IP Library Granted Patent US 8,981,408
Granted Patent B2
US 8,981,408 · App. 13/952,060 · Granted Mar 17, 2015

Light source having liquid encapsulant

Inventors: Lig Yi Yong (Penang, MY); Keat Chuan Ng (Penang, MY); Choon Guan Ko (Penang, MY)
Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
H01L33/54H01L33/58
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Quick Facts
Patent No.
US 8,981,408
App. No.
13/952,060
Granted
Mar 17, 2015
Kind
B2
Abstract

In one embodiment, a light source comprising a substrate, a die, a liquid encapsulant, an attachment member and a resilient cover configured to hold the liquid encapsulant is disclosed. At least a portion of the resilient cover is easily stretchable so as to absorb size increment of the liquid encapsulant due to thermal expansion. One other embodiment discloses a light-emitting device comprising a die, a liquid encapsulant and the resilient cover. The resilient cover may comprise a dome shaped portion, a vertical portion and a thermal joint portion. In another embodiment, a lighting apparatus having similar resilient cover is disclosed. The resilient cover may further comprise a thermal joint portion having first and second indentations for absorbing thermal expansion.

Claims (38)

1. A light source, comprising:

a substrate;

a die disposed on the substrate;

a liquid encapsulant surrounding the die;

a resilient cover configured to hold the liquid encapsulant; and

an attachment member to secure a portion of the resilient cover onto the substrate, wherein at least a portion of the resilient cover is stretchable so as to absorb size increment of the liquid encapsulant due to thermal expansion.

2. The light source of claim 1 , wherein the substrate comprises an aperture providing access to the liquid encapsulant.

3. The light source of claim 2 further comprising a seal covering the aperture.

4. The light source of claim 1 , the resilient cover comprises a lens portion, and a thermal expansion joint arranged adjacent to the lens portion to absorb thermal expansion of the liquid encapsulant such that shape and size of lens portion of the resilient cover is substantially retained when temperature changes.

5. The light source of claim 1 , wherein the liquid encapsulant is silicone oil.

6. The light source of claim 1 , wherein the resilient cover has a stress absorber that is more easily stretchable and compressible relative to other portion of the resilient cover.

7. The light source of claim 1 , wherein the liquid encapsulant is at least partially bounded by a substantially dome shaped portion of the resilient cover and wherein the substantially dome shaped portion substantially forms a convex lens.

8. The light source of claim 1 , wherein the resilient cover has a substantially flat portion to accommodate the attachment member so that the attachment member is sandwiched between the substantially flat portion of the resilient cover and the substrate.

9. A light-emitting device, comprising:

a base;

a die disposed on base;

a liquid encapsulant encapsulating the die;

a resilient cover configured to hold the liquid encapsulant, the resilient cover having a substantially dome shaped portion and a substantially flat portion; and

an attachment member configured to secure the substantially flat portion of the resilient cover onto the base,

wherein at least a portion of the resilient cover is stretchable so as to absorb size increment of the liquid encapsulant due to thermal expansion.

10. The light-emitting device of claim 9 , wherein the resilient cover comprises an indentation providing space for thermal expansion such that the substantially dome shaped portion of the resilient cover remained substantially secured.

11. The light-emitting device of claim 9 , wherein the resilient cover further comprises a thermal expansion joint.

12. The light-emitting device of claim 11 , wherein the thermal expansion joint is substantially radially symmetrical around a center axis.

13. The light-emitting device of claim 11 , wherein the attachment member is spaced apart from the liquid encapsulant with the thermal expansion joint disposed between the liquid encapsulant and the attachment member.

14. The light-emitting device of claim 9 , wherein the resilient cover further comprises a vertical portion adjoining the substantially dome shaped portion and the substantially flat portion.

15. The light-emitting device of claim 14 , wherein the substantially dome shaped portion of the resilient cover is more rigid compared to the vertical portion and the substantially flat portion of the resilient cover such the vertical portion expands or contracts in accordance to changes of temperature while that the substantially dome shaped portion retains its shape.

16. The light-emitting device of claim 9 , wherein the attachment member comprises a sealant preventing the liquid encapsulant from leaking externally.

17. A lighting apparatus, comprising:

a base, the base having a component side;

a die disposed on the component side of the base;

a resilient cover disposed on the component side of the base;

a cavity defined therein between the resilient cover and the component side of the base;

a liquid encapsulant disposed within the cavity encapsulating the die; and

an attachment member configured to seal the resilient cover onto the component side of the base such that the liquid encapsulant is retained within cavity,

wherein at least a portion of the resilient cover is stretchable so as to absorb size increment of the liquid encapsulant due to thermal expansion.

18. The lighting apparatus of claim 17 , wherein the resilient cover comprises a substantially dome shaped portion, a substantially flat portion and a thermal expansion joint portion.

19. The lighting apparatus of claim 18 , wherein the thermal expansion joint portion comprises a first indentation and a second indentation.

20. The lighting apparatus of claim 19 , wherein the first indentation is formed on an external surface of the resilient cover, and wherein the second indentation is formed on an internal surface.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047422 FRAME: 0464. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0702 →
MERGER Recorded Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047422/0464 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2013
From: YONG, LIG YI; NG, KEAT CHUAN; KO, CHOON GUAN
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030900/0713 →
Continuity (1)
Related Publication 20150028370A1 · Jan 29, 2015