IP Library Granted Patent US 9,472,744
Granted Patent B2
US 9,472,744 · App. 14/045,091 · Granted Oct 18, 2016

System for thermoelectric energy generation

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Quick Facts
Patent No.
US 9,472,744
App. No.
14/045,091
Granted
Oct 18, 2016
Kind
B2
Abstract

A system includes a first plate and a second plate. The first plate is arranged to be thermally coupled to a first surface and the second plate is arranged to be thermally coupled to an environment. The environment has a temperature that is different than the first surface. The system also includes a thermoelectric device that includes a plurality of thermoelectric elements. The thermoelectric device includes a third plate coupled to the plurality of thermoelectric elements and thermally coupled to the first plate. The thermoelectric device also includes a fourth plate coupled to the plurality of thermoelectric elements and thermally coupled to the second plate. The system also includes a dielectric fluid arranged between the first plate and the second plate. The thermoelectric elements are submersed in the dielectric fluid.

Claims (45)

1. A system comprising:

a first plate, the first plate arranged to be thermally coupled to a first surface;

a second plate, the second plate arranged to be thermally coupled to an environment, the environment comprising a temperature that is different than the first surface;

a thermoelectric device, comprising:

a plurality of thermoelectric elements;

a third plate coupled to the plurality of thermoelectric elements and thermally coupled to the first plate;

a fourth plate coupled to the plurality of thermoelectric elements and thermally coupled to the second plate; and

dielectric fluid arranged between the first plate and the second plate, the thermoelectric elements submersed in the dielectric fluid, wherein the dielectric fluid comprises non-compressible filler.

2. The system of claim 1 , further comprising a first gasket situated within a groove of the first plate and a second gasket situated within a groove of the second plate.

3. The system of claim 1 , further comprising a wall situated between the first plate and the second plate, the wall situated around the thermoelectric device, the wall comprising thermally insulative material.

4. The system of claim 1 , further comprising a plurality of baffles situated in a plurality of spaces between thermoelectric elements of the plurality of thermoelectric elements.

5. The system of claim 1 , wherein the second plate comprises a cavity configured to house an electronic component.

6. The system of claim 1 , further comprising a fin situated on the second plate.

7. The system of claim 1 , further comprising a diaphragm situated in the second plate.

8. The system of claim 1 , wherein:

the first surface is a surface of a pipe; and

the environment is a sea water environment having over 20 psi of pressure.

9. A method comprising:

thermally coupling a first plate to a first surface;

thermally coupling a second plate to an environment, the environment comprising a temperature that is different than the first surface; and

generating electricity using a thermoelectric device based on a temperature gradient between the first plate and the second plate, the thermoelectric device comprising:

a plurality of thermoelectric elements submersed in a dielectric fluid, wherein the dielectric fluid comprises non-compressible filler;

a third plate coupled to the plurality of thermoelectric elements and thermally coupled to the first plate; and

a fourth plate coupled to the plurality of thermoelectric elements and thermally coupled to the second plate.

10. The method of claim 9 , wherein:

the first plate comprises a first gasket; and

the second plate comprises a second gasket.

11. The method of claim 9 , wherein a wall comprising thermally insulative material is situated between the first plate and the second plate, the wall situated around the thermoelectric device.

12. The method of claim 9 , wherein a plurality of spaces between thermoelectric elements of the plurality of thermoelectric elements comprise a plurality of baffles.

13. The method of claim 9 , further comprising providing electrical power to an electronic component housed in a cavity of the second plate.

14. The method of claim 9 , wherein a fin is situated on the second plate.

15. The method of claim 9 , wherein a diaphragm is situated in the second plate.

16. The method of claim 9 , wherein:

the first surface is a surface of a pipe; and

the environment is a sea water environment having over 20 psi of pressure.

17. A system comprising:

a first plate, the first plate arranged to be thermally coupled to a pipe;

a second plate, the second plate arranged to be thermally coupled to a sea water environment having over 20 psi of pressure, the temperature of the sea water environment being over 10 degrees Fahrenheit different than the first surface;

a thermoelectric device, comprising:

a plurality of thermoelectric elements;

a third plate coupled to the plurality of thermoelectric elements and thermally coupled to the first plate;

a fourth plate coupled to the plurality of thermoelectric elements and thermally coupled to the second plate;

dielectric fluid arranged between the first plate and the second plate, the thermoelectric elements submersed in the dielectric fluid, the dielectric fluid comprising non-compressible powder; and

a wall situated between the first plate and the second plate, the wall situated around the thermoelectric device, the wall comprising thermally insulative material.

18. The system of claim 17 , further comprising insulation coupled to the first plate and the second plate.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2019
From: MARLOW INDUSTRIES, INC.
To: II-VI DELAWARE, INC.
Reel/Frame 048669/0830 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2013
From: MOCZYGEMBA, JOSHUA E.
To: MARLOW INDUSTRIES, INC.
Reel/Frame 031337/0913 →