Semiconductor integrated circuit device and a method of manufacturing the same
View Patent ↗Semiconductor device including a memory cell featuring a first gate insulating film over a semiconductor substrate, a control gate electrode over the first gate insulating film, a second gate insulating film over the substrate and a side wall of the control gate electrode, a memory gate electrode over the second gate insulating film arranged adjacent with the control gate electrode through the second gate insulating film, first and second semiconductor regions in the substrate positioned on a control gate electrode side and a memory gate side, respectively, the second gate insulating film featuring a first film over the substrate, a charge storage film over the first film and a third film over the second film, the first film having a first portion between the substrate and memory gate electrode and a thickness greater than that of a second portion between the control gate electrode and the memory gate electrode.
1. A semiconductor device having a memory cell;
the memory cell comprising:
a first gate insulating film formed over a semiconductor substrate,
a control gate electrode formed over the first gate insulating film,
a second gate insulating film formed over the semiconductor substrate and over a side wall of the control gate electrode,
a memory gate electrode formed over the second gate insulating film and arranged adjacent with the control gate electrode through the second gate insulating film,
a first semiconductor region formed in the semiconductor substrate and positioned on a control gate electrode side, and
a second semiconductor region formed in the semiconductor substrate and positioned on a memory gate electrode side,
wherein the second gate insulating film includes a first insulating film, a second insulating film, and a third insulating film,
wherein the first insulating film is formed over the semiconductor substrate and over a side wall of the control gate electrode,
wherein the second insulating film is formed over the first insulating film and contacts the first insulating film between the memory gate electrode and the semiconductor substrate and between the control gate electrode and the memory gate electrode,
wherein the third insulating film is formed over the second insulating film,
wherein the second insulating film includes a charge storage film, and
wherein an contacting face of the first insulating film and the second insulating film has a corner whose interior angle takes a form of an acute angle in a cross-section view.
2. A semiconductor device according to the claim 1 ,
wherein the first insulating film includes a first portion and a second portion,
wherein the first portion is located between the memory gate electrode and the semiconductor substrate, and the second portion is located between the control gate electrode and the memory gate electrode, and
wherein a thickness of a lower portion of the second portion is smaller than a thickness of a middle portion of the second portion.
3. A semiconductor device according to the claim 2 ,
wherein a thickness of the second portion is greater than a thickness of the first portion.
4. A semiconductor device according to the claim 1 ,
wherein the first insulating film includes a first portion and a second portion,
wherein the first portion is located between the memory gate electrode and the semiconductor substrate, and the second portion is located between the control gate electrode and the memory gate electrode, and
wherein a thickness of the second portion is greater than a thickness of the first portion.
5. A semiconductor device according to the claim 1 ,
wherein the first and third insulating film include a silicon oxide film, and
wherein the second insulating film includes a silicon nitride film.
6. A semiconductor device according to the claim 1 ,
wherein the memory gate electrode is in a form of a side wall.
7. A semiconductor device according to the claim 1 ,
wherein charge storage film includes a silicon nitride film.
8. A semiconductor device having a memory cell;
the memory cell comprising:
a first gate insulating film formed over a semiconductor substrate,
a control gate electrode formed over the first gate insulating film,
a second gate insulating film formed over the semiconductor substrate and over a side wall of the control gate electrode,
a memory gate electrode formed over the second gate insulating film and arranged adjacent with the control gate electrode through the second gate insulating film,
a first semiconductor region formed in the semiconductor substrate and positioned on a control gate electrode side, and
a second semiconductor region formed in the semiconductor substrate and positioned on a memory gate electrode side,
wherein the second gate insulating film includes a first insulating film, a second insulating film, and a third insulating film,
wherein the first insulating film is formed over the semiconductor substrate and over a side wall of the control gate electrode,
wherein the second insulating film is formed over the first insulating film and contacts the first insulating film between the memory gate electrode and the semiconductor substrate and between the control gate electrode and the memory gate electrode,
wherein the third insulating film is formed over the second insulating film,
wherein the second insulating film includes a charge storage film,
wherein a contacting face of the first insulating film and the second insulating film includes a first portion and a second portion,
wherein the first portion is located between the memory gate electrode and the semiconductor substrate, and the second portion is located between the control gate electrode and the memory gate electrode, and
wherein the first portion and the second portion intersect so as to take a form of an interior acute angle in a cross-section view.
9. A semiconductor device according to the claim 8 ,
wherein the first insulating film includes a third portion and a fourth portion,
wherein the third portion is located between the memory gate electrode and the semiconductor substrate, and the fourth portion is located between the control gate electrode and the memory gate electrode, and
wherein a thickness of a lower portion of the fourth portion is smaller than a thickness of a middle portion of the fourth portion.
10. A semiconductor device according to the claim 9 ,
wherein a thickness of the fourth portion is greater than a thickness of the third portion.
11. A semiconductor device according to the claim 8 ,
wherein the first insulating film includes a third portion and a fourth portion,
wherein the third portion is located between the memory gate electrode and the semiconductor substrate, and the fourth portion is located between the control gate electrode and the memory gate electrode, and
wherein a thickness of the fourth portion is greater than a thickness of the third portion.
12. A semiconductor device according to the claim 8 ,
wherein the first and third insulating film include a silicon oxide film, and
wherein the second insulating film includes a silicon nitride film.
13. A semiconductor device according to the claim 8 ,
wherein the memory gate electrode is in a form of a side wall.
14. A semiconductor device according to the claim 8 ,
wherein charge storage film includes a silicon nitride film.