Fabrication method of semiconductor device and fabrication method of dynamic threshold transistor
A method includes: etching a silicon substrate except for a silicon substrate portion on which a channel region is to be formed to form first and second trenches respectively at a first side and a second side of the silicon substrate portion; filling the first and second trenches by epitaxially growing a semiconductor layer having etching selectivity against silicon and further a silicon layer; removing the semiconductor layer selectivity by a selective etching process to form voids underneath the silicon layer respectively at the first side and the second side of the substrate portion; burying the voids at least partially with a buried insulation film; forming a gate insulation film and a gate electrode on the silicon substrate portion; and forming a source region in the silicon layer at the first side of the silicon substrate portion and a drain region at the second side of the silicon substrate portion.
1. A method of fabricating a semiconductor device, comprising:
forming a first trench and a second trench, that is located respectively at a first side and a second side of a silicon substrate portion in a silicon substrate;
forming a semiconductor layer that has etching selectivity against silicon in said first trench and said second trench by epitaxially growing;
forming a silicon layer on said semiconductor layer by epitaxially growing in said first trench and said second trench;
forming a void underneath said silicon layer by removing said semiconductor layer;
forming a buried insulation film in said voids;
forming a gate insulation film directly on said silicon substrate portion and a gate electrode on said gate insulation film; and
forming a source region in said silicon layer at said first side of said silicon substrate portion and a drain region in said silicon layer at said second side of said silicon substrate portion.
wherein the method further comprises, after said forming said buried insulation film but before said forming the gate insulation film, exposing a top surface of said silicon substrate portion by removing said buried insulation film covering said top surface, said gate insulation film being formed directly on said top surface of said silicon substrate portion.
2. The method of fabricating a semiconductor device according to claim 1 , further comprising:
forming a mask pattern on a first region of said silicon substrate between said first side and said second side before forming said first trench and said second trench; and
forming a device isolation trench that exposes a side surface of said semiconductor layer, in said silicon substrate after forming said silicon layer and before forming said voids;
wherein in forming said first trench and said second trench, etching said silicon substrate using said mask pattern as a mask.
3. The method as claimed in claim 2 , wherein a bottom of said device isolation trench is located underneath said semiconductor layer.
4. The method as claimed in claim 2 , further comprising forming a device isolation insulation film up to a top edge of said device isolation trench in said device isolation trench, after forming said buried insulation film.
5. The method as claimed in claim 2 , further comprising performing an ion implantation process, before forming said mask pattern, into said silicon substrate.
6. The method as claimed in claim 2 , wherein said silicon layer is selectively formed on said semiconductor layer by using said mask pattern as a mask.
7. The method as claimed in claim 1 , wherein said semiconductor layer includes a SiGe mixed crystal layer, and
forming said voids includes removing said semiconductor layer by a wet etching process that uses an etchant including a hydrofluoric acid, hydrogen peroxide and an ascetic acid or by a dry etching process that uses an etching gas including chlorine.
8. The method as claimed in claim 1 , wherein said semiconductor layer includes a silicon second layer which contains that includes boron with a concentration of 1×10 18 cm −3 or more,
and forming said voids includes removing said semiconductor layer by a wet etching process that uses an etchant including a hydrogen fluoric acid, a nitric acid and an ascetic acid.