IP Library Patent Application 14191484
Patent Application
App. No. 14/191,484

MAKING MICRO-WIRE ELECTRODE STRUCTURE WITH SINGLE-LAYER DUMMY MICRO-WIRES

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Quick Facts
Patent No.
US None
App. No.
14/191,484
Abstract

A method of making a micro-wire electrode structure includes providing a substrate having a surface. A plurality of first micro-wire electrodes spatially separated by first electrode gaps is located in a first layer in relation to the surface, each first micro-wire electrode including a plurality of electrically connected first micro-wires. A plurality of electrically isolated second micro-wire electrodes in a second layer is located in relation to the surface, the second layer at least partially different from the first layer and each second micro-wire electrode including a plurality of electrically connected second micro-wires. A plurality of first gap micro-wires is located in each first electrode gap, at least some of the first gap micro-wires located in a gap layer different from the first layer, the first gap micro-wires electrically isolated from the first micro-wires.

Claims (23)

1 . A method of making a micro-wire electrode structure, comprising:

providing a substrate having a surface;

locating a plurality of first micro-wire electrodes spatially separated by first electrode gaps in a first layer in relation to the surface, each first micro-wire electrode including a plurality of electrically connected first micro-wires;

locating a plurality of electrically isolated second micro-wire electrodes in a second layer in relation to the surface, the second layer at least partially different from the first layer and each second micro-wire electrode including a plurality of electrically connected second micro-wires; and

locating a plurality of first gap micro-wires in each first electrode gap, at least some of the first gap micro-wires located in a gap layer different from the first layer, the first gap micro-wires electrically isolated from the first micro-wires.

2 . The method of claim 1 , further including locating an unpatterned conductive layer in electrical contact with the first micro-wires of the first micro-wire electrodes.

3 . The method of claim 1 , further including locating at least some of the first gap micro-wires and locating at least some of the second micro-wires in the second layer in a common step so that the at least some of the first gap micro-wires are within the second micro-wire electrodes and are electrically connected to the second micro-wires.

4 . The method of claim 1 , further including spatially separating the second micro-wire electrodes by second electrode gaps and locating a plurality of second gap micro-wires in each second electrode gap, the second gap micro-wires electrically isolated from the second micro-wires.

5 . The method of claim 4 , further including locating at least some of the second gap micro-wires and at least some of the first gap micro-wires in a common layer parallel to the surface in a common step.

6 . The method of claim 5 , further including locating at least some of the second gap micro-wires and locating at least some of the first gap micro-wires in a common step in the first layer and the first layer is the common layer.

7 . The method of claim 6 , further including locating the second micro-wires and locating at least some of the first gap micro-wires within the second micro-wire electrodes and electrically connected to the second micro-wires in a common step.

8 . The method of claim 6 , further including locating the second gap micro-wires and locating at least some of the first gap micro-wires within the second electrode gap and electrically connected to the second gap micro-wires in a common step.

9 . The method of claim 1 , further including locating the first layer between the second layer and the surface and before the second layer is located.

10 . The method of claim 9 , further including providing an unpatterned conductive layer in electrical contact with the first micro-wires of the first micro-wire electrodes before the second layer is located.

11 . The method of claim 9 , further including driving the first micro-wire electrodes with a signal and sensing the second micro-wire electrodes to provide a signal for a capacitive touch screen.

12 . The method of claim 1 , further including locating the second layer between the first layer and the surface before the first layer is located.

13 . The method of claim 12 , further including driving the second micro-wire electrodes with a signal and sensing the first micro-wire electrodes to provide a signal for a capacitive touch screen.

14 . The method of claim 1 , further including providing a display substrate or a display cover having the surface or affixing the substrate to a display and wherein the display is the source of electromagnetic radiation.

15 . The method of claim 1 , further including locating the first micro-wire electrodes extending in a first direction parallel to the surface and locating the second micro-wire electrodes extending in a second direction parallel to the surface.

16 . The method of claim 15 , wherein the first direction is orthogonal to the second direction.

17 . The method of claim 15 , further including forming a first pattern with the first micro-wires, and forming a second pattern similar to the first pattern with the second micro-wires.

18 . The method of claim 17 , wherein the first pattern is spatially offset from the second pattern in a direction parallel to the surface by a phase difference of 180 degrees.

19 . The method of claim 1 , further including locating the first micro-wire electrodes so that the first micro-wire electrodes are electrically isolated.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Jan 24, 2020
From: BARCLAYS BANK PLC
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST) INC.; KODAK AMERICAS LTD.; KODAK REALTY INC.; LASER PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES LTD.; NPEC INC.
Reel/Frame 052773/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; PFC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 049901/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 22, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 050239/0001 →
SECURITY INTEREST Recorded Mar 28, 2014
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST). INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; KODAK AVIATION LEASING LLC
To: JPMORGAN CHASE BANK, N.A. AS ADMINISTRATIVE AGENT
Reel/Frame 032552/0741 →
SECURITY INTEREST Recorded Mar 28, 2014
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; KODAK AVIATION LEASING LLC
To: BANK OF AMERICA N.A., AS AGENT
Reel/Frame 032553/0152 →
SECURITY INTEREST Recorded Mar 28, 2014
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; KODAK AVIATION LEASING LLC
To: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
Reel/Frame 032553/0398 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2014
From: COK, RONALD STEVEN
To: EASTMAN KODAK COMPANY
Reel/Frame 032308/0379 →