IP Library Patent Application 14198664
Patent Application
App. No. 14/198,664

FORMING VERTICALLY SPACED ELECTRODES

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
14/198,664
Abstract

Producing vertically separated electrodes includes providing a structural polymer layer on a substrate. A patterned inorganic thin film is formed on the structural polymer layer, leaving exposed portions of the structural polymer layer not under the inorganic thin film. The exposed portions of the structural polymer layer and portions of the structural polymer layer between the patterned inorganic thin film and the substrate are removed to form a structural polymer post having an inorganic cap that extends beyond an edge of the structural polymer post to define a reentrant profile. A polymeric inhibitor is provided in the reentrant profile. A conductive inorganic thin film is deposited where the polymeric inhibitor is absent using an atomic layer deposition process to form a first electrode located over the cap and a second electrode over the substrate and not over the post.

Claims (20)

1 . A method of producing vertically separated electrodes:

providing a substrate;

providing a structural polymer layer on the substrate;

forming a patterned inorganic thin film on the structural polymer layer, leaving exposed portions of the structural polymer layer not under the inorganic thin film;

removing the exposed portions of the structural polymer layer and portions of the structural polymer layer between the patterned inorganic thin film and the substrate to form a structural polymer post having an inorganic cap that extends beyond an edge of the structural polymer post to define a reentrant profile;

providing a polymeric inhibitor in the reentrant profile; and

depositing a conductive inorganic thin film where the polymeric inhibitor is absent using an atomic layer deposition process to form a first electrode located over the cap and a second electrode over the substrate and not over the post.

2 . The method of claim 1 , wherein using an atomic layer deposition process includes using a spatial atomic layer deposition process.

3 . The method of claim 1 , the structural polymer layer having a surface, further comprising treating the surface of the structural polymer layer to activate the surface of the polymer to facilitate inorganic thin film growth using an atomic layer deposition process.

4 . The method of claim 1 , wherein providing a polymeric inhibitor includes providing the polymeric inhibitor using a coating process or a printing process.

5 . The method of claim 4 , wherein the printing process includes an inkjet printing process or a flexographic printing process.

6 . The method of claim 1 , wherein providing a polymeric inhibitor includes providing a water soluble polymer.

7 . The method of claim 6 , wherein providing a water soluble polymer includes providing polyvinylpyrrolidone.

8 . The method of claim 1 , wherein providing the structural polymer layer comprises providing polyester, polyetherester, polyamide, polyesteramide, polyurethane, polyimide, polyetherimide, polyurea, polyamideimide, polyphenyleneoxide, phenoxy resin, epoxy resin, polyolefin, polyacrylate, polyethylene-co-vinyl alcohol, or a copolymer thereof, or a mixture thereof.

9 . The method of claim 1 , wherein providing the structural polymer layer comprises providing an epoxy resin or polyimide layer.

10 . The method of claim 1 , wherein removing the exposed portions of the structural polymer layer and portions of the structural polymer layer between the patterned inorganic thin film and the substrate includes using a plasma process or UV-ozone process.

11 . The method of claim 1 , wherein forming a patterned inorganic thin includes depositing one of a Al 2 O 3 , SiO 2 , HfO, ZrO, TiO 2 , Ta 2 O 5 , and Si x N y .

12 . The method of claim 1 , wherein forming the structural polymer post having the inorganic cap further includes forming another reentrant profile opposite the reentrant profile.

13 . The method of claim 12 , wherein forming the first electrode includes forming the first electrode to extend beyond the other reentrant profile.

14 . The method of claim 12 , further comprising depositing a filler material in the other reentrant profile.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Jan 24, 2020
From: BARCLAYS BANK PLC
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST) INC.; KODAK AMERICAS LTD.; KODAK REALTY INC.; LASER PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES LTD.; NPEC INC.
Reel/Frame 052773/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; PFC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 049901/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 22, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 050239/0001 →
SECURITY INTEREST Recorded Mar 28, 2014
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; KODAK AVIATION LEASING LLC
To: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
Reel/Frame 032553/0398 →
SECURITY INTEREST Recorded Mar 28, 2014
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST). INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; KODAK AVIATION LEASING LLC
To: JPMORGAN CHASE BANK, N.A. AS ADMINISTRATIVE AGENT
Reel/Frame 032552/0741 →
SECURITY INTEREST Recorded Mar 28, 2014
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; KODAK AVIATION LEASING LLC
To: BANK OF AMERICA N.A., AS AGENT
Reel/Frame 032553/0152 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 6, 2014
From: ELLINGER, CAROLYN RAE; NELSON, SHELBY FORRESTER
To: EASTMAN KODAK COMPANY
Reel/Frame 032364/0693 →