Semiconductor device with improved short circuit capability
A semiconductor device in which short circuit capability can be improved while decline in overall current capability is suppressed. In the semiconductor device, a plurality of IGBTs (insulated gate bipolar transistors) arranged in a row in one direction over the main surface of a semiconductor substrate include an IGBT located at an extreme end in the one direction and an IGBT located more centrally than the IGBT located at the extreme end. The current capability of the IGBT located at the extreme end is higher than the current capability of the IGBT located centrally.
1. An Insulated Gate Bipolar Transistor (IGBT) comprising:
a semiconductor substrate having a main surface; and
elements having a plurality of insulated gate transistor parts arranged in a row in one direction over the main surface;
the elements including a first element located at an end of the row in the one direction; and a second element located more centrally in the row in the one direction than the first element;
wherein the first element includes a first insulated gate transistor part, and the second element includes a second insulated gate transistor part and a third insulated gate transistor part that are arranged symmetrically to each other in the one direction, and
wherein current capability of the first element located at the end is higher than current capability of the second element located centrally,
wherein the first insulated gate transistor part includes a first gate electrode formed over a portion of a first base region at a first side of the first base region and a portion of a first element separation structure formed in the main surface, the first base region being formed in the main surface;
wherein the second insulated gate transistor part and the third insulated gate transistor part include a second gate electrode and a third gate electrode, respectively, which are formed over a second base region formed in the main surface, the second base region being common to the second gate electrode and the third gate electrode,
wherein in the one direction, a distance between the second gate electrode and the third gate electrode is more than twice as long as a distance between the first gate electrode and a second element separation structure formed on a second side of the first base region that is opposite to the first side of the first base region, and
wherein a channel length of the second element located centrally is same as a channel length of the first element located at the end.
2. The IGBT according to claim 1 , the insulated gate transistor parts each comprising:
a first conductivity type collector region formed in the semiconductor substrate;
a first conductivity type base region, which includes the first and the second base regions, formed in the main surface separately from the collector region; and
a second conductivity type emitter region formed in the main surface in the first conductivity type base region,
wherein doping concentration of the second base region of the second element located centrally is higher than doping concentration of the first base region of the first element located at the end.
3. The IGBT according to claim 1 , the insulated gate transistor parts each comprising:
a first conductivity type drain region formed in the semiconductor substrate;
a second conductivity type base region, which includes the first and the second base regions, formed in the main surface separately from the drain region; and
a first conductivity type source region formed in the main surface in the second conductivity type base region,
wherein doping concentration of the second base region of the second element located centrally is higher than doping concentration of the first base region of the first element located at the extreme end.
4. The IGBT according to claim 1 , the insulated gate transistor parts each comprising:
a first conductivity type collector region formed in the semiconductor substrate;
a first conductivity type base region, which includes the first and the second base regions, formed in the main surface separately from the collector region; and
a second conductivity type emitter region formed in the main surface in the first conductivity type base region,
wherein the second base region of the second element located centrally extends down to a deeper position from the main surface than the first base region of the first element located at the end.
5. The IGBT according to claim 1 , the insulated gate transistor parts each comprising:
a first conductivity type drain region formed in the semiconductor substrate;
a second conductivity type base region, which includes the first and the second base regions, formed in the main surface separately from the drain region; and
a first conductivity type source region formed in the main surface in the second conductivity type base region,
wherein the second base region of the second element located centrally extends down to a deeper position from the main surface than the first base region of the first element located at the end.
6. The IGBT according to claim 1 , the insulated gate transistor parts each comprising:
a first conductivity type collector region formed in the semiconductor substrate;
a first conductivity type base region formed in the main surface separately from the collector region; and
a second conductivity type emitter region formed in the main surface in the first conductivity type base region,
wherein a drift region of the second element located centrally is longer than a drift region of the first element located at the end.
7. The IGBT according to claim 1 , the insulated gate transistor parts each comprising:
a first conductivity type drain region formed in the semiconductor substrate;
a second conductivity type base region formed in the main surface separately from the drain region; and
a first conductivity type source region formed in the main surface in the second conductivity base region,
wherein a drift region of the second element located centrally is longer than a drift region of the first element located at the end.