FLEXIBLE SUBSTRATES FOR WEARABLE DEVICES
Embodiments relate generally to wearable electrical and electronic hardware, computer software, wired and wireless network communications, and to wearable/mobile computing devices. More specifically, various embodiments are directed to, for example, a flexible substrate. In one example, a wearable device may include a framework configured to be worn or attached, and a flexible substrate coupled to the framework. The flexible substrate may include a first end and a second end, and may include one or more conductive layer structures and a conductive laminate structure. The flexible substrate may include rigid regions configured to receive one or more components including a sensor, an electrode, and/or a logic circuit (e.g., bioimpedance logic circuit).
1 . A wearable device comprising:
a framework configured to be worn or attached; and
a flexible substrate coupled to the framework, the flexible substrate having a first end and a second end and comprising:
one or more conductive layer structures;
a conductive laminate structure; and
a plurality of intermediate support structures,
wherein the flexible substrate includes one or more rigid regions configured to receive one or more components including a sensor.
2 . The wearable device of claim 1 wherein at least a rigid region of the rigid regions comprises:
a portion of the one or more conductive layer structures, a portion of the conductive laminate structure, and a portion of the plurality of intermediate support structures,
wherein the portions are stacked upon each other.
3 . The wearable device of claim 1 wherein the rigid regions comprise:
at least one of the sensor, a vibratory motor, and an electronic device.
4 . The wearable device of claim 1 wherein the flexible substrate further comprises:
at least two intermediate support structures of the plurality of the intermediate support structures in which the conductive laminate structure is disposed between the two intermediate support structures.
5 . The wearable device of claim 1 wherein the flexible substrate further comprises:
one or more supported flex regions.
6 . The wearable device of claim 5 wherein the one or more supported flex regions each comprises:
at least two intermediate support structures of the plurality of the intermediate support structures disposed between a first rigid region and a second rigid region.
7 . The wearable device of claim 6 wherein each of the two intermediate support structures comprises:
two intermediate layers.
8 . The wearable device of claim 7 wherein each of the two intermediate layers comprises:
a polyimide layer.
9 . The wearable device of claim 1 wherein the flexible substrate further comprises:
one or more flex regions.
10 . The wearable device of claim 9 wherein the one or more flex regions each comprises:
at least two intermediate support structures of the plurality of the intermediate support structures disposed between a third rigid region and one of the first or the second ends.
11 . The wearable device of claim 10 wherein each of the two intermediate support structures comprises:
one intermediate layer.
12 . The wearable device of claim 1 wherein at least one of the rigid regions comprises:
a molding material encapsulating one of the components.
13 . The wearable device of claim 12 wherein the molding material comprises:
an extension portion that encapsulates a portion of a supported flex region.
14 . The wearable device of claim 13 wherein extension portion comprises:
a ridge supporting the portion of a supported flex region.
15 . The wearable device of claim 1 wherein the flexible substrate comprises:
electrodes.
16 . The wearable device of claim 1 wherein a rigid region comprises:
a logic circuit.
17 . The wearable device of claim 1 wherein the sensor comprises:
electrodes;
one or more of the conductive layer structures; and
a bioimpedance logic circuit.
18 . A method comprising:
forming a flexible substrate including:
one or more conductive layer structures;
a conductive laminate structure; and
a plurality of intermediate support structures;
coupling the flexible substrate to a framework; and
molding over the flexible substrate and the framework,
wherein the flexible substrate includes one or more rigid regions configured to receive one or more components including a sensor.
19 . The method of claim 18 , further comprising:
disposing the conductive laminate structure between multiple intermediate layers, each of which is a constituent of at least one of plurality of intermediate support structures.
20 . The method of claim 18 , further comprising:
molding over a component in a rigid region; and
extending a molding material to form a ridge contacting a surface portion of a supported flex region.