Circuit board and electronic device
An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings.
1. An electronic device comprising:
a circuit board;
a first electronic component mounted on a first region of the circuit board and including a plurality of first terminals; and
a second electronic component mounted on a second region of the circuit board and including a plurality of second terminals; and
wherein the circuit board includes;
a board body,
a plurality of first electrode pads arranged on the board body, each of the first electrode pads being connected to each of the first terminals by solder,
a plurality of second electrode pads arranged on the board body, each of the second electrode pads being connected to each of the second terminals by solder,
a first solder resist formed on the board body and having a plurality of first openings and a plurality of second openings, each of the first openings accommodating each of the first electrode pads and each of the second openings accommodating each of the second electrode pads, and
a second solder resist selectively formed on the first solder resist and having a plurality of third openings, each of the third openings being larger than each of the first openings and communicating with each of the first openings.
2. A circuit board comprising:
a board body;
a plurality of first electrode pads arranged on the board body;
a plurality of second electrode pads arranged on the board body;
a first solder resist formed on the board body and having a plurality of first openings and a plurality of second openings, each of the first openings accommodating each of the first electrode pads and each of the second openings accommodating each of the second electrode pads; and
a second solder resist formed on the first solder resist and having a plurality of third openings, each of the third openings being larger than each of the first openings and communicating with each of the first openings,
wherein the board body includes a first region on which a first electronic component is mounted and a second region on which a second electronic component is mounted, and
the second solder resist is selectively formed in the first region.