IP Library Patent Application 14403716
Patent Application
App. No. 14/403,716

INSULATING COMPOSITES FOR POWER TRANSMISSION AND DISTRIBUTION

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Patent No.
US None
App. No.
14/403,716
Abstract

An insulating composite for powder transmission and distribution containing a continuous reinforcing fiber embedded in a thermoset resin, wherein the thermoset resin is a reaction product of a curable epoxy resin composition comprising (a) at least one bisphenol A-type epoxy resin, (b) at least one oxazolidone ring containing epoxy resin, and (c) at least one anhydride hardener and wherein the curable epoxy resin composition has a viscosity of 6,000 millipascals·second or less at 25° C.; and a process for preparing the insulating composite.

Claims (15)

1 . An insulating composite for power transmission and distribution comprising a continuous reinforcing fiber embedded in a thermoset resin, wherein the thermoset resin is a reaction product of a curable epoxy resin composition comprising (a) at least one bisphenol A-type epoxy resin, (b) at least one oxazolidone ring containing epoxy resin, and (c) at least one anhydride hardener and wherein the curable epoxy resin composition has a viscosity of 6,000 Millipascals·second or less at 25° C.

2 . The insulating composite of claim 1 , wherein the bisphenol A-type epoxy resin is a diglycidyl ether of bisphenol A.

3 . The insulating composite of claim 1 , wherein the oxazolidone ring containing epoxy resin is a reaction product of an aromatic epoxy resin and an isocyanate compound.

4 . The insulating composite of claim 1 , wherein the anhydride hardener is selected from methyltetrahydrophthalic anhydride (MTHPA); methyl hexahydrophathalic anhydride (MHHPA); methyl-(endo)-5-norbornene-2,3-dicarboxylic anhydride (METHPA); hexahydrophthalic anhydride (HHPA); tetrahydrophthalic anhydride (THPA); pyromellitic dianhydride; ciscyclopentanetetracarboxylic acid dianhydride; hemimellitic anhydride; trimellitic anhydride; naphthalene-1,8-dicarboxylic acid anhydride; phthalic anhydride; dichloromaleic anhydride; dodecenylsuccinic anhydride; glutaric anhydride; maletic anhydride; succinic anhydride; or mixtures thereof.

5 . The insulating composite of claim 1 , wherein the curable epoxy resin composition comprises from 60 to 95 weight percent of the bisphenol A-type epoxy resin and from 5 to 40 weight percent of the oxazolidone ring containing epoxy resin, based on the total weight of epoxy resins in the curable epoxy resin composition.

6 . The insulating composite of claim 1 , wherein the curable epoxy resin composition further comprises an additional epoxy resin selected from the group consisting of a phenol novolac epoxy resin and a cycloaliphatic epoxy resin.

7 . The insulating composite of claim 1 , wherein the curable epoxy resin composition further comprises at least one of a toughening agent, a mold release agent, a catalyst and a filler.

8 . The insulating composite of claim 1 , wherein the reinforcing fiber is a glass fiber.

9 . The insulating composite of claim 1 , wherein the insulating composite comprises from 70 to 85 weight percent of the reinforcing fiber, based on the total weight of the insulating composite.

10 . The insulating composite of claim 1 , wherein the reinforcing fiber is axially aligned in the longitudinal direction of the insulating composite.

11 . The insulating composite of claim 1 , wherein the insulating composite is in a shape of a rod.

12 . The insulating composite of claim 11 having a length of one meter or more.

13 . The insulating composite of claim 1 , wherein the insulating composite is in a form of a core that further comprises an outer sheathing around the insulating composite core.

14 . The insulating composite of claim 13 , wherein the sheathing is rubber.

15 . A pultrusion process for preparing an insulating composite, comprising pulling a continuous reinforcing fiber, contacting the reinforcing fiber with a curable epoxy resin composition and curing the curable epoxy resin composition, wherein the curable epoxy resin composition has a viscosity of 6000 Millipascals·Second or less at 25° C. and contains (a) at least one bisphenol A-type epoxy resin, (b) at least one oxazolidone ring containing epoxy resin, and (c) at least one anhydride hardener.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2018
From: DU, WEI; ZHANG, YI
To: DOW CHEMICAL (CHINA) INVESTMENT COMPANY LIMITED
Reel/Frame 046427/0600 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2018
From: DOW CHEMICAL (CHINA) INVESTMENT COMPANY LIMITED
To: THE DOW CHEMICAL COMPANY
Reel/Frame 046427/0686 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2018
From: LI, YONGJIANG
To: DCOMCO, INC.
Reel/Frame 046427/0802 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2018
From: DCOMCO, INC.
To: THE DOW CHEMICAL COMPANY
Reel/Frame 046427/0939 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2018
From: THE DOW CHEMICAL COMPANY
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 046428/0047 →