Different thermal zones in an opto-electronic module
An opto-electronic module used in optical networking may be implemented using two different thermal zones. A first thermal zone at a first temperature may be used for an optical module. A second thermal zone at a second temperature may be used for an electronic module. The first temperature may be different from the second temperature. As a result, a physical dimension of the electronic module may be reduced in comparison to using a single thermal zone for the opto-electronic module.
1. An opto-electronic module, comprising:
an optical module, further comprising:
a first contact area for a first heatsink that operates at a first temperature; and
a first circuit board having heat dissipated by the first heatsink via the first contact area;
an electronic module, further comprising:
a second contact area for a second heatsink that operates at a second temperature different from the first temperature; and
a second circuit board having heat dissipated by the second heatsink via the second contact area;
a housing enclosing the first circuit board and the second circuit board, the housing including a thermal conduction barrier to thermally isolate the first circuit board from the second circuit board;
a radiation barrier disposed between the first heatsink and the second heatsink; and
an interconnect between the first circuit board and the second circuit board, wherein the interconnect penetrates the thermal conduction barrier and the interconnect includes galvanic connections between the first circuit board and the second circuit board,
wherein the first heat sink, the second head sink, and the radiation barrier are mounted to a cage in which the housing is inserted in operation.
2. The opto-electronic module of claim 1 , wherein the interconnect is a flexible circuit board.
3. The opto-electronic module of claim 1 , wherein the first circuit board includes at least one of:
an optical transmitter; and
an optical receiver.
4. The opto-electronic module of claim 1 , wherein the second circuit board includes an integrated circuit mechanically coupled to the second heat sink.
5. The opto-electronic module of claim 4 , wherein the integrated circuit is an application specific integrated circuit.
6. The opto-electronic module of claim 1 , wherein the second temperature is higher than the first temperature.
7. The opto-electronic module of claim 1 , wherein the second heatsink dissipates more heat than the first heatsink.
8. The opto-electronic module of claim 1 , wherein the first contact area has a first length and the second contact area has a second length, and wherein the second length is selected based on a power dissipation for the electronic module.
9. An opto-electronic module, comprising:
an optical module, further comprising:
a first contact area for a first heatsink that operates at a first temperature; and
a first circuit board, including an optical connector, having heat dissipated by the first heatsink via the first contact area;
an electronic module, further comprising:
a second contact area for a second heatsink that operates at a second temperature different from the first temperature; and
a second circuit board, including an electronic connector, having heat dissipated by the second heatsink via the second contact area; and
a housing enclosing the first circuit board and the second circuit board, the housing including a thermal conduction barrier to thermally isolate the first circuit board from the second circuit board,
wherein the optical connector and the electronic connector are pluggable connectors accessible from opposite faces of the housing.
10. The opto-electronic module of claim 9 , wherein the electronic connector includes digital signal connections.
11. An optical network, comprising:
an opto-electronic module, further comprising:
an optical module, further comprising:
a first contact area for a first heatsink that operates at a first temperature; and
a first circuit board, including an optical connector, having heat dissipated by the first heatsink via the first contact area;
an electronic module, further comprising:
a second contact area for a second heatsink that operates at a second temperature different from the first temperature; and
a second circuit board, including an electronic connector, having heat dissipated by the second heatsink via the second contact area;
a housing enclosing the first circuit board and the second circuit board, the housing including a thermal conduction barrier to thermally isolate the first circuit board from the second circuit board; and
an interconnect between the first circuit board and the second circuit board, wherein the interconnect penetrates the thermal conduction barrier,
wherein the optical connector and the electronic connector are pluggable connectors accessible from opposite faces of the housing, and wherein the electronic connector includes digital signal connections.
12. The optical network of claim 11 , wherein the interconnect is a flexible circuit board, and wherein the interconnect includes galvanic connections between the first circuit board and the second circuit board.
13. The optical network of claim 11 , wherein the opto-electronic module further comprises:
a radiation barrier disposed between the first heatsink and the second heatsink, wherein the second temperature is higher than the first temperature, and wherein the second heatsink dissipates more heat than the first heatsink.
14. The optical network of claim 11 , wherein the first contact area has a first length and the second contact area has a second length, and wherein the second length is selected based on a power dissipation for the electronic module.