Solder ball jet nozzle having improved reliability
View Patent ↗A solder ball bonding tool includes a nozzle having an inner bore having a plurality of columnar surfaces and interposed retention structures that are positioned within the nozzle to retain a solder ball therein. A projection or projected shape formed by intersecting the retention structures may be generally circular, having a diameter less than the diameter of the solder balls for which the retention structures are positioned to retain. The nozzle may comprise a cemented carbide having less than or equal to a cumulative 4.5% of cobalt and gold serving as a binder.
1. A solder ball bonding tool nozzle, comprising:
an inner bore comprising a plurality of equivalent columnar surfaces equally spaced around the perimeter of said inner bore; and
a plurality of retention structures each formed by an intersection of two said adjacent columnar surfaces such that only one pointes structure per retention structure extends into said inner bore in a position to retain a solder ball within said nozzle;
wherein said nozzle is composed of a cemented carbide having up to a 4.5% cumulative percentage of cobalt and gold serving as a binder.
2. The nozzle of claim 1 , wherein a projected shape formed by intersecting said retention structures is substantially circular and has a diameter that is less than the diameter of a solder ball for which said retention structures are positioned to retain.
3. The nozzle of claim 1 , wherein said columnar surfaces of said inner bore are concave surfaces.
4. The nozzle of claim 1 , wherein said columnar surfaces of said inner bore are substantially circular concave surfaces having a diameter that is less than the diameter of a solder ball for which said retention structures are positioned to retain.
5. The nozzle of claim 1 , further comprising a nozzle tip comprising a continuous outer side wall, and wherein said columnar surfaces of said inner bore do not intersect an outermost interface of said outer sidewall of said nozzle tip.
6. The nozzle of claim 1 , wherein said plurality of columnar surfaces comprises three or more columnar surfaces and wherein said plurality of retention structures comprises three or more retention structures.
7. The nozzle of claim 1 , wherein said plurality of columnar surfaces comprises at least four columnar surfaces and wherein said plurality of retention structures comprises at least four retention structures.
8. A solder ball bonding tool, comprising:
a solder ball reservoir configured for housing a plurality of solder balls;
a nozzle configured for retaining at least one solder ball from said reservoir, said nozzle comprising:
an inner bore comprising a plurality of equivalent columnar surfaces equally spaced around the perimeter of said inner bore, and
a plurality of retention structures each formed by an intersection of two said adjacent columnar surfaces such that only one pointed structure per retention structure extends into said inner bore in a position to retain said at least one solder ball within said nozzle, wherein said nozzle is composed of a cemented carbide having up to a 4.5% cumulative percentage of cobalt and gold serving as a binder; and
a laser light source for at least partially melting said solder ball for the expulsion of said partially melted solder ball from said nozzle.
9. The solder ball bonding tool of claim 8 , wherein a projected shape formed by intersecting said retention structures of said inner bore is substantially circular and has a diameter that is less than the diameter of said at least one solder ball.
10. The solder ball bonding tool of claim 8 , wherein said columnar surfaces of said inner bore are concave surfaces.
11. The solder ball bonding tool of claim 8 , wherein said columnar surfaces of said inner bore are substantially circular concave surfaces having a diameter that is less than the diameter of said at least one solder ball.
12. The solder ball bonding tool of claim 8 , further comprising a nozzle tip comprising a continuous outer side wall, and wherein said columnar surfaces of said inner bore do not intersect an outermost interface of said outer sidewall of said nozzle tip.
13. The solder ball bonding tool of claim 8 , wherein said plurality of columnar surfaces comprises three or more columnar surfaces and wherein said plurality of retention structures comprises three or more retention structures.
14. The solder ball bonding tool of claim 8 , wherein said plurality of columnar surfaces comprises at least four columnar surfaces and wherein said plurality of retention structures comprises at least four retention structures.
15. A method comprising:
feeding a solder ball from a reservoir into a nozzle composed of a cemented carbide having up to a 4.5% cumulative percentage of cobalt and gold serving as a binder;
retaining said solder ball within an inner bore of said nozzle, wherein said inner bore comprises a plurality of equivalent columnar surfaces equally spaced around the perimeter of said inner bore, and wherein said nozzle comprises a plurality of retention structures each formed by an intersection of two said adjacent columnar surfaces and such that only one pointed structure per retention structure extends into said inner bore in a position to retain a solder ball within said nozzle;
at least partially melting said solder ball; and
expelling said solder ball from said nozzle onto an assembly component.
16. The method of claim 15 , wherein said expelling includes expelling said partially melted solder ball onto respective electrical contact pads of a magnetic recording head slider and a suspension.
17. A solder ball bonding tool nozzle, comprising:
an inner bore comprising a plurality of equivalent columnar surfaces equally spaced around the perimeter of said inner bore; and
a plurality of retention structures each formed by an intersection of two said adjacent columnar surfaces such that only one pointed structure per retention structure extends into said inner bore in a position to retain a solder ball within said nozzle.
18. A solder ball bonding tool, comprising:
a solder ball reservoir configured for housing a plurality of solder balls;
a nozzle configured for retaining at least one solder ball from said reservoir, said nozzle comprising;
an inner bore comprising a plurality of equivalent columnar surfaces equally spaced around the perimeter of said inner bore, and
a plurality of retention structures each formed by an intersection of two said adjacent columnar surfaces such that only one pointed structure per retention structure extends into said inner bore; and
a laser light source for at least partially melting said solder ball for the expulsion of said partially melted solder ball from said nozzle.