IP Library Granted Patent US 9,490,232
Granted Patent B2
US 9,490,232 · App. 14/532,032 · Granted Nov 8, 2016

Electronic apparatus and method for fabricating the same

Inventors: Kozo Shimizu (Atsugi, JP); Seiki Sakuyama (Isehara, JP)
Assignee: FUJITSU LIMITED
H01L25/0657B23K1/0016B23K3/085H01L23/3675H01L23/488H01L23/49816H01L23/49822H01L24/16H01L24/19H01L24/75H01L24/81H01L25/50H05K3/3463B23K2001/12H01L23/145H01L23/3128H01L23/49827H01L24/13H01L24/20H01L24/73H01L2224/0401H01L2224/04105H01L2224/05567H01L2224/05624H01L2224/05647H01L2224/1146H01L2224/11334H01L2224/131H01L2224/13111H01L2224/1601H01L2224/16145H01L2224/16235H01L2224/16238H01L2224/16505H01L2224/16507H01L2224/24137H01L2224/24195H01L2224/293H01L2224/2919H01L2224/2929H01L2224/32225H01L2224/33181H01L2224/48091H01L2224/48227H01L2224/73204H01L2224/73253H01L2224/73265H01L2224/759H01L2224/75253H01L2224/75501H01L2224/75502H01L2224/81005H01L2224/8121H01L2224/81075H01L2224/81191H01L2224/81192H01L2224/81411H01L2224/81815H01L2224/81948H01L2224/81986H01L2225/06513H01L2924/10252H01L2924/10253H01L2924/10271H01L2924/10329H01L2924/10335H01L2924/13091H01L2924/1579H01L2924/15311H01L2924/15313H01L2924/1659H01L2924/16235H01L2924/16251H01L2924/16747H01L2924/181H01L2924/19041H01L2924/19105H01L2924/35121H05K1/0203H05K3/3436H05K2201/0248H05K2201/09972H05K2201/1056H05K2203/1121H05K2203/304
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Quick Facts
Patent No.
US 9,490,232
App. No.
14/532,032
Granted
Nov 8, 2016
Kind
B2
Abstract

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

Claims (17)

1. An electronic apparatus comprising:

a first electronic part with a first terminal;

a second electronic part with a second terminal opposite the first terminal; and

a joining portion which joins the first terminal and the second terminal and which includes a first pole-shaped compound of Ag 3 Sn extending in a direction in which the first terminal and the second terminal are opposite to each other;

wherein the joining portion includes a portion which covers the first pole-shaped compound of Ag 3 Sn, the portion including Sn and Ag.

2. The electronic apparatus according to claim 1 further comprising a first member which is disposed over the first electronic part and which has first heat capacity.

3. The electronic apparatus according to claim 2 , wherein the first member is separate from the second electronic part.

4. The electronic apparatus according to claim 2 , wherein heat capacity of the first electronic part over which the first member is disposed is larger than heat capacity of the second electronic part.

5. An electronic apparatus comprising:

a first electronic part with a first terminal;

a second electronic part with a second terminal opposite the first terminal; and

a joining portion which joins the first terminal and the second terminal and which includes a first pole-shaped compound of Ag 3 Sn extending in a direction in which the first terminal and the second terminal are opposite to each other;

wherein the joining portion includes a second pole-shaped compound extending in the direction in which the first terminal and the second terminal are opposite to each other, and a portion which covers the second pole-shaped compound, the portion including Sn and Ag, the second pole-shaped compound being an intermetallic compound including Sn and Ag.

6. The electronic apparatus according to claim 5 , wherein the second pole-shaped compound includes Ag 3 Sn.

7. The electronic apparatus according to claim 5 , further comprising a first member which is disposed over the first electronic part and which has first heat capacity.

8. The electronic apparatus according to claim 7 , wherein the first member is separate from the second electronic part.

9. The electronic apparatus according to claim 7 , wherein heat capacity of the first electronic part over which the first member is disposed is larger than heat capacity of the second electronic part.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 25, 2014
From: SHIMIZU, KOZO; SAKUYAMA, SEIKI
To: FUJITSU LIMITED
Reel/Frame 034261/0259 →
Priority Claims (1)
JP 2013-254372 · Dec 9, 2013 · national
Continuity (1)
Related Publication 20150162312A1 · Jun 11, 2015