Method of focus measurement, exposure apparatus, and method of manufacturing semiconductor device

1. A method of focus measurement comprising:

projecting first and second line-and-space patterns on a substrate on which a photosensitive material is applied by irradiating first exposure light from a first direction that is displaced from an optical axis of an optical system on the first line-and-space pattern having a first pattern pitch and the second line-and-space pattern having a second pattern pitch;

projecting third and fourth line-and-space patterns on the substrate by irradiating second exposure light from a second direction that is displaced from the optical axis of the optical system on the third line-and-space pattern having the first pattern pitch and the fourth line-and-space pattern having the second pattern pitch;

calculating a sum of a dislocated amount on the substrate caused by a dislocation of focus and an overlap dislocation amount on the substrate between the first and third line-and-space patterns as a first dislocation amount by measuring a distance between the first line-and-space pattern and the third line-and-space pattern on the substrate;

calculating an overlap dislocation amount on the substrate between the second and fourth line-and-space patterns as a second dislocation amount by measuring a distance between the second line-and-space pattern and the fourth line-and-space pattern on the substrate; and

calculating the focus dislocation amount based on the first and second dislocation amounts.

2. The method of focus measurement according to claim 1 , wherein the first exposure light is emitted from a first mono-pole lighting, and the second exposure light is emitted from a second mono-pole lighting.

3. The method of focus measurement according to claim 2 , wherein a light source of the first mono-pole lighting and a light source of the second mono-pole lighting have a relationship of a two rotational symmetry with an optical axis center of the optical system as a symmetry axis.

4. The method of focus measurement according to claim 1 , wherein the first to fourth line-and-space patterns have a ratio of a line width and a space width at 1:1.

5. The method of focus measurement according to claim 1 , wherein the second pattern pitch is half the first pattern pitch.

6. The method of focus measurement according to claim 1 , wherein first lighting condition of the first exposure light and second lighting condition of the first exposure light are positions where an irradiated region of diffracted light is inscribed a numerical aperture of a lighting optical system.

7. The method of focus measurement according to claim 1 , wherein the third line-and-space pattern is formed such that positive first order diffracted light of the second exposure light matches an optical axis center of a projection lens, and negative first order diffracted light of the second exposure light does not enter within the projection lens.

8. The method of focus measurement according to claim 1 , wherein the first to fourth line-and-space patterns are formed on a reticle.

9. The method of focus measurement according to claim 1 , wherein the first to fourth line-and-space patterns are formed on a reticle stage.

10. The method of focus measurement according to claim 2 , wherein light sources of the first and second mono-pole lightings have a light source shape in a circle shape.

11. A method of manufacturing a semiconductor device, the method comprising:

projecting first and second line-and-space patterns on a first substrate on which a photosensitive material is applied by irradiating first exposure light from a first direction that is displaced from an optical axis of an optical system on the first line-and-space pattern having a first pattern pitch and the second line-and-space pattern having a second pattern pitch;

projecting third and fourth line-and-space patterns on the first substrate by irradiating second exposure light from a second direction that is displaced from the optical axis of the optical system on the third line-and-space pattern having the first pattern pitch and the fourth line-and-space pattern having the second pattern pitch;

calculating a sum of a dislocated amount on the substrate caused by a dislocation of focus and an overlap dislocation amount on the substrate between the first and third line-and-space patterns as a first dislocation amount by measuring a distance between the first line-and-space pattern and the third line-and-space pattern on the first substrate;

calculating an overlap dislocation amount on the substrate between the second and fourth line-and-space patterns as a second dislocation amount by measuring a distance between the second line-and-space pattern and the fourth line-and-space pattern on the first substrate;

calculating the focus dislocation amount based on the first and second dislocation amounts;

modifying the focus dislocation amount;

projecting a circuit pattern on a second substrate on which a photosensitive material is applied by irradiating third exposure light on the circuit pattern formed on a reticle; and

forming a resist pattern corresponding to the circuit pattern on the second substrate by developing the second substrate.

12. The method of manufacturing a semiconductor device according to claim 11 , wherein the first exposure light is emitted from a first mono-pole lighting, and the second exposure light is emitted from a second mono-pole lighting.

13. The method of manufacturing a semiconductor device according to claim 12 , wherein a light source of the first mono-pole lighting and a light source of the second mono-pole lighting have a relationship of a two rotational symmetry with an optical axis center of the optical system as a symmetry axis.