IP Library Granted Patent US 9,671,959
Granted Patent B2
US 9,671,959 · App. 14/558,329 · Granted Jun 6, 2017

Tiered sub-unit throughputs in mass storage assemblies

Inventors: Curtis H. Bruner (Niwot, CO); Christopher J. Squires (Boulder, CO)
Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
G06F3/0607G06F3/0613G06F3/0632G06F3/0683
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Quick Facts
Patent No.
US 9,671,959
App. No.
14/558,329
Granted
Jun 6, 2017
Kind
B2
Abstract

Tiered mass storage assemblies are presented. The mass storage assembly in one example includes a plurality of drive interfaces configured to couple to a plurality of storage devices, with each drive interface of the plurality of drive interfaces being configured to exchange digital data at a predetermined maximum interface throughput, one or more low-output storage drives coupled to one or more corresponding drive interfaces, with a low-output storage drive exchanging digital data using the predetermined maximum interface throughput, and one or more high-output storage drives, with each high-output storage drive of the one or more high-output storage drives being coupled to two or more drive interfaces and with a high-output storage drive exchanging digital data using two or more predetermined maximum interface throughputs of the two or more drive interfaces.

Claims (24)

1. A modular mass storage assembly, comprising:

a plurality of drive interfaces configured to couple to a plurality of mass storage drives, wherein each drive interface of the plurality of drive interfaces has similar predetermined maximum drive interface throughputs;

one or more replaceable low-output mass storage drives comprising rotating magnetic storage media, wherein each low-output mass storage drive of the one or more low-output mass storage drives is coupled to one associated drive interface having the predetermined maximum drive interface throughput; and

one or more replaceable high-output mass storage drives comprising solid state storage media, wherein each high-output mass storage drive of the one or more high-output mass storage drives is coupled to two or more drive interfaces each having the predetermined maximum drive interface throughput.

2. The modular mass storage assembly of claim 1 , wherein each drive interface of the plurality of drive interfaces has the same predetermined maximum drive interface throughput.

3. The modular mass storage assembly of claim 1 , wherein two or more drive interfaces of the plurality of drive interfaces have two or more differing predetermined maximum drive interface throughputs.

4. The modular mass storage assembly of claim 1 , wherein the one or more low-output mass storage drives comprise one or more Hard Disk Drives.

5. The modular mass storage assembly of claim 1 , wherein the one or more high-output mass storage drives comprise one or more Solid State Drives.

6. The modular mass storage assembly of claim 1 , wherein the one or more high-output mass storage drives comprising one or more hybrid storage drives include a Hard Disk Drive component and a Solid State Drive component.

7. The modular mass storage assembly of claim 1 , further comprising at least one modular sub-assembly having an associated maximum sub-assembly data throughput, wherein the modular sub-assembly comprises:

an associated plurality of drive interfaces individually supporting low-output mass storage drives that each operate at the predetermined maximum drive interface throughputs to provide the sub-assembly data throughput, wherein at least two of the low-output mass storage drives are replaceable with a single high-output mass storage drive configured to communicate over at least two of the drive interfaces previously associated with the at least two low-output mass storage drives.

8. The modular mass storage assembly of claim 1 , wherein: one or both of the one or more low-output mass storage drives and the one or more high-output mass storage drives are arranged into two or more storage drive sub-groupings a first storage drive sub-grouping has a predetermined first sub-grouping throughput; and a second storage drive sub-grouping has a predetermined second sub-grouping throughput that differs from the predetermined first sub-grouping throughput.

9. The modular mass storage assembly of claim 1 , wherein one or both of the one or more low-output mass storage drives and the one or more high-output mass storage drives are arranged into two or more storage drive sub-groupings a first storage drive sub-grouping has a predetermined first sub-grouping throughput; and a second storage drive sub-grouping has a predetermined second sub-grouping throughput that is greater than the predetermined first sub-grouping throughput.

10. The modular mass storage assembly of claim 1 , further comprising an Input/Output (I/O) module coupled to the plurality of drive interfaces and configured to exchange digital data with the plurality of mass storage drives.

11. A mass storage assembly, comprising:

a rackmount chassis configured to carry a plurality of modular sub-assemblies;

each of the plurality of modular sub-assemblies configured to carry at least two storage drives, and comprising:

a sub-assembly interface having a predetermined maximum sub-assembly data throughput; and

an associated plurality of drive interfaces individually supporting low-bandwidth storage drives each operating at a predetermined maximum drive interface throughput to provide the predetermined maximum sub-assembly data throughput, wherein at least two of the low-bandwidth storage drives are replaceable in an associated modular sub-assembly with a single high-bandwidth storage drive configured to communicate over at least two of the drive interfaces previously associated with the at least two low-bandwidth storage drives to provide the predetermined maximum sub-assembly data throughput.

12. The mass storage assembly of claim 11 , wherein the low-bandwidth storage drives comprise Hard Disk Drives.

13. The mass storage assembly of claim 11 , wherein the high-bandwidth storage drives comprise Solid State Drives.

14. The mass storage assembly of claim 11 , wherein the high-bandwidth storage drive comprise a hybrid storage drive including a Hard Disk Drive component and a Solid State Drive component.

15. The mass storage assembly of claim 11 , further comprising an Input/Output (I/O) module coupled to ones of the sub-assembly interfaces of the plurality of modular sub-assemblies and configured to exchange digital data with the at least two storage drives.

16. The mass storage assembly of claim 11 , wherein: the low-bandwidth storage drives each comprise Hard Disk Drives; and the high-bandwidth storage drive comprises one of a Solid State Drive and a hybrid storage drive that includes a Hard Disk Drive component and a Solid State Drive component.

Assignments (6)
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
RELEASE OF SECURITY INTEREST AT REEL 052915 FRAME 0566 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
SECURITY INTEREST Recorded Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040829/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 2, 2014
From: BRUNER, CURTIS H.; SQUIRES, CHRISTOPHER J.
To: HGST NETHERLANDS B.V.
Reel/Frame 034313/0232 →
Continuity (1)
Related Publication 20160154609A1 · Jun 2, 2016