IP Library Granted Patent US 8,921,704
Granted Patent B2
US 8,921,704 · App. 13/850,315 · Granted Dec 30, 2014

Patterned conductive polymer with dielectric patch

Inventor: Todd Mathew Spath (Hilton, NY)
Assignee: Eastman Kodak Company
H05K1/09H05K3/10
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Quick Facts
Patent No.
US 8,921,704
App. No.
13/850,315
Granted
Dec 30, 2014
Kind
B2
Abstract

A patterned conductive structure includes a transparent substrate having a substrate surface. A conductive polymer layer is formed on the substrate surface. The conductive polymer layer has electrically conductive areas and deactivated areas that are less electrically conductive than the conductive areas. The conductive areas and the deactivated areas form a conductive pattern in the polymer layer. One or more transparent dielectric patches that are less electrically conductive than the deactivated areas are formed over at least a portion of one or more deactivated areas and one or more conductive wires are formed over at least one of the dielectric patches.

Claims (27)

1. A patterned conductive structure, comprising:

a substrate having a substrate surface;

a conductive polymer layer formed on the substrate surface, the conductive polymer layer having electrically conductive areas and deactivated areas that are less electrically conductive than the conductive areas, the conductive areas and the deactivated areas forming a conductive pattern in the conductive polymer layer;

one or more dielectric patches that are less electrically conductive than the deactivated areas formed over less than all of the conductive polymer layer and over at least a portion of one or more deactivated areas; and

one or more conductive wires formed over at least one of the dielectric patches.

2. The patterned conductive structure of claim 1 , wherein at least one of the conductive wires is located only over one or more of the deactivated areas.

3. The patterned conductive structure of claim 1 , wherein at least one of the dielectric patches extends over at least a portion of one or more of the conductive areas.

4. The patterned conductive structure of claim 1 , wherein at least one of the dielectric patches extends over only one or more of the deactivated areas.

5. The patterned conductive structure of claim 1 , wherein the substrate, conductive polymer layer, or dielectric patch is transparent.

6. The patterned conductive structure of claim 1 , wherein both the conductive area and the deactivated area include conjugated polymers.

7. The patterned conductive structure of claim 1 , wherein the conjugated polymers include polyethylene dioxythiophene (PEDOT).

8. The patterned conductive structure of claim 1 , wherein both the conductive area and the deactivated area include the same conjugated polymers.

9. The patterned conductive structure of claim 1 , wherein the deactivated area includes conjugated polymers with disrupted conjugation or increased oxidation.

10. The patterned conductive structure of claim 1 , wherein the conductive area has a higher concentration of conjugated polymers than the deactivated areas.

11. The patterned conductive structure of claim 1 , wherein the dielectric patches are a polymer resin or an oxide.

12. The patterned conductive structure of claim 1 , wherein the conductive wires include silver, aluminum, carbon, or tin.

13. The patterned conductive structure of claim 1 , wherein the conductive wires include conductive particles that are sintered, welded, or agglomerated together.

14. The patterned conductive structure of claim 1 , wherein the substrate, conductive polymer layer, or dielectric patch is flexible.

15. A method of making a patterned conductive structure, comprising:

providing a substrate having a substrate surface;

providing a conductive polymer layer on the substrate surface;

pattern-wise exposing the conductive polymer layer to an agent to electrically transform portions of the conductive polymer layer to form electrically conductive areas and deactivated areas that are less electrically conductive than the conductive areas, the conductive areas and the deactivated areas forming a conductive pattern in the conductive polymer layer;

forming one or more transparent dielectric patches that are less electrically conductive than the deactivated areas over at least a portion of one or more deactivated areas; and

forming one or more conductive wires over at least one of the dielectric patches.

16. The method according to claim 15 , wherein the agent is an electrical-conductivity deactivating agent and further including pattern-wise exposing the transparent conductive polymer layer to deactivate exposed areas of the transparent conductive polymer layer so that the deactivated areas have less electrical conductivity than the areas that are not exposed.

17. The method according to claim 15 , wherein the agent is an electrical-conductivity enhancing agent and further including pattern-wise exposing the transparent conductive polymer layer to enhance the electrical conductivity of exposed areas of the transparent conductive polymer layer so that the enhanced areas have greater electrical conductivity than the areas that are not exposed.

18. The method according to claim 15 , wherein the step of forming one or more transparent dielectric patches further includes depositing a material on the conductive polymer layer.

Assignments (11)
NOTICE OF SECURITY INTERESTS Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 056984/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056734/0233 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056734/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056733/0681 →
RELEASE OF SECURITY INTEREST Recorded Jan 24, 2020
From: BARCLAYS BANK PLC
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST) INC.; KODAK AMERICAS LTD.; KODAK REALTY INC.; LASER PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES LTD.; NPEC INC.
Reel/Frame 052773/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; PFC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 049901/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 22, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 050239/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (ABL) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
To: BANK OF AMERICA N.A., AS AGENT
Reel/Frame 031162/0117 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (SECOND LIEN) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
To: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
Reel/Frame 031159/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (FIRST LIEN) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC; KODAK AMERICAS, LTD.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE
Reel/Frame 031158/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2013
From: SPATH, TODD MATHEW
To: EASTMAN KODAK COMPANY
Reel/Frame 030082/0088 →
Continuity (1)
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