Manufacturing method of semiconductor device
View Patent ↗A semiconductor device including a low-concentration impurity region formed on the drain side of an n-type MIS transistor, in a non-self-aligned manner with respect to an end portion of the gate electrode. A high-concentration impurity region is placed with a specific offset from the gate electrode and a sidewall insulating film. The semiconductor device enables the drain breakdown voltage to be sufficient and the on-resistance to decrease. A silicide layer is also formed on the surface of the gate electrode, thereby achieving gate resistance reduction and high frequency characteristics improvement.
1. A semiconductor device manufacturing method comprising:
forming a first impurity region of a first conductivity type in a first region of a substrate;
forming a first insulating film on the substrate and a gate electrode, that overlaps with an end portion of the first impurity region, on the first insulating film;
forming a second impurity region of the first conductivity type in the substrate, opposite to the first impurity region;
forming a second insulating film on a sidewall of the gate electrode and a third insulating film that is separated from the second insulating film on the first impurity region;
forming a resist on a part of the gate electrode, a part of the first impurity region located between the second insulating film and the third insulating film, and the third insulating film;
forming a third impurity region of a first conductivity type next to the first impurity region in the substrate and a fourth impurity region of the first conductivity type next to the second impurity region in the substrate using the resist as a mask, the third impurity region having an impurity concentration higher than an impurity concentration of the first region and an impurity concentration of the second impurity region, the fourth impurity region having an impurity concentration higher than the impurity concentration of the first region and the impurity concentration of the second impurity region;
forming a silicide layer on a surface of the gate electrode, a surface of the part of the first impurity region, a surface of the third impurity region and a surface of the fourth impurity region.
2. The semiconductor device manufacturing method according to claim 1 , further comprising forming a fifth impurity region of a second conductivity type, opposite to the first impurity region in the substrate before the forming of the second impurity region.
3. The semiconductor device manufacturing method according to claim 1 , further comprising forming a fifth impurity region of a second conductivity type in the substrate before the forming of the first impurity region.
4. The semiconductor device manufacturing method according to claim 1 , further comprising forming a silicide layer on a whole top surface of the gate electrode.
5. The semiconductor device manufacturing method according to claim 1 , wherein the silicide layer formed on the surface of the part of the first impurity region is separated from the silicide layer formed on the surface of the third impurity region.
6. The semiconductor device manufacturing method according to claim 1 , wherein the first impurity region is formed in a non-self-aligned manner with respect to the gate electrode so as to overlap with the end portion of the gate electrode.
7. The semiconductor device manufacturing method according to claim 1 , wherein the second impurity region is formed in a self-aligned manner with respect to the gate electrode.
8. The semiconductor device manufacture method according to claim 1 , wherein an impurity concentration of the surface of the part of the first impurity region is lower than an impurity concentration of the surface of the third impurity region.
9. The semiconductor device manufacture method according to claim 2 , wherein:
the fifth impurity region includes a first portion and a second portion below the gate electrode;
the first portion is nearer to the first impurity region than the second portion; and
an impurity concentration of the first portion is lower than an impurity concentration of the second portion.