Semiconductor device

1. A semiconductor device comprising:

a silicon substrate including a first region of a first conductivity type and a second region of a second conductivity type that is in contact with the first region;

a gate electrode above the first region and the second region;

an insulation film extending from the gate electrode to the second region to cover part of the gate electrode and part of the second region;

a source region and a drain region formed in the silicon substrate,

silicide formed on the source region, on the drain region, and on the gate electrode;

an interlayer insulation film formed above the gate electrode and the insulation film;

a first electrically conductive via formed in the interlayer insulation film and electrically connecting to the source region, a second electrically conductive via formed in the interlayer insulation and electrically connecting to the drain region, and a third electrically conductive via formed in the interlayer insulation and electrically connecting to the gate electrode; and

at least one electrically conductive member formed on the insulation film in the interlayer insulation film.

2. The semiconductor device according to claim 1 , further comprising a wiring to electrically connect the first electrically conductive via and the electrically conductive member.

3. The semiconductor device according to claim 1 , further comprising a wiring to electrically connect the third electrically conductive via and the electrically conductive member.

4. The semiconductor device according to claim 1 , further comprising a gate insulation film located between the gate electrode and the silicon substrate, wherein the insulation film is larger in thickness than the gate insulation film and the bottom face of the electrically conductive member is at a higher level than that of the gate electrode.

5. The semiconductor device according to claim 1 , wherein the at least one electrically conductive member is a plurality of electrically conductive members, and the electrically conductive members are formed at positions distributed in the gate's width direction.

6. The semiconductor device according to claim 1 , wherein the electrically conductive member has the same planar shape as that of the first electrically conductive via, the second electrically conductive via, or the third electrically conductive via.

7. The semiconductor device according to claim 1 , wherein the at least one electrically conductive member is a plurality of electrically conductive members, and the electrically conductive members are formed in such a manner that two or more lines each of which includes two or more electrically conductive members aligned in a gate's width direction are arranged in a gate's length direction, and with respect to the gate's width direction, the positions of the gaps between the adjacent electrically conductive members in one line correspond to positions of the electrically conductive members in another line.

8. The semiconductor device according to claim 1 , wherein the electrically conductive member has a long and narrow planar shape elongated in the gate's width direction.