Multi-layer micro-wire substrate structure
View Patent ↗A multi-layer micro-wire structure includes a substrate having a substrate edge. A first layer is formed over the substrate extending to a first layer edge. One or more first micro-channels are imprinted in the first layer, at least one imprinted first micro-channel having a micro-wire forming at least a portion of an exposed first connection pad in the first layer. A second layer is formed over the first layer extending to a second layer edge. One or more second micro-channels are imprinted in the second layer, at least one imprinted second micro-channel having a micro-wire forming at least a portion of an exposed second connection pad in the second layer. The second-layer edge is farther from the substrate edge than the first-layer edge for at least a portion of the second-layer edge so that the first connection pads are exposed through the second layer.
1. A multi-layer micro-wire structure, comprising:
a substrate having a substrate edge;
a first layer formed over the substrate extending to a first layer edge;
one or more first micro-channels imprinted in the first layer, at least one imprinted first micro-channel having a first micro-wire forming at least a portion of an exposed first connection pad in the first layer;
a second layer formed over the first layer extending to a second layer edge;
one or more second micro-channels imprinted in the second layer, at least one imprinted second micro-channel having a second micro-wire that is electrically separate from the first micro-wire forming at least a portion of an exposed second connection pad in the second layer, the second connection pad spatially separate from the first connection pad; and
wherein the first connection pad is exposed in a first location over the substrate, the second connection pad is exposed in a second location different from the first location over the substrate, and the second-layer edge is farther from the substrate edge than the first-layer edge for at least a portion of the second-layer edge so that the first connection pads are exposed through the second layer and the first and second connection pads can be separately electrically connected to separate wires in one or more electrical connectors.
2. The multi-layer micro-wire structure of claim 1 , wherein the first and second connection pads are arranged in a common row.
3. The multi-layer micro-wire structure of claim 1 , wherein the first and second connection pads are arranged along the substrate edge.
4. The multi-layer micro-wire structure of claim 1 , wherein the second layer has a crenellated edge.
5. The multi-layer micro-wire structure of claim 1 , wherein the second layer has a straight edge.
6. The multi-layer micro-wire structure of claim 1 , wherein the first connection pads are arranged in a row adjacent to the substrate edge, the second connection pads are arranged in a row adjacent to the first connection pads, and the first connection pads are between the substrate edge and the second connection pads.
7. The multi-layer micro-wire structure of claim 1 , wherein the substrate has a second substrate edge extending in a different direction from the substrate edge, the first connection pads are arranged in a row adjacent to the substrate edge, and the second connection pads are arranged in a row adjacent to the second substrate edge.
8. The multi-layer micro-wire structure of claim 1 , wherein the first connection pads are adjacent to each other and the second connection pads are adjacent to each other.
9. The multi-layer micro-wire structure of claim 1 , wherein the first and second connection pads alternate in a row.
10. The multi-layer micro-wire structure of claim 1 , wherein the first connection pads are aligned with the second connection pads.
11. The multi-layer micro-wire structure of claim 1 , wherein the first connection pads are offset from the second connection pads.
12. The multi-layer micro-wire structure of claim 1 , wherein the first layer edge is coincident with the substrate edge.
13. The multi-layer micro-wire structure of claim 1 , wherein a portion of the second layer edge is coincident with the substrate edge.
14. The multi-layer micro-wire structure of claim 1 , further including a connector including multiple first and second wires, at least one first wire electrically connected to one of the first connection pads and at least one second wire electrically connected to one of the second connection pads.
15. The multi-layer micro-wire structure of claim 1 , wherein the connector is a ribbon cable.
16. The multi-layer micro-wire structure of claim 1 , wherein the connector is flexible, compressible, or compliant.
17. The multi-layer micro-wire structure of claim 1 , wherein the substrate, the first layer, or the second layer is flexible, compliant, or compressible.
18. The multi-layer micro-wire structure of claim 1 , wherein a first wire is electrically connected to a first connection pad with an electrically conductive material having a first thickness, a second wire is electrically connected to a second connection pad with the electrically conductive material having a second thickness, and the first thickness is greater than the second thickness.
19. A multi-layer micro-wire structure, comprising:
a substrate having a substrate edge;
a first layer formed over the substrate extending to a first layer edge;
one or more first micro-channels imprinted in the first layer, at least one imprinted first micro-channel having a micro-wire forming at least a portion of an exposed first connection pad in the first layer;
a second layer formed over the first layer extending to a second layer edge;
one or more second micro-channels imprinted in the second layer, at least one imprinted second micro-channel having a micro-wire forming at least a portion of an exposed second connection pad in the second layer;
wherein the second-layer edge is farther from the substrate edge than the first-layer edge for at least a portion of the second-layer edge so that the first connection pads are exposed through the second layer; and
further including a third layer extending to a third-layer edge formed over the second layer, the third layer having imprinted micro-channels including micro-wires forming a plurality of exposed third connection pads; wherein the third-layer edge is farther from the substrate edge than the first- or second-layer edge for at least a portion of the first- or second-layer edge to expose the first and second connection pads.
20. The multi-layer micro-wire structure of claim 19 , wherein the third-layer edge is farther from the substrate edge than the first- and second-layer edge.