High Temperature Imaging Media for Digital Image Correlation
A thermal barrier coating is provided. The thermal barrier coating is configured to remain adherent to the substrate under high strains, thus allowing the use of non-contacting strain measurement systems, such as digital image correlation. The thermal barrier coating may include a first layer of a partially metallic material configured to adhere to a metallic substrate, and a second layer of a partially ceramic material configured to adhere to the first layer. A successful configuration has a top layer thickness that is approximately two-thirds of the first layer thickness.
1 . A thermal barrier coating, comprising:
a bond layer having a first thickness; and
a top layer having a second thickness that is approximately two-thirds of the first thickness.
2 . The thermal barrier coating of claim 1 , wherein one or more of the bond layer and the top layer is configured to maintain substantial adherence with a metallic substrate at temperatures of at least approximately 1400° F. and under strain levels of at least approximately 30%.
3 . The thermal barrier coating of claim 1 , wherein the top layer is at least partially formed of a ceramic material.
4 . The thermal barrier coating of claim 1 , further comprising a thermally grown oxide layer that is disposed between the bond layer and the top layer.
5 . A thermal barrier coating, comprising:
a first layer of a partially metallic material configured to adhere to a metallic substrate, the first layer having a thickness of approximately 0.003 inches; and
a second layer of a partially ceramic material configured to adhere to the first layer, the second layer having a thickness of approximately 0.002 inches.
6 . The thermal barrier coating of claim 5 , wherein one or more of the first layer and the second layer is configured to maintain adherence with the metallic substrate at temperatures of at least approximately 1400° F. and under strain levels of approximately 30% strain.
7 . The thermal barrier coating of claim 5 , wherein one or more interfaces between the first layer and the second layer is configured to enable non-contact characterization of a sample substrate under high temperature and high strain conditions.
8 . The thermal barrier coating of claim 5 , wherein the first layer is a bond layer configured to adhere to the metallic substrate, and the second layer is a top layer configured to adhere to the first layer.
9 . The thermal barrier coating of claim 5 , further comprising a third layer formed of an at least partially oxide material, the third layer being disposed between the first layer and the second layer.
10 . The thermal barrier coating of claim 5 , wherein each of the first layer and the second layer is applied by one or more spray coats.
11 . A method of applying a thermal barrier coating onto a metallic substrate, the method comprising:
applying a first layer of a partially metallic material of a first thickness to a surface of the metallic substrate; and
applying a second layer of a partially ceramic material of a second thickness to the first layer, the second layer being applied such that the second thickness is approximately two-thirds of the first thickness.
12 . The method of claim 11 , wherein one or more of the first layer and the second layer is configured to maintain adherence with the surface of the metallic substrate in temperatures of at least approximately 1400° F. and under strain levels of approximately 30% strain.
13 . The method of claim 11 , wherein the first layer is a bond layer and is bonded to the surface of the metallic substrate, and the second layer is a top layer and is bonded to the first layer.
14 . The method of claim 11 , wherein each of the first layer and the second layer is applied by one or more spray coats.