SEMICONDUCTOR DEVICE, METHOD OF POSITIONING SEMICONDUCTOR DEVICE, AND POSITIONING APPARATUS FOR SEMICONDUCTOR DEVICE

1 . A semiconductor device, comprising:

a semiconductor chip that has a first connection terminal for wiring connection;

a substrate that has a second connection terminal for wiring connection, the second connection terminal being electrically connected to the first connection terminal; and

a reflective surface that reflects light from the first connection terminal and the second connection terminal in a thickness direction of the substrate or the semiconductor chip.

2 . The semiconductor device according to claim 1 , wherein the reflective surface is a part of an outer surface of a prism mounted on the semiconductor chip.

3 . The semiconductor device according to claim 2 , further comprising a transmission cable that is connected on a reverse side of a connection surface of the substrate to the semiconductor chip, and is positioned according to an image reflected by the reflective surface when being connected.

4 . The semiconductor device according to claim 2 , wherein

the semiconductor chip has a first alignment mark on a connection surface to the substrate, and

the substrate has a second alignment mark on a reverse side of a connection surface to the semiconductor chip.

5 . The semiconductor device according to claim 1 , wherein the reflective surface is formed on a base substrate to which the semiconductor chip is connected.

6 . The semiconductor device according to claim 1 , wherein the reflective surface is a part of a trench portion that is formed in the substrate and that accommodates the semiconductor chip.

7 . A method of positioning a semiconductor device in which a semiconductor chip and a substrate are connected to each other, the method comprising the steps of:

first positioning of positioning in a field of view of an imaging device a reflective surface that reflects light from a first connection terminal of the semiconductor chip for wiring connection; and

second positioning of positioning the substrate according to an image of a second connection terminal of the substrate for wiring connection and an image of the first connection terminal, both of the images being projected on the reflective surface.

8 . The method according to claim 7 , further comprising a step of roughly adjusting a position of the second connection terminal of the substrate according to a first alignment mark formed on a connection surface of the semiconductor chip to the substrate and a second alignment mark formed on a reverse side of a connection surface of the substrate to the semiconductor chip, after the step of first positioning.

9 . A positioning apparatus for a semiconductor device that includes: a semiconductor chip having a first connection terminal for wiring connection; a substrate having a second connection terminal for wiring connection, the second connection terminal being electrically connected to the first connection terminal; and a reflective surface that reflects light, the positioning apparatus comprising:

a stage that fixes the semiconductor chip having the first connection terminal for wiring connection and is movable within one plane;

a tool that suctions and fixes the substrate having the second connection terminal for wiring connection and mounts the substrate on the semiconductor chip;

an imaging device that images a reflective surface for projecting images of the first connection terminal and the second connection terminal; and

a control unit that controls movement of the stage based on the images of the first connection terminal and the second connection terminal that are projected on the reflective surface, the images having been imaged by the imaging device.