plurality of electrically distinct electrical connectors, each electrically distinct electrical connector electrically connected to the cured electrical conductors in a corresponding connection pad.
11 . The connection-pad structure of claim 10 , wherein each of the intersecting micro-channels has a micro-channel width and the connection pads are spatially separated by a distance greater than the micro-channel width.
12 . The connection-pad structure of claim 10 , wherein the plurality of electrically distinct electrical connectors is part of a common electrical connection cable.
13 . The connection-pad structure of claim 10 , wherein each electrically distinct electrical connector is aligned with a connection pad.
14 . The connection-pad structure of claim 10 , further including a plurality of conductive particles, wherein a conductive particle is located in at least one intersecting micro-channel in each connection pad, each conductive particle is in electrical contact with the micro-wire of each connection pad and in electrical contact with the electrical connector corresponding to the connection pad.
15 . The connection-pad structure of claim 14 , further including at least one conductive particle electrically connected to the electrical connector that is not electrically connected to a micro-wire.
16 . The connection-pad structure of claim 15 , wherein the at least one conductive particle electrically connected to the electrical connector that is not electrically connected to a micro-wire is located on the cured-layer surface between the connection pads or between the intersecting micro-channels.
17 . The connection-pad structure of claim 14 , wherein the connection pads are spatially separated by a distance greater than a largest diameter of the conductive particles.
18 . The connection-pad structure of claim 10 , further including a conductive paste electrically connecting each electrical connector to the corresponding micro-wire.